Siplace SiCluster Professional software determines component overlaps in family setups. Groups shared components on constant component tables, which remain on the machine during setup changeovers. Reportedly reduce setup time by hours, while reducing space and investment requirements for feeders and component carts by up to 33%. Is available as an add-on to Siplace Pro v. 7.1, which offers setups for single products or product families combined with fixed setups, offline setups of feeder tables and changeover tables concepts, nonstop setup changeovers with line execution system, or random setups of individual feeder modules.

Siemens Electronics Assembly Systems, www.siplace.com

 

Multicore LF730 Pb-free solder paste uses DAP Plus Type 4 solder powder and a flux medium said to permit greater process latitude. Reportedly prints thorough apertures as small as 160 µm, permitting more solder per aperture with less risk of aperture clogging. Volume release is said to be over 90%. 

Wets to a range of surface finishes, and can be used in environments from 30°C at 84% RH. Features open and abandon times of two to three hours, standard refrigeration storage, six-month shelf life and good hot slump resistance.

Henkel, www.henkel.com/electronics

Dual Lane Reflow Oven provides high- and low-volume SMT soldering in one reflow unit. Features flexible production in parallel and is compatible for both Pb-free and leaded SMT. Reportedly reduces floor space 47% compared to traditional dual-lane production lines. Contains two independent conveyor lanes and two heating areas. Has 18 independently programmable heating zones, with both top and bottom side heating areas. Conveyor speeds and widths are independently controlled and adjustable.
 
SEHO Systems GmbH, www.sehona.com

 

GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.

Seho Systems, www.sehona.com

S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.
 
S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.
 
Koki Co. Ltd., www.ko-ki.co.jp

 

M22X DL-18/460 Desktop AOI inspects SMT and PTH components (presence, type, polarity, offset, text, etc.) and reflow and wave solder joints (including meniscus). Provides 2-D solder paste inspection. Handles medium and large PCBs. Features high-speed digital XGA color camera, as well as analysis via synthetic imaging. Combines speed and accuracy of CL systems with a new lighting concept. Three pulse wave modulated LED light sources (main, side and DOAL) can lighten inspection points from three different angles. Up to six different lighting combinations are available.
 
Marantz, www.escapethegrayworld.com 

Over Top Snuggers substrate clamping technology clamps the board flat before enabling finite snugging and clamp control for precise board location. Pulls board flat to enable a strong vacuum tooling contact; clamps are then pulled away from the board surface to permit close edge printing. Automatically adjusts for variations in board thickness, eliminating setup requirements between production batches and runs. Automatically adjusts for out-of-parallel boards. Uses Instinctiv V9 user interface software. Is compatible with all tooling variants, including HD Grid-Lok.
 
DEK, www.dek.com

VC-3 heavy duty vacuum tweezer is self-contained and activates from the top via a plunger mechanism. Is ESD-safe unit and is said to eliminate contamination from skin oils and handling damage to leads. It for loading burn-in trays or tinning leads, and can handle larger packages. Includes 1/2" (12.7 mm) diameter heavy-duty vacuum pen and two handling tips, a 1/2" (12.7 mm) and a 5/8" (15.88 mm) diameter rubber vacuum cup. Optionally, can be used with multiple cup pick-up tips or cups on a luer slip probe.

Virtual Industries Inc., virtual-ii.com

Omegameter 600SMD ionic contamination tester now features expanded profile capabilities, storing up to 99 test profiles. Optional software reportedly provides near infinite memory. Offers the ability to test components with a heated or non-heated test solution.

Specialty Coating Systems, www.scsequip.com

 

MSD 1200 Series dessicant cabinet is a modular, 0.5% RH cabinet for moisture sensitive device drying. Designed to exceed J-STS-033B.1. Includes a modular enclosure, with access from two sides that can be expanded to meet growing production, and a new dry unit with closed loop on-demand regeneration. U5001 "Dynamic Series" Zeolite dryer, for dehumidification, reportedly is capable of taking a basic MSD1212 from from 50%RH to less than 5% under unloaded conditions at 25°C in 240 sec. Optimal humidity levels are below 0.5% RH. Designed to regenerate only when necessary. Has a quiet and maintenance-free operation. Average power consumption is 30W per hr.

Totech, www.totech.eu.com

The fully enclosed, lockable SMT storage cabinet is available as an accessory to stockroom units; is only available in a shorter height. Is fully ESD-compliant. Features interchangeable shelves and subdividers. Is available in both single- and double-sided models. Doors are clear.

Bliss Industries, www.blissindustries.com

 

A-108 aluminum paste is printed as a back electrode on single or polycrystalline silicon solar cells. A-568 Pb-free silver front-side paste is used for back contact on silicon solar cells. A-368 high-conductivity back-surface paste adheres to aluminum. All are metallization pastes for photovoltaic cell manufacturing.

Giga Solar Materials Corp., http://www.gigasolar.com.tw/english.asp