TF series Teflon lined tips are for low viscosity fluids and Cyanoacrylates (super glue) material. Reportedly resists Cyanoacrylate clogging and prevents substrate. Features a double helix Polypropylene color hub and a rigid Teflon crimped lining that projects approximately 1/8" from the inside of a stainless steel tube. Are compatible with a range of fluids and composed of silicone-free materials. Are rated industrial grade safe up to 100 psi and are conveniently available in both bulk quantity and packs of 50 pieces.

Techcon Systems, www.techconsystems.com

 

The Precisioncoat spray and dispense system now has programmable tilt and rotate, needle calibration and a vision system. The programmable tilt and rotate functionality provides 5 axes to coat alongside and underneath components. Is said to have precise movement along the x, y and z axes; offers programmable tilt up to ± 60° and 360° rotation in 1° increments. Needle calibration is designed to verify the needle is in the correct position. If the needle is offset, the program will adjust accordingly. Uses fiducial or pattern recognition to identify the location of the board to be coated.

Specialty Coating Systems, www.scscoatings.com  

Siplace CA die bonder and SMD placement machine is based on the Siplace X-series platform and processes dies (flip chip and die attach) directly from a wafer, while it can also place conventional SMT components. Reportedly processes up to 36,000 flip-chip components per hour, and can bonds up 36,000 dies per hour at an accuracy of up to 10 µm at 3 sigma. In SMT mode, it reportedly places up to 90,000 cph with an accuracy of 41 µm at 3 sigma. Processes dies from 0.8 to 18.7 mm2 (expanded die bandwidth upon request). Maximum wafer size is 12".

Siemens Electronics Assembly Systems, www.siplace.com

 

The Wrist Strap and Ground Monitor 773 is said to provide effective workstation monitoring in applications with two metal ground requirements. Grounds and monitors two operators and monitors two metal grounds. Measures ground impedance in automated tools while in operation. Has real-time communication and audio alarm, for immediate shut down should impedance values exceed facility standards. Is miniature, easy to install and unobtrusive on the product floor. ANSI/ESD S6.1 and ANSI/ESD S20.20 compliant.

3M Electronic Solutions Division, www.3mstatic.com

The Easy Flow Blue Pistonis part of the 700 Series premier dispensing line, has close tolerances to fit neatly inside the syringe barrel, ensuring consistent fluid deposition. Prevents air entrapment within dispensed fluid, reportedly providing drip-free dispensing and improved repeatability. Is silicone- and chloride-free, and comes in bulk quantity and packs of 50 pieces.

Techcon Systems, www.techconsystems.com

 

Hysol UF3800 is said to provide room temperature fast flow, low temperature cure and reworkability. Is for use with CSPs and BGAs; is suited for handheld communication and entertainment applications. Is halogen-free, with less than 900 ppm chlorine and bromine. Is compatible with a variety of Pb-free and halogen-free solder pastes. Offers a high glass transition temperature. Reportedly offers stable electrical performance under temperature humidity bias.  

Henkel, www.henkel.com/electronics  

Cobar MCI-2330 is a stencil-cleaning agent for removal of solder paste and adhesive residues from all types of stencils. For used in immersion and ultrasonic cleaning equipment for removal of paste or flux residues on stencils and assemblies. Is nonhazardous and has a low odor.

 

Balver Zinn Group, www.balverzinn.com

Cobar Europe, www.cobar.com

Model 455 dispensing valve is a pneumatically operated, two-way pinch valve. Features micrometer control over flow rate. Has an over-stroke adjustment, positive shutoff and disposable inert wetted parts. Can be used as a dispense valve or as an inline valve with adjustable flow. Teflon tubing is recommended, but can use materials such as silicone, urethane, polyethylene, or vinyl tubing. Easily integrates into automated assembly lines and can be fitted with a number of different style dispense tips and spray nozzles. Dispenses low-to-medium viscosity materials, including adhesives, UV resins, flux, gels, solvents and more.  
 
Tridak LLC, www.tridak.com

Araldite EP1000 A/B epoxy adhesive is a two-part, thixotropic paste with a convenient 2:1 mix ratio and low viscosity that accommodates handling. Comes in dual-barrel cartridge mixing kits for waste-free application. Cures at temperatures ranging from ambient to 212ºF. Achieves a stable maximum Tg after gelling at room temperature, followed by a mild heat cure. Requires no autoclave cycling. Reportedly has high lap shear strength and good peel strength.

Huntsman Advanced Materials, www.huntsman.com/advancedmaterials  

 

WS177 lead-free water-soluble solder paste is said to meet standards for solder spread and wetting and meet IPC-7095 Class III resistance to voiding under straight ramp or soak reflow profiles. Is reportedly fully cleanable after two paste reflow cycles, with a wide cleaning process window. Is compatible with SN100C and SN97C alloys with Type 3,4 and 5 solder meshes. Can be used with OSP, ENIG, immersion silver, and immersion tin finishes.

FCT Assembly, www.fctassembly.com

 

 

Duralco 122 nickel-filled adhesive and casting epoxy is formulated to provide an alternative to silver-filled, electrically conductive epoxies for applications up to 500ºF. Is said to be ideal for manufacturing and repairing flexible circuits, solder replacement, bonding semiconductors, EMI shielding, thermistors, wire tacking, heating elements, assembling and electronics. Is two-part epoxy mixed by hand. Cures at room temperature in 16-24 hr. at 75ºF, or can be fast-cured in 10 min. at 200ºF. For optimum conductivity, adhesion and strength, post cure at 250º for 2 hr. Is said to be resistant to moisture, chemicals and solvents.
 
Cotronics Corp., www.cotronics.com

Cobar 396-DRX VOC-free flux is RoHS-compliant and classified as ORL0. Contains no halides and is based on a water carrying system that will provide advantages in transportation and storage conditions and eliminate fire risks. Is odorless, thermally stable, and has a wide process window with top-side preheat temperatures of up to 150°C. Reportedly can be used in high thermal mass and heavy multilayer products which require extended and higher soldering conditions. Leaves no visible residues. 

Cobar, www.cobar.com