Expert-SAFP pick-and-place system directly imports layout data and bills of material. Head is air-suspended, moves gently and is ergonomic. Works in automatic or semiautomatic modes. Windows control software is said to increase productivity, sometimes doubling it; ensures correct component is aligned at the desired location without errors. Is reportedly suited for prototyping because it permits picking from rest tape strips and loose components. A turning station for upside down components is standard. Is available as a complete prototyping station, including dispenser and reflow tool. Users have access to remote maintenance system.
The free, online Highly Accelerated Thermal Shock test coupon generator has been upgraded, permitting English and Metric input; makes selecting the interconnect sequence of the test patterns a single step. Other additions include help rollovers and the ability to have a Web download link to the HATS Gerber file e-mailed. Is a methodology of accelerating thermal shock reliability testing of PCBs so that 1000 thermal shock cycles takes a few days. Tests 36 four-net coupons with continuous resistance monitoring. Provides 144 nets of resistance data per test run.
Desktop Companion II is a prototype solder paste printing tool created as a solution to printing inconsistently routed boards. With a desktop stencil mounted to adjustable plate, two tension screws can be loosened, permitting stencil movement in the x and y axis.
Eco-Reflow SNR series of reflow ovens operate in nitrogen or ambient conditions. Come with six to eight heating zones, individual heater temperature settings, and top and bottom cooling. Include IR panel heaters and novel air blowers to improve thermal efficiency. Dimensions range from 9' to 19' long, and about 5' wide. Handle boards from 2" x 4" to 20" x 20". Optional PCB warp prevention, automatic conveyor width adjustment, chiller and thermal profiler.
SSF-400 has a novel two-part mixing nozzle said to reduce clogging and ease maintenance. Includes automatic cleaning system for the conveyor chain, upper and lower exhaust fans, and color LCD touch panel. Handles boards up from 2" x 4" to 16" x 16". Coating width range is 2" x 16".
ProcessWatch production control suite traces boards and records events throughout the assembly process and tracks associated consumables, stencils and tooling. Benefits include stencil/board/tooling compatibilities, materials aging, and events alerts. Follows individual board batches and records all events during production; tracks stencils and provides alerts about use, cleaning requirements and design revisions and obsolescence; follows consumables (solder pastes, adhesives); checks board/consumable/stencil compatibility; prints reports covering a specific production batch; traces individual boards and reviews conditions under which each has been produced.
The Advanced Starter turnkey line is for prototyping and other low-volume assembly. Consists of a stencil printer, a full-function automatic pick-and-place system and a Pb-free conveyor reflow oven. Only options are feeders. ECM-6711S placer has on-the-fly top vision plus bottom vision, 24-lane feeder base, 13.75" x 9.8" placement area, computer and LCD monitor; is suitable for fine-pitch devices and BGAs. Stencil printer is 4500 with X, Y and theta adjustments for fine-pitch SMT printing of single or double-sided boards. Also features TN350 Pb-free forced hot air convection reflow oven with five upper and lower heat zones, each with independent PID controllers settable to 320ºC at accuracy of ±1ºC.
This pick-and-place system is capable of placing 3-D-MID technology. Is based on inline pick-and-place FLX2011-LCV system. Is completed by a palette transport system, a five-axis robot and a dispensing head with two valves. A free-motion robot arm is located in the chassis and grips the 3D-MID module from the transport system. Dispensing head is equipped with two individual touch-less dispensers: one for precise dispensing of solder paste, the other for accurate metering of fast-curing adhesive. Solder paste is applied to the electrical contact surfaces. Glue is dispensed on other locations to hold the SMD part until the reflow process and absorb mechanical stress. SMD components are placed with a vacuum tool and are picked from feeders, measured and aligned by an optical centering system, then placed to contact surfaces. Standard components are aligned on-the-fly with a laser system. For BGA, QFN and QFP, Cognex Vision is used.
DispenseJet DJ-100 piezoelectric jets are said to be suitable for a range of fluid types and viscosities. Three models are available, each designed to dispense different types of fluid: DJ-100 Standard, DJ-100 NC for low viscosity materials, and DJ-100 GH, designed for highly viscous fluids. Novel “Jet on the Fly” technology reportedly shoots precise volumes in dots, lines and patterns. Reportedly eliminates Z-axis movement. Can achieve flow rates up to 200 mg/sec. and shot rates up to 150 dots per sec. Come with a serialized hardware set that includes a matched ball and seat. Calibrated Process Jetting uses weigh scale feedback to maintain consistent dispense volume. Achieve dot diameters as small as 200 µm.
Niton XL3t is said to deliver improvements in light element detection, overall sensitivity and measurement times as much as 10 times faster than conventional Si-PIN detectors, and up to three times more precise than conventional silicon drift detectors. Permits light element detection of magnesium, aluminum, silicon, phosphorus and sulfur without helium or vacuum purging. Incorporates 80 MHz real-time DSP and dual embedded processors for computation, data storage, live video processing, and communication. Software permits users to customize the instrument; set user permissions; generate custom reports; print personalized certificates of analysis; remotely monitor and operate the instrument hands-free from a PC or PDA. Can locate areas of interest on a sample using the integrated color CCD camera and optional integrated 3-mm small-spot collimation.
Pressurex Zero tactile pressure-indicating sensor film characterizes tactile contact surface pressure down to 7.2 psi (0.5 kg/cm2). Is flexible and placed between contacting or mating surfaces to measure and map pressure magnitude and distribution. Variations in contact surface pressure are said to be immediately visible by the impression made on the film; spatial resolution is fine enough to expose minute surface defects and other imperfections. Ranges from 7.2 to 28 psi. Comes as a thin, clear plastic sheet; is available in eight different pressure ranges with highest measuring impact up to 43,200 psi. Changes color directly proportional to the actual pressure applied. Can be scanned through an optical imaging system. Is used in design, manufacture, calibration and quality control. Is said to be ideal for invasive, intolerant environments and tight spaces not accessible to conventional electronic transducers.
The SC-5000 tabletop ultrasonic stencil and misprint cleaner comes with cleaning head, generator, foot pedal, large tray and 30 foam pads.
The SAWA 5000GUS removes solder balls from stencil apertures after wipe cleaning. A handheld ultrasonic cleaning head is manually applied over apertures with any solvent. The stencil is laid on a foam pad soaked with solvent contained within a large tray. The foam is used to capture solder balls dislodged by the cleaning head.