Gensonic manually operated ultrasonic generator comes with a single 40 kHz transducer unit, for cleaning solder paste stencils. An additional transducer head can be employed for tougher applications. Cleans paste left in stencil apertures.

GEN3 Systems, gen3systems.com

Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has RS-232C interface with SPI and NG PCB anti-touch verification. Is said to provide increased line efficiency and requires minimal space. No need to filter NG PCBs, and SPI operates normally, even during NG PCB verification. AOI NG Buffer stacks NG PCBs and pushes good PCBs to the next AOI inspection process. Features a PCB shock-free and noncontact power transmission. Both systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch-screen operation.
 
Young Jin/Seika Machinery Inc., www.seikausa.com

 

Falcon 3-axis non-contact video measuring system is said to be suitable for multi-user shop-floor use and advanced manufacturing inspection applications. Employs high-resolution indexed zoom optics (up to 100x magnification), with an indexed camera iris control, increasing accuracy and repeatability of Z-axis results. Incorporates controllable quadrant LED illumination and motorized Z-axis control. Measuring stages provide a measurement capacity of up to 150 x 150 x 115 mm (X, Y, Z) and include factory-completed NLEC calibration as standard.

Vision, Engineering, www.visioneng.us

Parylene Conformal Coating Machine 1092 uses vapor phase to transform coatings from solids. Is horizontal, stainless steel, 8' long x 30" wide. Requires electrical power and a vent connection. Pumping section consists of cold trap and pump; separate controls for temperature and vacuum sensor.
 
Paratronix, www.paratronix.com

 

The FH family of flexible circuit connectors come in different configurations with contact pitches ranging from 0.3 to 1 mm. Are for flexible printed circuit and flat flex cable-type connections. Certain models feature side-retention tabs. Includes: 

FH12 – ZIF connector; 0.5 mm and 1 mm pitch; top or bottom contact points; horizontal and vertical mounting; front flip lock actuator; FPC thickness 0.18 or 0.3 mm; connector height 2, 2.4, 4.85 mm (vertical); contact positions from 6-60;

FH19C/19SC – ZIF connector; 0.5 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm (FH19C), 0.3 mm (FH19SC); connector height 0.9 mm; contact positions from 4-50;

FH23 – LIF connector; 0.3 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1.25 mm; contact positions from 15-71;

FH26 – ZIF connector; 0.3 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1 mm; contact positions from 13-71;

FH27 – ZIF connector; 0.4 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1.2 mm; contact positions from 10-60;

FH28 – ZIF connector; 0.5 mm bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.3 mm; connector height 2.55 mm; contact positions from 20-80;

FH34S – ZIF connector; 0.5 mm pitch; top contact point; horizontal mounting; back flip lock actuator; FPC thickness 0.3 mm; connector height 1 mm; contact positions from 4-34;

FH35 – ZIF connector; 0.3 mm top contact point; horizontal mounting; back flip lock actuator; FPC thickness 0.2 mm; connector height 0.9 mm; contact positions 19, 25, 33, 35, 45 and 51.

Hirose Electric Co. Ltd., www.hiroseusa.com  

 

Alpha CVP-520 solder paste is a Pb-free, no-clean, zero-halogen paste designed for pin-in-through-hole assembly of temperature-sensitive components. Reportedly reflows at peak temperatures of 155° to 190°C. Is said to provide fine feature printing on 0.30 mm circles at speeds up to 100 mm/sec., and in-circuit pin test yield. 

Cookson Electronics, www.alpha.cooksonelectronics.com  

Hirox's MX-BGAZ II Lens is said to perform easy, accurate BGA exterior observation. Allows ball joints to be observed nondestructively. Has 3-D optical rotary ring, including prism tip with lighting and a cushion mechanism to ensure comfortable observation. Helps specify such problems as overheating, oxidation and air foam formation. Inspects upper and lower ball joints Is capable of up to 180X magnification. Features spring-loaded lens tip to protect samples, and configurable and flexible lineup of lenses and peripheral devices.

Hirox/Seika Machinery, Inc., www.seikausa.com

XE-1000 series robotic soldering systems are for attaching tabbing and bus ribbon to crystalline silicon, amorphous silicon, CIGS and CdTe solar cells. Automate soldering process. Programmable control reportedly permits repeatable soldering over a wide range of format sizes. Can be used for either SnPb or Pb-free applications.

Christopher Associates Inc., www.christopherweb.com

Double/Bubble epoxy, urethane and silicone adhesives are available in variety-pak cartons of 25 or 50, in addition to the traditional 100-size carton. Color-coded, dual-pouch adhesive formulations include eight epoxies, three urethanes, and a silicone. Are designed to meet the needs of small to medium-size organizations for in-house or field service applications. Includes an adhesive selector guide. Includes five-minute epoxy, a non-sag gel epoxy for vertical and overhead use. Urethanes include a high-peel strength and high-shear strength. A silicone adhesive/sealant and a “one-wash” scrubbing beadlet hand cleanser are part of the full product offering. 

Sanford Distributing Company Inc., www.TheEpoxysource.com

 

BPWin 5.0 software platform has intellectual property protection, featuring BPWin job protection. Enables viewing and editing only with password, and permits full control of programming parameters. Additional features include COM serialization – external serialization server and a free serialization software development kit; process monitoring and control features automation control and supports SPC, verification, auditing and logging; process monitoring permits customer-defined functionality. Has software version control with BPWinLauncher. Device programming features a NAND management utility and data pattern compression. Has JobMaster integrity check, enhanced buffer utilities and an image format tool.

BPM Microsystems, www.bpmmicro.com

Universal holder and blade assemblies are available to fit the following SMT printing equipment: Yamaha, Tenryu-Sieki, Hitachi, Milara, Speed-Print, Samsung, Misuzu and Minami. Feature lightweight design, sliding paste retainers, and flat, secure screw locking of blade. Options include colors (-red, -blue, -green or -silver) and squeegee angle.

Transition Automation Inc., www.transitionautomation.com

Zebra Gold 8000 Series elastomeric connectors reportedly provide excellent board-to-component electrical contact for broad-ranging commercial and military applications. Deliver current carrying capacity of 250-500 mA amps per wire; exhibit electrical resistance of 25-50 milliohms. Are constructed from a low durometer silicone core covered with parallel rows of flat, gold-plated conductors ranging from 100 to 166 wires per inch. Pad spacing as close as 0.020" centers.

Fujipoly America Corporation, www.fujipoly.com