PanaCIM Enterprise Edition electronics assembly manufacturing execution system software includes nine modules: production analysis, production planning, production monitoring and dispatch, material verification, traceability, material control, product changeover and control, maintenance, and enterprise link. Includes production monitoring and dispatch’s centralized and real-time data monitoring to identify events such as part exhausts, changeovers and process shifts. Dispatches tasks to the necessary labor resources via email, PDA, or visual display; generates reports for analysis of event history by product, operator and equipment.
 
Panasonic Factory Solutions Co. of America, www.panasonicfa.com

Next Production Modular is a single-platform modular assembly machine with interchangeable, plug-and-play placement heads for nearly any component. Integrates solder paste inspection, adhesive dispense, post-placement inspection and screen-printing capabilities. Both heads of each NPM unit work on both stages. The Dual Screen Printer module performs parallel, simultaneous printing of two unique products. Has area productivity of up to 25,000 cph/m2. Uses features of CM series placement equipment, including intelligent feeders and nozzles with interchangeable head capabilities. Exchange carts reportedly provide virtually zero downtime during changeover.

Panasonic Factory Solutions Co. of America, www.panasonicfa.com/?id=NPM

TS6500CIM Series cartridge mixer automatically mixes two-component material filled in a cartridge kit. Is said to accommodate all standard size cartridge kits ranging from 2.5 to 20 oz. 74 to 591ml) and is usable anywhere with its accompanying tools, accessories and universal power supply.

Comes with automatic fluid level sensing device and user-friendly electronic control system, for quick, simple setup. Automatic injection feature provides even distribution of hardener into resin during the mixing cycle to ensure a uniform mixed result. The high torque motor maintains speed to allow for the continuous mixing of high viscosity materials. Safety features include a two-hand start, emergency stop button and the required closing of the protective enclosure to ensure maximum protection for operators. Conversion kit available for 1/10 gallon (325 ml) cartridge kit size.

Techcon Systems, a division of OK International, http://www.techconsystems.com

XF-300 is a 0.005" coated polyamide, pressure-sensitive label material, designed for barcode or alphanumeric identification of connectors, wires and cables. Is coated with a high opacity, matte white topcoat specifically designed for thermal transfer printing. Can be printed using dot matrix printers and certain felt-tip or ballpoint pens. Is for labeling curved parts and surfaces. Is coated with a permanent pressure-sensitive acrylic adhesive that will adhere to most clean, dry surfaces. Has a temperature rating up to 293°F.

 

XF-596 (0.001") and XF-597 (0.002") high-gloss polyimide label materials for higher barcode print density are coated with a high opacity, gloss white topcoat specifically designed for thermal transfer printing. High-gloss topcoat permits high barcode printing densities when using 600 dpi thermal transfer printers. Label sizes can be reduced compared to standard density barcodes. 2-D barcodes, such as IDMatrix or PDF417, are said to be easily printed on these materials. The temperature resistance (rated up to 932°F) is critical for the dimensional stability of the label required for efficient barcode scanning. Come laminated with a high-temperature, permanent, pressure-sensitive acrylic adhesive.

 

XF-509 is a 0.001" polyimide film coated with a high opacity, black topcoat. Is designed for thermal transfer printing with white resin-based ribbons. Is laminated with a high-temperature permanent pressure-sensitive acrylic adhesive designed for industrial environments. Labels can withstand chemicals and temperature extremes up to 932°F. Is used in situations where reflected light from standard white labels can cause “ghosting.” Also offers aesthetic advantages when the label is used on a dark surface. Retains high dimensional stability at high temperatures.

 

All comply with ROHS, REACH, and halogen-free.

 

Polyonics, www.polyonics.com

Dross-B-Gone powder separates dross from molten solder. Applicable for wave soldering and other processes involving considerable volumes of solder. Is claimed to recover in several minutes almost 90% of the pure solder originally used. Is effective with both Pb-free and SnPb solders. Eliminates dross by quickly oxidizing it into an easily removable powder that is discarded, while pure molten solder remains in the pot and becomes reusable. Is sprinkled on the molten solder at an approx. ratio of 10 g per 1000 g of solder dross. The pure solder recovery rate is 880 g.
 
Manncorp, www.manncorp.com/wave-solder/dross-b-gone/.

