Circuits Assembly Online Magazine - News

Products

Sarcon SPG-15A form-in-place thermal interface compound now comes in 30 and 50cc pneumatic syringes, said to permit faster and more accurate dispensing. The single-component gap filler compound offers near-zero compression force with conformability. Is reportedly ideal for filling gaps around PCB solder points. Requires no heat curing; will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range of -40° to + 150°C.

Fujipoly America Corp., www.fujipoly.com

XSD Series desiccant cabinet is said to reduce device drying times by as much as 75%. Deploy self-regenerating desiccant. Zeolite drying unit is said to achieve humidity levels under 0.5% RH. Cabinets are heavily insulated, reportedly consume a fraction of the energy of baking or vacuum ovens, and are equipped with precision measurement, 24/7 data logging and an ergonomic touch-screen operator interface. Is reportedly proven to dry components at speeds competitive with traditional methods, without oxidation problems associated with traditional baking. Designed to exceed J-STD-033B requirements for handling moisture sensitive devices.

Totech Super Dry, www.superdry.info

HM-2520 is a neutral-cure, low-VOC sealant that enables parts to be moved immediately upon application. Has a tensile strength of 700 psi and service temperatures ranging from -50° to 300°F (-45° to 150°C). Is formulated for automated assembly. Is said to combine the immediate green strength of a hot melt adhesive with the long-term performance of a reactive silicone sealant and improved resistance to movement during cure and at high temperatures under load.
Dow Corning, www.dowcorning.com

EZReball reballing preforms are available in ball sizes down to 0.20 mm. Can accommodate devices down to 0.4 mm pitch sizes. Solder sphere alloys are available in Pb-free, SnPb and high-temperature alloys. Come in packages of 15 and with a QC stencil.

BEST Inc., www.solder.net

SN100C Pb-free solder spheres are said to offer impact strength and have smooth surfaces free of shrinkage effects. High ductility ensures high impact strength. Additional features include stable intermetallic compound and slow growth of interfacial intermetallic. Suitable for BGA, CSP, MCM and high-density fine-pitch applications.

Nihon Superior, www.nihonsuperior.co.jp

The 2800 Series LLHP ultra-low frequency Vibration-Isolation Workstation is for lighter loads. Is designed to meet vibration-isolation requirements of sensitive equipment weighing around 100 lb. (200 lb. max). Uses trifilar pendulum mounts and active-air suspension; has a high level of vertical axis isolation. Tabletop is 30" sq., 2" thick and can be constructed of lightweight aluminum extruded core or a variety of composite cores. Surfaces available with or without mounting holes. Incorporates automatic leveling and low natural frequencies (1.1 Hz along horizontal axis and 1.4 Hz along vertical axis). Reportedly can achieve vertical isolation efficiency of 96% and horizontal isolation efficiency of 97% (at 10 Hz and above).

Kinetic Systems Inc., www.kineticsystems.com

SN100C(510) Pb-free flux cored solder wire is said to generate little spatter, even with the high solder tip temperatures required to burn off polyurethane insulating enamel. Reduces risk of copper erosion during soldering and slow growth of the interfacial intermetallic layer in service. Other features include minimal cracking of flux residue, low fuming and odor, and high-temperature soldering. Can be used with soldering tip temperature up to 480°C.

Nihon Superior, www.nihonsuperior.co.jp

SP50 for 3-D solder paste inspection features full volume, height, area and registration measurements. Speeds reportedly up to 38.7cm²/sec. Handles boards up to 19.5 x 19.5”. Features Agilent head swap technology, which permits alternating equipment from an SP50 to an SJ50. Has optical encoders and linear motors. speeds may vary depending upon application. Has scalable 6 μm per pixel resolution and 4 μm height resolution.

Agilent Technologies, www.agilent.com

The 781RC MicroMark Recirculating Spray System is said to reduce maintenance and downtime associated with conventional marking systems. Uses a recirculating pump to keep pigments in suspension and a short burst of air after each cycle to clear the nozzle of any residue. Applications include components to printed circuit boards.

EFD Inc., www.efd-inc.com

Thermoset MA-511 is a one-component thixotropic epoxy material for use as an adhesive or sealant in microelectronic applications requiring high-speed dispensing. Is said to be a reworkable, low-modulus, non-slumping dispensing adhesive for cap sealing. Cures rapidly, offers adhesion to a variety of plastics; thixotropic rheology permits shape to be maintained after dispensing.

Lord Corp., www.lord.com

NS-F850 rosin-based flux for lead-free wave soldering ensures wetting and hole fill, and facilitates solder drainage to minimize bridges and icicles. Is said to prevent solder balls from adhering to solder mask. Matte finish facilitates inspection after soldering.

Nihon Superior, www.nihonsuperior.co.jp

FLEXconveyor is a box-build factory on wheels, providing a way to kit and assemble products. Permits unclamping and re-clamping of any section of the conveyor line at any time.

Bliss Industries, www.blissindustries.com