Kaleido high-resolution color head enhances definition at the repair station; enabling decisions based on the defect picture. Inspects solder joint and lead defects. With i-lite technology, a color-enhancement solution at the defect viewer station is offered; can see 01005 components, as well as associated solder joint. RGB lighting structure enables rendering of color picture.
 
Vi Technology, www.vitechnology.com

 

EP30BN is a two-part boron nitride epoxy adhesive; is a medium-viscosity epoxy with good flow characteristics for bonding, sealing and potting. Is designed to optimize heat dissipation, and cures at room temperature. Mechanical strength properties and chemical resistance are maintained over the temperature range of -60° to 300°F. Has volume resistivity in excess of 1014 ohm cm and thermal conductivity of 24 btu/hr/ft²/°F/in.
 
Master Bond, www.masterbond.com
 
 

 

Multicore TFN700B is a no-clean, halide-free tacky flux formulated specifically for package-on-package applications. Is a Newtonian-based system; reportedly eliminates shearing conditions associated with traditional tacky flux formulations. Enables optical recognition of flux by pick-and-place systems; permits visual verification of volume before placement of the top component of the PoP. Is suitable for doctor blading and dip transfer for PoP builds. Is ROLO-classified, or non-hydroscopic and non-corrosive.
 
Henkel Corp., www.henkel.com/electronics

 

Spectrum thermal process optimization software is said to automatically identify the correct furnace setup for a thermal profile within the sweet spot of the established process window. Uses information from a single profile pass to evaluate millions of possible furnace setups. Each possible furnace recipe will yield a profile, and the Spectrum identifies the fit between the profile and the established process window. Within seconds, reportedly can complete an exhaustive ranking and present its recommendation for the furnace recipe (zone temperatures and conveyor speed). Is a software-only option for the SunKIC profiler.

KIC, www.kicthermal.com

e-Clipse is said to be fast and convenient to attach, and provides repeatable profile readings. Features four spring-loaded thermocouples within a lightweight fixture that also holds the solar wafer. TCs have disk-shaped beads, rather than the traditional spherical shaped beads, for reliable contact to the solar wafer surface. Permits quick replacement of broken wafers. Four standard type K TC connectors plug into the profiler.

KIC, kicthermal.com

 

 

Multicore DA100 die attach solder paste is suitable for high-lead and Pb-free applications. Incorporates a no-clean, ROLO flux system. Complies with RoHS legislation. Delivers low void formation. Exhibits less that 5% void instances on average. Is formulated to hold a higher metal loading for dispensable applications. Reportedly dispenses easily with high pause time and dot-to-dot consistency.
 
Henkel, www.henkel.com/electronics
 

 

The second-generation Wave Surfer is a self-contained measurement system for wave solder machines. Provides data on wave solder machine setup and profiling. Is said to be easy-to-use, with five embedded thermocouples. Works in conjunction with KIC profilers. Is made of a material similar to typical wave solder pallets, and reportedly withstands thousands of passes. A fixture holds the profiler in place during each run to measure pertinent process data, including peak temperature, dwell time, parallelism, and conveyor speed.

KIC Thermal, www.kicthermal.com

 

The 28.400-2 compact dual-pot system is mounted on transport and storage carts that permit easy conversion from Pb-free to SnPb. Otherwise, it is identical to model 28.400, the single-pot version. Is 9.5' long; features dual-wave; three independently controlled zones with forced-air convection heating, and bottom-side IR preheating. Includes internal automatic spray fluxer, titanium finger conveyor with motorized width adjustment for PCBs from 50 to 400 mm and closed-loop conveyor speed control.
 
Manncorp, www.manncorp.com/wave-solder/28.400-2
 

 

The GT2 Series contact digital sensor has a scale-shot system said to provide 0.1 μm resolution and 1.0 μm accuracy. Reportedly loses no data due to rapid spindle movement during production line and other high-speed applications. All measurement is performed in the compact GT amplifier requiring no PLC or external data processing. Are tough and rugged, and cable has IP67 water-resistant enclosure rating. Sensor head cable uses a flexible robot cable that can withstand continuous bending up to 6 million times at a radius of 50 mm, and can be cut anywhere to length. Linear ball bearings are covered by a strong rubber, and encase the spindle to ensure a service life by eliminating wear and abrasion damage. Detecting durability extends up to 20 million times.

Keyence Corp. of America, www.keyence.com/GT2

RF741 No-Clean Gel Flux, for electronics component rework and repair applications, is high viscosity and has a gel-like consistency. Is said to be easily applied by syringe dispensing. Stays in place until soldering. Is compatible with most no-clean chemistries and leaves solder joints bright and shiny after reflow. Is classified as ROL0 per J-STD-004 and Bellcore GR-78 compliant.

Easy Spheres, www.easyspheres.com

DSP 866 no-clean, Pb-free solder paste reportedly has 0% ppm total halogens and comes in a variety of alloys. Has flux classification of ROL0 per J-STD-004. Exhibits excellent printing characteristics and will perform during continuous printing for up to 8 hr. Abandon time of at least 1 hr. said to be is possible. Characterized by brick-like prints. Good release seen on 0.0012 to 0.0009 apertures with print speeds in the range of 1" to 6" per sec. Has nonconductive, noncorrosive and highly insulated residues. Nitrogen not required.

Qualitek International, www.qualitek.com

FLX2011-MK now comes with with a dual dispensers. One, a jet valve dispenser, for 0603 or smaller surface mount components and LEDs on flexible circuits, is said to quickly and accurately dispenses small glue dots, and is contactless. Also has Archimedean screw type for dispensing solder paste or conductive adhesives; or time/pressure dispenser, Piezoflow valve or jet valve, depending on the specific application.

Assembly head features optical centering system that can align SMD components, LEDs and metal domes, permitting flexible circuit production all on one system. Foils are held in position by a vacuum table. Working area is 500 x 300 mm; support area is 800 x 300 mm. Smaller foils can be clustered and be produced like a single foil. Integrated vision system automatically finds reference marks and corrects offset and distortion.

Essemtec, www.essemtec.com