The Paste Roll Height Monitor is a productivity tool designed to eliminate defects. Uses lasers to detect solder paste; monitors height of the paste roll. Uses Instinctiv V9 for setup. Consists of two sensors that sit on either side of the squeegee blade framework support and are fully integrated into most printer software. A light curtain detects solder paste presence or absence, sending a signal to the printer. If paste crosses the light threshold and breaks the light beam, the printer reads that as a signal that paste is present and will continue to process boards as normal. If the light curtain is not disturbed, indicating a low paste height, the printer will alert the operator to add solder paste. As the paste roll starts to recede, the printer issues a warning.

DEK, www.dek.com

 

MRS-1000 Modular Rework System is a convection rework system for removal and placement of BGA/CSP and SMT components. Is comprised of a handheld convection tool with an array of nozzles, preheater, adjustable tool holder with board holder, and light magnifier. Capable of handling PCBs up to 12" x 12" or above using standalone BH-1000 board holder; is equipped to process components up to 40 x 40 mm. Features include programmability, a digital display, program storage of up to 50 profiles and adjustability. Features HCT-1000 programmable handheld convection tool, digital controls, internal or external thermocouple feedback control, profile storage and integrated vacuum pickup. HN series nozzles fit applications reworking components of all sizes, including BGAs, QFPs, LGAs, PLCC and SOIC. Features PCT-1000 programmable preheater.

OK International, www.okinternational.com

QX Hawk barcode imager is integrated with liquid lens technology. Reads any barcode or 2-D symbol, including 2-D direct part marks, within seconds. Is reportedly the first high-performance imager to have the flexibility to read any mark at any distance and speed in any environment, and the first to fully integrate liquid lens technology. Uses decoding technology to read marks at distances from 50 to 500 mm and beyond, from a high-density data matrix to a large linear code to a low-contrast DPM. Features a high-resolution modular optical zoom system. Includes visible LED indicators and an EZ button for instant setup and configuration. Leverages a dual-core ARM/DSP processor and integrated Ethernet protocols.

Microscan, www.microscan.com

 

CN-1728 reworkable underfill encapsulant is designed to underfill package-on-package assemblies. Reportedly has a lower coefficient of thermal expansion, higher Tg, and better compatibility with flux residues. Is a fast-flowing capillary underfill with a viscosity of 900 cps; can be cured in as little as 1 min. at 150°C. Is suited for high-volume, high-speed inline processing. Rework is accomplished by use of temperatures between 170°C and 180°C to remove the underfill fillet. Then, the BGA is lifted from the board after heating it to reflow temperature. Underfill residue is easily scraped off.

Zymet Inc. www.zymet.com

The dual-head MC-385 pick-and-place system has IPC-9805 speed of up to 5,500 cph, plus expandability and compatibility features. Is for high-mix, mid-volume assembly. Uses Cognex flying vision and stationary bottom vision. Chip placement capability includes 0201s and flip chips, while AC motor and linear encoder combined with vision, ensure a placement accuracy of ±0.03 mm (±0.001"). Accommodates 64 smart tape feeders; up to 128 feeders are installable in the batch mode. Features high-precision ball-screw X-Y drive and closed-loop servo control with linear encoding.

Manncorp, www.manncorp.com/pick-and-place/mc385

The Model 780 spool valve reportedly provides a higher rate of fluid flow during dispensing. Is designed to accommodate a broader range of fluids, including those possessing high viscosities. Can be integrated into robotics and automated production processes. Has adjustable material suck-back and flow control. Is supplied with hard-coated aluminum components and Teflon seals, and is also available in stainless steel and Teflon construction.
 
Tridak, www.tridak.com

 

The point-and-shoot Mobile Hawk handheld imager is said to read any 2-D barcode, including direct part marks. Combines MAXlite machine vision illumination with X-Mode DPM algorithms. MAXlite leverages NERLITE experience in machine vision lighting with an integrated multi-axis lighting solution; delivers a plug-and-play mobile imager that is easy to use and reliable for low-contrast DPM applications. USB powered. Features a blue line targeting pattern for quick symbol location and easy barcode output into standard databases.
 
Microscan, www.microscan.com

 

iCure spot curing system is an inline fiber-optic system that provides heat by IR radiation in a portable unit, delivering accurate control for temperature-sensitive substrates and complex devices. Is made for automated manufacturing processes requiring adhesive curing and localized heating of bonded assemblies. Has a 200 W lamp with up to 90 W/cm². Batch processes can be fully automated by attaching the flexible lightguide to a robotic arm. Applications include spot curing thermal epoxies; bonding and fixing plastic and glass components; fixing lenses; temporary fixing of miniature components; precision assembly and bonding of semiconductor components; focused energy for micro soldering, and localized heat welding of thermoplastics. 

IRphotonics, www.icure-irphotonics.com

 

OvenChecker thermal profiler verifies that ovens remain in spec after a board’s initial “characterization” profile. Is designed to be self-contained, and requires no thermocouples or repeated use of golden boards. Reportedly can be taught to an operator in less than two minutes. Comes in a kit that includes a three-sensor pallet, V-M.O.L.E. thermal profiler with M.A.P. software, and a thermal barrier.

Is said to perform over 1,000 runs without degradation.

ECD, www.ecd.com/products/ovenchecker

 

 

RP-113178 Pick-and-Place Underfilm enhances CSP and BGA solder joint reliability. Air or nitrogen reflow compatible. Requires no prebaking of boards. Is reportedly 100% reworkable and RoHS-compatible. Is said to reduce solder joint fatigue failures, and requires no additional cure cycle. Implement into design and manufacturing process by utilizing existing SMT Line and existing tape and reel feeders. Comes in standard EIA-481 carrier tape.
 
Alltemated Inc., www.alltemated.com
 

 

Stacked Die Tool software performs acoustic imaging to identify anomalies and defects in stacked die configurations. Can image all of the interfaces in a stack of eight die. Can sort out the correct echoes and provide acoustic imaging accuracy.
 
Sonoscan, www.sonoscan.com

 

VHX-600 Generation II digital microscope now features 16-bit imaging resolution. The brightness range has been increased from 256 levels to 65,536 levels. 3CCD color clarity has improved from 16 million to more than 2.8 trillion colors. Has high dynamic range function; graphic engine creates images in 16-bit gradation through the acquisition of RGB data from each pixel. The double'r automatic lens/zoom recognition system makes it possible for the VHX to recognize in real time which lens is mounted to the camera, and also the current magnification being viewed. Calibration is automatically adjusted when magnification is changed. Reportedly offers a depth-of-field at least 20x greater than conventional microscopes. Includes a pixel-shift actuator, achieving observation with resolution of up to 54 million pixels. Uses a flicker-free progressive scan method. Has a wide selection of high-resolution RZ optical design zoom lenses, with up to 5000x magnification.
 
Keyence Corp. of America, www.keyence.com