XPii comes with one or two placement heads, 8 or 12 nozzles, tape or feeder trolleys, a matrix tray sequencer and an internal matrix tray. Features linear motors, high resolution digital cameras, turret head(s) and intelligent feeders. On-head optical sensors detect presence of components as small as 01005 and as large as 50 x 50 mm on-the-fly. Handles components up to 70 x 70 mm and 100 mm connectors with fixed camera option. Accommodate components on tape, strip tape, stick and matrix tray. Gantry platform has a 40 position "smart: nozzle bank (2 x 40) or (1 x 40 + 1 x 20 + 1 special) optional. Reportedly places at rates up to 13,500 cph (11,340 cph based on IPC-9850), or 15,000 cph (12,800 cph IPC-9850) with Tornado head

Europlacer, www.europlacer.com

CPJ+ reduces process variability to maintain a constant Takt time by ensuring consistent flow rates for applications such as underfill with tight keep-out zones, and sealing applications. With Fluidmove software, integral electro-pneumatic regulators, and precision weigh scale, CPJ+ is said to automatically compensate for both fluid viscosity changes over time as well as batch-to-batch variations. Reportedly increases dispense accuracy for higher yields and ensures a highly repeatable process, minimizing setup-to-setup and line-to-line variation, while eliminating operator interaction.

Asymtek, www.asymtek.com

 

ER2218 epoxy resin is a two-part encapsulation compound designed to meet UL94 flame retardency. Incorporates a novel flame retardant, resulting in an low viscosity flame retardant formulation. Is RoHS-compliant and non-halogenated and free of aromatic amines. Adheres to a variety of substrates, exhibits resistance to water and a variety of chemicals. Is reflow compatible. Comes in resin packs for air-free mixing of small volumes. Bulk product and resin kits will also be available for larger volumes.

Electrolube, www.electrolube.com

VP4000 4-channel vapor phase temperature profiler has a low mass, hermetically sealed RF data-logger with heat-shield, measuring 130 x 60 x 40 mm. Is capable of passing directly through the preheat, vapor reflow and vacuum stages. Profile data are continuously passed to a PC via two-way wireless RF link. Profile can be viewed in real time as boards are being soldered.
 
AutoSeeker automatic reflow process optimization software reportedly eliminates trial-and-error approach. Given a user profile, it uses a rules-based algorithm to search for the best machine settings. User criteria such as process window centered, fastest throughput or lowest running costs can be defined.
 
Solderstar Pro RF wave and reflow profiling is for reflow and wave solder temperature profiling. This scalable system permits reflow profiling on 6, 9, 12 or 16 channels. When used in conjunction with the Waveshuttle wave solder process analyzer, it forms a wave analysis tool capable of detailed wave temperature profile and wave contact measurements. Incorporates an ultra-compact RF data-logger that provides a two-way RF data link with a PC. Permits system setup, process improvements and data downloads to be performed efficiently and temperature profile to be analyzed in real time.
 
SolderStar Ltd., www.solderstar.eu

 

McDry MCU-401 Hepa Filter is for precision measuring instruments, electronics components, or other materials that require a cleanroom and low humidity environment. Meets cleanroom Class 1000 specifications. Using a fan circulation system, dry air passes through the hepa filter and is circulated throughout the cabinet and back down into the drying unit. Is said to maintain relative humidity inside the cabinet below 10%, and can hold up to 50 kg (approximately 110 lb). Comes with digital meter that displays the RH level at all times. Features adjustable stainless shelves and is equipped with a high resistance ground terminal.

Seika Machinery, www.seikausa.com

 

NL930 Pb-free, no-clean solder paste is said to feature good solderability, improve stencil life and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index and wetting characteristics. Post-reflow flux residues are penetrable. Is compatible with SN100C and SAC alloys with Type 3, 4 and 5 solder meshes, and with OSP, ENIG, immersion silver, and immersion tin finishes. Features high-volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as good response to one-hour pause after two knead strokes at 35-65% RH.
 
FCT Assembly, www.fctassembly.com

 

Silver Zebra elastomeric connector is for most electronics packages. Uses a component-to-board or board-to-board design. Offers a current carrying capacity up to 0.700 A per square 0.040"; exhibits a contact resistance of less than 0.50 Ω. Creates redundant electrical contact; incorporates 240 alternating layers of silver-filled conductive elastomer and nonconductive silicone material per inch of connector. Provides a centerline pitch between layers of 0.004" and permits 0.015" pad spacing on the PCB. Is also available with an outer installation barrier.

Fujipoly America, www.fujipoly.com

 

QX500 AOI has improved cycle times. Now includes SIM, enabling on-the-fly inspection. 
 
SE500-X 3-D solder paste inspection now accommodates boards/panels measuring 100 x 100 mm up to 810 x 610 mm. SE500 and SE500-X 3-D can inspect pad sizes down to 01005.
 
CyberOptics Corp., www.cyberoptics.com

 

Extended Reach substrate handling tips are for solar cells, wafers or flat panels. Come in three sizes for reaching up to 200 mm into an area to pick up a substrate. Substrates handled can range from 4" to more than 12". Can be used with any of the firm’s wafer wands. Handle temperatures up to 212°F. 
 
Virtual Industries Inc., www.virtual-ii.com

 

FlyScan integrates boundary scan and flying probe test methods. Comes on the Pilot/Aerial flying probe testers. Features automatic generation of the test program in a single software environment (Seica VIVA); automatic creation of the boundary scan program for nets not of the JTAG type; automatic elimination of test redundancies; automatic fault diagnostics; a single test report, and management of the faults detected by the boundary scan test in Seica Repair Station.

Seica, www.seica.com 
 

 

Fifth Axis Tilt (0 to 30 degrees) together with Four Position Rotate (0, 90, 180 and 270 degrees), are said to provide Film Coater applicators greater flexibility and increased access while conformal coating a printed circuit board. Tilt and rotate accessory is for coating vertical surfaces and underneath components. It enhances access to tight or hard-to-reach areas that may not be achievable with the standard downward approach (0 degrees). While the nozzle is tilted to 30 degrees, the mechanism can be rotated in 90-degree increments to direct the fan pattern to the left, right, front or back to coat all four sides of a component. Uses dual pneumatic motors for smooth, fast and quiet rotate action. Single action rotate speed is variable using flow controls. Is compatible with Select Coat SL-940E platform configured with Film Coater Applicators (SC-104/SC-105 or SC-204/SC-205).

Asymtek, www.asymtek.com

 

Perseas was designed for processing Cadmium Telluride (CdTe) thin film photovoltaic cells. Is modular, featuring configurations with varied throughputs and process capabilities. Is scalable from R&D to pilot and to production-sized units. The CA model is designed for the chlorine annealing process, while CF is for the contact formation process. Is compatible with both glass and web substrates.  
 
BTU International, www.btu.com