A-108 aluminum paste is printed as a back electrode on single or polycrystalline silicon solar cells. A-568 Pb-free silver front-side paste is used for back contact on silicon solar cells. A-368 high-conductivity back-surface paste adheres to aluminum. All are metallization pastes for photovoltaic cell manufacturing.
Giga Solar Materials Corp., http://www.gigasolar.com.tw/english.asp
ITM Marketing, www.itmconsulting.org
S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.
S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.
Koki Co. Ltd., www.ko-ki.co.jp
GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.
Seho Systems, www.sehona.com
SolAg solar cell conductive adhesives and inks reportedly deliver efficient, long-lasting solar power. Are said to be superior in damp heat and thermal cycle aging. Deliver low, stable electrical contact resistance for silver grid buss lines, ribbon attachment and metal wrap-through in CIGS, amorphous silicon and similar thin film platforms.
Engineered Conductive Materials, www.conductives.com
Krayden Inc., www.krayden.com
Dual Lane Reflow Oven provides high- and low-volume SMT soldering in one reflow unit. Features flexible production in parallel and is compatible for both Pb-free and leaded SMT. Reportedly reduces floor space 47% compared to traditional dual-lane production lines. Contains two independent conveyor lanes and two heating areas. Has 18 independently programmable heating zones, with both top and bottom side heating areas. Conveyor speeds and widths are independently controlled and adjustable.
SEHO Systems GmbH, www.sehona.com
Wets to a range of surface finishes, and can be used in environments from 30°C at 84% RH. Features open and abandon times of two to three hours, standard refrigeration storage, six-month shelf life and good hot slump resistance.
Henkel, www.henkel.com/electronics
IM-6000 series provides high-precision dimension inspection. Pattern registration and search functions provide place-and-press measurement operation. Reportedly eliminates need for optical comparators, x-y stages for part positioning, CNC measuring devices, and measuring and stereo microscopes. Parts to be measured are placed on the IM’s sample tray, and the measurement button pressed. An iPASS automatically locates, identifies and measures parts placed anywhere within the unit’s 100 mm field of view. A part evaluation library stores the images, measurement functions and specifications of parts, and provides automatic pattern search, part recognition and measurement without setup the next time inspection of the same parts is performed. Performs up to 99 distinct measurements with the press of a button. High-precision image acquisition and sub-pixel processing permit measurement of hard-to-inspect features.
Keyence Corp. of America, www.keyence.com
Siplace SiCluster Professional software determines component overlaps in family setups. Groups shared components on constant component tables, which remain on the machine during setup changeovers. Reportedly reduce setup time by hours, while reducing space and investment requirements for feeders and component carts by up to 33%. Is available as an add-on to Siplace Pro v. 7.1, which offers setups for single products or product families combined with fixed setups, offline setups of feeder tables and changeover tables concepts, nonstop setup changeovers with line execution system, or random setups of individual feeder modules.
Siemens Electronics Assembly Systems, www.siplace.com
The EWS-310 wave soldering machine has continuous PCB width adjustment; accommodates boards up to 12" or 310 mm in width. Reportedly provides the same level of process control and parameter monitoring found in more expensive machines. Total power consumption is at least 10% less than comparable models. Employs a durable "L" finger handling mechanism. Has on-board LCD touch screen with graphic user interface.
APS Novastar, www.apsgold.com
M22X DL-18/460 Desktop AOI inspects SMT and PTH components (presence, type, polarity, offset, text, etc.) and reflow and wave solder joints (including meniscus). Provides 2-D solder paste inspection. Handles medium and large PCBs. Features high-speed digital XGA color camera, as well as analysis via synthetic imaging. Combines speed and accuracy of CL systems with a new lighting concept. Three pulse wave modulated LED light sources (main, side and DOAL) can lighten inspection points from three different angles. Up to six different lighting combinations are available.
Marantz, www.escapethegrayworld.com
Christopher Associates Inc., www.christopherweb.com