The second-generation Wave Surfer is a self-contained measurement system for wave solder machines. Provides data on wave solder machine setup and profiling. Is said to be easy-to-use, with five embedded thermocouples. Works in conjunction with KIC profilers. Is made of a material similar to typical wave solder pallets, and reportedly withstands thousands of passes. A fixture holds the profiler in place during each run to measure pertinent process data, including peak temperature, dwell time, parallelism, and conveyor speed.

KIC Thermal, www.kicthermal.com

 

The 28.400-2 compact dual-pot system is mounted on transport and storage carts that permit easy conversion from Pb-free to SnPb. Otherwise, it is identical to model 28.400, the single-pot version. Is 9.5' long; features dual-wave; three independently controlled zones with forced-air convection heating, and bottom-side IR preheating. Includes internal automatic spray fluxer, titanium finger conveyor with motorized width adjustment for PCBs from 50 to 400 mm and closed-loop conveyor speed control.
 
Manncorp, www.manncorp.com/wave-solder/28.400-2
 

 

The GT2 Series contact digital sensor has a scale-shot system said to provide 0.1 μm resolution and 1.0 μm accuracy. Reportedly loses no data due to rapid spindle movement during production line and other high-speed applications. All measurement is performed in the compact GT amplifier requiring no PLC or external data processing. Are tough and rugged, and cable has IP67 water-resistant enclosure rating. Sensor head cable uses a flexible robot cable that can withstand continuous bending up to 6 million times at a radius of 50 mm, and can be cut anywhere to length. Linear ball bearings are covered by a strong rubber, and encase the spindle to ensure a service life by eliminating wear and abrasion damage. Detecting durability extends up to 20 million times.

Keyence Corp. of America, www.keyence.com/GT2

RF741 No-Clean Gel Flux, for electronics component rework and repair applications, is high viscosity and has a gel-like consistency. Is said to be easily applied by syringe dispensing. Stays in place until soldering. Is compatible with most no-clean chemistries and leaves solder joints bright and shiny after reflow. Is classified as ROL0 per J-STD-004 and Bellcore GR-78 compliant.

Easy Spheres, www.easyspheres.com

DSP 866 no-clean, Pb-free solder paste reportedly has 0% ppm total halogens and comes in a variety of alloys. Has flux classification of ROL0 per J-STD-004. Exhibits excellent printing characteristics and will perform during continuous printing for up to 8 hr. Abandon time of at least 1 hr. said to be is possible. Characterized by brick-like prints. Good release seen on 0.0012 to 0.0009 apertures with print speeds in the range of 1" to 6" per sec. Has nonconductive, noncorrosive and highly insulated residues. Nitrogen not required.

Qualitek International, www.qualitek.com

FLX2011-MK now comes with with a dual dispensers. One, a jet valve dispenser, for 0603 or smaller surface mount components and LEDs on flexible circuits, is said to quickly and accurately dispenses small glue dots, and is contactless. Also has Archimedean screw type for dispensing solder paste or conductive adhesives; or time/pressure dispenser, Piezoflow valve or jet valve, depending on the specific application.

Assembly head features optical centering system that can align SMD components, LEDs and metal domes, permitting flexible circuit production all on one system. Foils are held in position by a vacuum table. Working area is 500 x 300 mm; support area is 800 x 300 mm. Smaller foils can be clustered and be produced like a single foil. Integrated vision system automatically finds reference marks and corrects offset and distortion.

Essemtec, www.essemtec.com

Static pressure soldering technology is for Pb-free soldering large, high-density products. Enables Pb-free (SnAg3.0Cu0.5) soldering for products up to 490 x 510 mm in size and 6 mm in thickness. Ensures a decent soldering fill without damaging the PWB; enables partial soldering for insertion components.
 
OKI, www.oki.com

 

Miniature Linear Guides feature dowel holes on rail and block. Options include advanced (preload) and standard (interchangeable and small clearance) versions; long or wide blocks, standard or wide rail, all in a variety of dimensions, and varying guide rail with dowel hole lengths. Dowel holes on the rail enable easier positioning; balls remain retained even when the block is removed from the rail. Operating temperature range is from -20º to 80ºC.
 
Misumi USA Inc., www.misumiusa.com
 

 

Double barrel syringes are available in 2.5, 5 and 10 mL capacities; offered in 1:1, 4:1 and 10:1 ratios. Consist of a manual plunger, a dual-cylinder syringe and a static mixer, designed to work together. Are polypropylene. Prevent diffusion of two components.  Provide precise mixing and dispensing. Come in black. 
 
ConProTec, www.conprotec.com

 

A new market and technology study on integrated passive devices lists the existing and upcoming technologies and applications for IPDs. Provides an overview of the thin-film IPD market and growth opportunities. Details each market segment with drivers and benefits of IPDs, sub-segment size and expected growth rate, value chain analysis, and global market evaluation per application. Lists links between IPD technologies and their applications.
 
Yole Développement, www.yole.fr

 

Multi-Cure 9001-E Series encapsulants are said to cure in seconds; no mixing required and viscosity is consistent. Have high ionic purity, are solvent-free, and isocyanate-free. Have a low modulus. Contain no sharp, abrasive mineral or glass fillers. Reportedly display excellent adhesion to polyimide, PET, flexible PCBs, FR-4 and ceramic boards, and provide protection for glob top and chip-on-board applications. Are for encapsulating ICs in flex circuits.
 
Dymax Corp., www.dymax.com

The 7722FV pick-and-place machine mounts most fine-pitch components. Placement accuracy for chips, including 0402s, is ±0.1 mm. Bottom vision delivers an accuracy of ±0.05 mm in mounting SOICs, QFPs and BGAs to 40 mm square with a 0.0015" fine-pitch capability. Offers 56-feeder capacity and 6,000 dph.

Manncorp, www.manncorp.com