 

ZelFlex Protect is a reusable stencil frame system that is an alternative to glued stencil frames. Stencil foil can be stored as a flat sheet if not in use. Can stay on the stencil to permit safe handling and quick changeover. Changing a stencil is said to take 30 sec. or less. Comes in industry standard form factors and reportedly is compatible with virtually any stencil printer. Outer dimension is 23" x 23" and total thickness is 1".
 
LPKF Laser & Electronics, www.lpkfusa.com
 

 

The Modular Compact platform consists of MC-12, MC-1 and MC-8. Packs up to 126 ultra-thin (12-mm) feeders into each machine. A side-view camera prevents placement defects. Has full-featured graphical programming tools and common family setups and production scheduling. Incorporates intelligent and lightweight feeders that reportedly can be changed in seconds. Includes offline preparation, online loading units and Feeder Exchange Systems. Standard equipped with tape cutting. MC-12 has vision recognition that uses a moving side-view scan camera with advanced optics; simultaneously takes X and Y component measurements; helps prevent misplaced or missing components, and rejects components with bent leads, damaged bumps or that have been picked upside down. A chipshooter places up to 36,000 cph with 50µm accuracy at 3 sigma. With up to 120 feeder positions, space productivity is 20,000 cph/m2. MC-1 multifunctional mounter (19,100 cph and 126 feeder positions) and MC-8 fine-pitch mounter (8,900 cph and 119 feeder positions) both have 30 µm accuracy. All have automatic nozzle cleaning procedures. Platform accepts component range from 0.4 x 0.2 mm up to 100 x 45 mm, or 55 x 55 mm with component heights up to 25.5 mm, and programmable placement forces from 10 to 30N for press-fitting complex components. Accepts boards up to 510 x 460 mm. On-board tools enable teaching of placement locations, fiducials and component shapes.
 
Assembléon, www.assembleon.com

 

MRS-1000 Modular Rework System is a benchtop solution comprised of a handheld convection tool with an array of nozzles, preheater, adjustable tool holder with board holder, and light magnifier. Is manually assisted and said to be ideal for removal of delicate SMT components and other processes requiring increased control. Standard features include programmability, a digital display, program storage of up to 50 profiles and adjustability.

OK International, www.okinternational.com

The MT2168 pick-and-place test handler is configurable and comes with up to 16 contact sites. Reported index time is 0.38 sec. and temperature accuracy is +/-1.0°C. Features soak capacity for 3.5 JEDEC trays and throughput of up to 20,000 uph. Handles BGAs, QFNs QFPs and other thin and small devices (3.0 x 3.0 x 0.3 mm) with contact pitches of 0.3 mm or higher.

Multitest Elektronische Systeme GmbH, www.multitest.com

Model 27E magnet wire stripper is designed to strip magnet wire, coils and resistor leads to within 0.031" from the component body. Rotating slotted stripping insert removes the film insulation. Strip lengths with stop rod installed are up to 0.625" or up to 2.87" with stop rod removed. Changes easily for various wire gauges and available in tool steel or carbide. Optional P/N 1939D Flexible Shaft Assembly; converts from benchtop to portable unit, capable of processing leads on heavy coils.  

Carpenter Manufacturing Co. Inc., www.carpentermfg.com  

Enterprise 3000 v. 8.2 is an automated DfM verification tool for PCB design. Is said to cut processing time 25%, while memory management improvements enable analysis of larger designs than previously possible. The new version also incorporates functionality that improves the system’s ease-of-use, simplifies the DfM analysis preparation process and improves upon filtering capabilities. Provides new analysis verification for HDI designs through the integration of net integrity, electrical return path, and via stack count for HDI designs. Via Stack Count verification is used to locate likely microvia fractures and return path validation. Also enables wire bond and die pad netlist validation. A new design preparation rule set module makes preparing a design an order of magnitude faster and easier than using traditional automation techniques. Attributes are now provided with a complete and meaningful name, making it easier for DfM users to setup and be productive. Analysis for thermal impact of embedded pads has been improved to calculate the percentage of perimeter for the covered area to minimize incorrect identification of DFM issues. 

Supra-E AOI uses iPro and comes standard with a 5-MP camera with Tri-Color illumination. Has resolutions between 7 and 17 µm; is capable of inspecting 01005 components to solder joint level. Is capable of board handling of 20 x 18". For low- to high-volume and low- to high-mix environments. Can reportedly be placed at any position in the production line without configuration changes. Programming times said to be 10 to 90 min.

 

Machine Vision Products Inc., www.machinevisionproducts.com