Rehm Pyrolysis is a low-maintenance residue management system deployed within the heating zones of VXP convection reflow ovens. Thermally induces decomposition of organic compounds. Complex molecules are broken down into simpler substances with the use of high temperatures (500°C-900°C) taking place in a largely oxygen free (anaerobic) environment to avoid burning. Remaining residues are then captured within a special granulate. Granulate exchange required at 12-month intervals.
Rehm Thermal Systems, www.rehm-group.com

CSM7200 features fully automatic SMD placement and fabricates all current components up to 40 x 40 mm and offers integrated glue or solder paste dispensing. Graphical user surface simplifies controlling and programming. Programmable intelligent feeders have bar code readers to eliminate errors at changeover. “On-the-fly” laser measuring system.

Essemtec, www.essemtec.com

 

 

UltraSlic FG solder paste stencil has paste release below surface area ratios of 0.5. Uses Datum Alloys’ fine grain stencil material. Is said to provide superior aperture registration, higher performance and lower cost compared to electroform. Step stencils optional.
 
Fine Line Stencil, www.finelinestencil.com
 

VPS Condenso Vacuum condensation reflow system is said to minimize void rates by subjecting the molten solder to a vacuum, removing residues and gas inclusions that would otherwise result in voids in the solidified joint. Reportedly can produce solder joints with surface contact ratios of greater than 99%. Releases even heat during condensation and maintains constant temperature. Limits maximum soldering temperatures so PCBs do not sustain damage from overheat.

Rehm Thermal Systems, www.rehm-group.com

Valve Product Guide is comprehensive and easily navigated. Includes manual valves, pneumatic valves and auger valves, as well as accessories and application examples. Manual valves featured include TS1201 pinch tube pen, which requires no cleaning, and Diaphragm Valves, which feature a new compact design. Featured pneumatic valves include the TS1212 Pinch Tube Valve, which features disposable wetted parts and requires no cleaning, and TS5620 Series Diaphragm Valves, which permit horizontal or vertical mounting. The featured auger valves include the TS5000DMP Series Auger Valve, featuring a disposable material path, and the TS7000 Series Auger Valve, capable of achieving 0.25 mm dot sizes.

Techcon Systems, a product group of OK International, www.techconsystems.com

Variofocus x-ray system offers in-performance variable focal spot. Is said to close the gap between microfocus and conventional x-ray tubes in digital radiography and computed tomography. Is reportedly useful for x-ray application in automotive, aviation and aerospace industries. Is said to be less than half the size of conventional x-ray tubes and more symmetrical. Provides performance of high-power x-ray tubes. Displays a value between 250 µm at 290W up to 800 µm at 1600W. Zoom size is adjustable.
 
Yxlon International GmbH, www.yxlon.com
 
 

Manncorp’s board-handling equipment adds inline capability to existing PCB assembly equipment. Includes board loaders and unloaders, stackers, sorters, equipment-connecting conveyors and rotators, plus buffers for inspection and handwork. Each of the 23 SMEMA-compatible transporters will interface with Manncorp and most other makes of surface mount, through-hole and mixed technology equipment.
 
Manncorp, www.manncorp.com/conveyors-and-board-handling
 

TS7000 Interchangeable Material Path Series Rotary valve is based on the technology of TS5000 Series Rotary Microvalve. Is designed with no dead fluid volume, field replaceable feed screw/cartridge assembly; is interchangeable with TS5000DMP feed screw auger inserts, has a flexible motor, syringe, and a needle mounting option. Is available in three feed screw auger sizes (16-pitch, 8-pitch and high output 8-pitch), all made of hardened steel. Encoder motor version is available for applications that require closed-loop motor control with encoder feedback. Reportedly provides repeatable dispensing of medium- to high-viscosity fluids and pastes. Applications include small-dot dispensing of dispensable-grade solder pastes, silver epoxies, surface mount adhesives, dispensing beads of structural adhesives, cavity and cam filling, and glob top dispensing.

Techcon Systems, www.techconsystems.com

mySelective 6748 selective soldering machine now has PCB warpage compensation. Is said to ensure points to be soldered are always the same height above the wave, even if board has slight warpage. A noncontact laser sensor measures the distance between an assembly in process and the wave prior to soldering. Measures the distance of several target positions on the bottom side of the assembly, while the board is held in the gripper (robot product handling device). Chooses a reference point (near the corner of the board) and a measurement point (near the middle of the board), and others if needed, so the sensor can take measurements and teach itself the board shape and degree of distortion. It then makes appropriate calculations (Z offset).
 
Vitronics Soltec, www.vitronics-soltec.com
 

The ASD-700 PCB DeStacker has an enhanced top-loading exterior. Is said to provide a small footprint for loading PCBs at the front of the line. Is capable of holding up to 80 PCBs ranging in size from 2 x 3" to 18 x 20". A floating center support mechanism rises upward and is used to prevent larger PCBs from flexing during the lowering process onto the edge belts. Load and pass mode functions are standard. Touch panel optional.
 
Promation, www.Pro-mation-Inc.com