Gold-Tin die attach solder paste can be reflowed in nitrogen environments with up to 200 ppm oxygen. Aurum 2 uses a special treatment to improve the wetting of eutectic 80-20 AuSn solder powder. The flux component of the solder paste remains the same; no requalification testing is needed. Is halide-free and can be applied by stencil printing or dispensing.
 
Heraeus, www.heraeus-contactmaterials.com 

 

InnoLot solder alloy is for high-temperature and vibration environments. Is capable of operating temperatures of 150ºC and 2000 thermal cycles from -55º to +150ºC. The six-part alloy modifies SAC 387 with the addition of bismuth (3%), antimony (1.4%) and nickel (0.15%) Begins to melt at 206ºC, and becomes fully liquid at 217ºC. Is compatible SAC 305 or SAC 387 processes.
 
Heraeus Materials Technologies, www.heraeuscontact-materials.com

SMT box contacts are for direct PCB mounting. Are capable of being oriented for horizontal or vertical (for bottom post entry) mounting. Will accept 0.025" sq. posts or 0.032" round pins, forming a connection durable for 12 or more mating cycles. The phosphor bronze contacts are RoHS-compliant and finished with a matte tin over copper plating with a current rating of 15A.
 
E-Mark Inc., www.e-markinc.com

 

S2088-II desktop AOI comes with automatic paste print, pre- and post-reflow and THT solder joint inspections. Now includes 8-MB camera, with the same angled inspection and OnDemandHR function as inline systems. Has faster loading and unloading and large PCB fixturing. Has IPC-compliant inspection library. Can be transferred to other systems, including S3088-II, S6056 and X7056. Inspects PCBs up to 20" x 18". 

Viscom, www.viscom.com

 

Smart Conveyor controls PCB warpage during selective soldering. Difficult setups are handled automatically. Automatically senses and adjusts to board size, then crowds the PCB for a snug fit; automatically clamps the two parallel edges and resizes the holding area while exerting pressure to eliminate board shape issues.

ACE Production Technologies, www.ace-protech.com

Alpha EF-6103 is an alcohol-based flux developed for standard and thicker high-density PCB applications in Pb-free and eutectic SnPb processes. Is an enhanced version of EF-6100 and EF6100P wave solder fluxes. Is designed to minimize bridging on bottom-side QFPs, as well as to provide superior performance in pin testing, hole-fill and solderballing.

Cookson Electronics, www.alpha.cooksonelectronics.com

 

Visu2 software drives advanced process features and thermal control. Incorporates process and product traceability tools, remote diagnostics and an extensive product library within an intuitively designed interface. Extensive system documentation is available with a few keystrokes; offers password-protected security levels and multilingual operations, data recording and maintenance logging. Process and product traceability are supported via barcode and data recording of all relevant process parameters with time stamps. Uses capability control system to monitor process capability during the production process. CCS automatically translates data; creates control charts where trends of all time lengths are displayed as graphics.

Rehm Thermal Systems, www.rehm-group.com

7K Series Dual-lane AOI handles large board (up to 21" x 11") in each of the two lanes. Comes with P-Series acquisition heads, including i-LITE illumination system; uses VIT software suite. Is a branch of the 5K Series. 3-D Selective AOI technology provides accurate tilt and coplanarity measurement of ICs, connectors and passives.
 
Vi Technology, www.vitechnology.com

 

Automatic Selective Coating Machine features failure alarming system and on- and offline programming. Coating accuracy is said to be 0.02 mm, and rotation is ±180°. Reads CAD drawings and can be manual taught. Has an arc shape design, servomotors, and steel platform. Has three nozzles: pin, film, and atomizing. Pin and film nozzles can tilt 30°. Has a nozzle auto-cleaning device. Has a dual-conveyor design, with auto-adjusting device and two material containers for different coating material.
 
Anda, www.anda-dg.com

E-form Plus laser-cut stencil uses an electroformed nickel said to increase solder paste volume, improve print-to-print consistency and release characteristics, and maximize surface contact between stencil and board.
 
Alloy 9 Plus alloy laser-cut stencil has a 7-step aperture polishing process. Developed to interact with laser equipment to produce smoother aperture walls and cleaner solder bricks, and to reduce print defects.
 
Thin Metal Parts, www.thinmetalparts.com

 

Model 340PS and Model 340PSL positive-displacement dispensing valves are for fluid dispensing. Sequenced piston actuation dispenses a shot-to-shot volume; is accentuated in applications that require precise dispense volume repetition. Are effective with materials that are shear sensitive, extremely high or low in viscosity, possess tacky or stringy characteristics, or have drifting viscosities due to limited pot life. 340PS is best suited for shot volumes from 0.004 mL to 0.180 mL. 340PSL offers shot size capability up to 1.200 mL. Both are available with polyurethane, flexible polyethylene, or Teflon tubing. Feature over-stroke adjustment.
 
Tridak, www.tridak.com

FX Series AOI now comes with a 5 Mp color camera. Has one top down and four side viewing cameras, for inspecting solder joints and part assembly. Uses a standard package library to simplify training and aid program portability across manufacturing lines. Configurable for all line positions: paste, pre- / post-reflow or final assembly inspection. Is offline programmable and has real-time SPC monitoring.

YesTech, www.yestech-inc.com