Products
ER2218 epoxy resin is a two-part encapsulation compound designed to meet UL94 flame retardency. Incorporates a novel flame retardant, resulting in an low viscosity flame retardant formulation. Is RoHS-compliant and non-halogenated and free of aromatic amines. Adheres to a variety of substrates, exhibits resistance to water and a variety of chemicals. Is reflow compatible. Comes in resin packs for air-free mixing of small volumes. Bulk product and resin kits will also be available for larger volumes.
Electrolube, www.electrolube.com
CPJ+ reduces process variability to maintain a constant Takt time by ensuring consistent flow rates for applications such as underfill with tight keep-out zones, and sealing applications. With Fluidmove software, integral electro-pneumatic regulators, and precision weigh scale, CPJ+ is said to automatically compensate for both fluid viscosity changes over time as well as batch-to-batch variations. Reportedly increases dispense accuracy for higher yields and ensures a highly repeatable process, minimizing setup-to-setup and line-to-line variation, while eliminating operator interaction.
Asymtek, www.asymtek.com
XPii comes with one or two placement heads, 8 or 12 nozzles, tape or feeder trolleys, a matrix tray sequencer and an internal matrix tray. Features linear motors, high resolution digital cameras, turret head(s) and intelligent feeders. On-head optical sensors detect presence of components as small as 01005 and as large as 50 x 50 mm on-the-fly. Handles components up to 70 x 70 mm and 100 mm connectors with fixed camera option. Accommodate components on tape, strip tape, stick and matrix tray. Gantry platform has a 40 position "smart: nozzle bank (2 x 40) or (1 x 40 + 1 x 20 + 1 special) optional. Reportedly places at rates up to 13,500 cph (11,340 cph based on IPC-9850), or 15,000 cph (12,800 cph IPC-9850) with Tornado head
Europlacer, www.europlacer.com
Vigon N 501 pH-neutral defluxing cleaning agent ensures compatibility with sensitive SMT production materials such as aluminum, copper, brass, nickel, plastics and label materials. Is a water-based, non-flammable MPC (micro phase cleaner) specifically developed for spray-in-air processes. Has short contact times and bath concentration levels as low as 10 – 15%.
Zestron, www.zestron.com
The Yamaha YS24 pick-and-place machine is a dual-sided machine with a total of 120 feeder positions in a space of 2 m2. Has speed up to 72,000 components per hr. Performs placement of components ranging from 0.4 mm by 0.2 mm (01005) up to 32 sq. mm. Handles board sizes up to 700 mm long by 460 mm wide. Includes NPI features like virtual sticky tape, easy editors and setup assistant.
Assembléon, www.assembleon.com
RemUVa is designed to remove coatings from finished assemblies. Has a fully configurable nozzle to permit working on smaller areas or to remove coating across a larger area. Reportedly does not damage adjacent devices, interconnects or PCBs. Is a bench-top powder abrasion system designed to remove conformal coatings, including UV40. Is equipped with adjustable powder flow control and air pressure regulation. Uses an abrasive media known as carbo-blast. Uses a point ionizer to reduce ESD from reaching levels that could potentially damage components.
HumiSeal, www.humiseal.com
Camalot SmartStream non-contact dispense pumps now come with optional Dual Head Synchronous Mode. Synchronous dispense mode said to improve throughput by 50% while eliminating risk of poor yields/scrapped product experienced by alternative approaches to simultaneous dispensing on multi-up circuits. Is capable of detecting panel rotation and will automatically switch to an asynchronous dispense mode to ensure that both heads dispense accurately on the PCBs within the skewed panel. New software algorithms ensure dual pumps are pitched correctly and have identical flow rates. Is compatible with the Camalot XyflexPro+ and FX-D dispense systems and may be retrofitted in the field.
Speedline Technologies, www.speedlinetech.com
A thick film dielectric and conductor system improves the mounting of silicon ICs to aluminum substrates. Provides low thermal resistance between the chip and heat sink in applications such as HB LEDs. The glass system of the Pb- and Cd-free dielectric paste was developed to offer thermal conductivity on both 3003- and 6061-grade alloy aluminum substrates. Reduces bowing by closely matching the CTE of aluminum. Also, a Pb-free silver conductor paste, fired together at 550°C with the dielectric paste, provides solderability and adhesion. Is for applications such as direct-mounted LEDs.
Heraeus Thick Films Materials Business Unit, www.heraeus.com
XT V 130 x-ray inspection system is compact and comes with a 30-130 kV open micro-focus x-ray source, 4-axis programmable manipulator and 16-bit imaging system based on a 4” image intensifier. Reports compliant with MRP systems. Focal spot size down to 3 microns, 320X geometric magnification and tilt angle up to 60°. Rotate stage and CT capability optional. Hinged door provides access to inspection area, which fits samples up to 40 x 35 cm (16 x 14”).
Nikon Metrology, www.nikonmetrology.com
Electrolube, www.electrolube.com
MCP screen printer has a head design with variable attack angle printing that reportedly permits constant solder pressure independent of stencil thickness. Single-head system reportedly reduces maintenance by half. Board cycle time is as low as 11 sec. Reduces defect per million figures by up to 50%. Has a flat-metal single-head squeegee. Variable angle print head improves repeatability of paste deposition for 01005 components. Produces solder shapes with stencil thickness down to 50 µm, and half-edging stencils with stencil steps of 30 to 50 µm. Is ideal for PCBs mixing 01005 (0.4 mm x 0.2 mm) types with larger component sizes.
Assembléon, www.assembleon.com
Multicore HF108 is a Pb-free, halogen-free solder paste. Has high-speed print capability, a shelf life of up to six months when refrigerated or four weeks at room temperature, and a wide process window.
Henkel, www.henkel.com/electronics
