The Modular Compact platform consists of MC-12, MC-1 and MC-8. Packs up to 126 ultra-thin (12-mm) feeders into each machine. A side-view camera prevents placement defects. Has full-featured graphical programming tools and common family setups and production scheduling. Incorporates intelligent and lightweight feeders that reportedly can be changed in seconds. Includes offline preparation, online loading units and Feeder Exchange Systems. Standard equipped with tape cutting. MC-12 has vision recognition that uses a moving side-view scan camera with advanced optics; simultaneously takes X and Y component measurements; helps prevent misplaced or missing components, and rejects components with bent leads, damaged bumps or that have been picked upside down. A chipshooter places up to 36,000 cph with 50µm accuracy at 3 sigma. With up to 120 feeder positions, space productivity is 20,000 cph/m2. MC-1 multifunctional mounter (19,100 cph and 126 feeder positions) and MC-8 fine-pitch mounter (8,900 cph and 119 feeder positions) both have 30 µm accuracy. All have automatic nozzle cleaning procedures. Platform accepts component range from 0.4 x 0.2 mm up to 100 x 45 mm, or 55 x 55 mm with component heights up to 25.5 mm, and programmable placement forces from 10 to 30N for press-fitting complex components. Accepts boards up to 510 x 460 mm. On-board tools enable teaching of placement locations, fiducials and component shapes.
 
Assembléon, www.assembleon.com

 

MRS-1000 Modular Rework System is a benchtop solution comprised of a handheld convection tool with an array of nozzles, preheater, adjustable tool holder with board holder, and light magnifier. Is manually assisted and said to be ideal for removal of delicate SMT components and other processes requiring increased control. Standard features include programmability, a digital display, program storage of up to 50 profiles and adjustability.

OK International, www.okinternational.com

The MT2168 pick-and-place test handler is configurable and comes with up to 16 contact sites. Reported index time is 0.38 sec. and temperature accuracy is +/-1.0°C. Features soak capacity for 3.5 JEDEC trays and throughput of up to 20,000 uph. Handles BGAs, QFNs QFPs and other thin and small devices (3.0 x 3.0 x 0.3 mm) with contact pitches of 0.3 mm or higher.

Multitest Elektronische Systeme GmbH, www.multitest.com

Model 27E magnet wire stripper is designed to strip magnet wire, coils and resistor leads to within 0.031" from the component body. Rotating slotted stripping insert removes the film insulation. Strip lengths with stop rod installed are up to 0.625" or up to 2.87" with stop rod removed. Changes easily for various wire gauges and available in tool steel or carbide. Optional P/N 1939D Flexible Shaft Assembly; converts from benchtop to portable unit, capable of processing leads on heavy coils.  

Carpenter Manufacturing Co. Inc., www.carpentermfg.com  

Enterprise 3000 v. 8.2 is an automated DfM verification tool for PCB design. Is said to cut processing time 25%, while memory management improvements enable analysis of larger designs than previously possible. The new version also incorporates functionality that improves the system’s ease-of-use, simplifies the DfM analysis preparation process and improves upon filtering capabilities. Provides new analysis verification for HDI designs through the integration of net integrity, electrical return path, and via stack count for HDI designs. Via Stack Count verification is used to locate likely microvia fractures and return path validation. Also enables wire bond and die pad netlist validation. A new design preparation rule set module makes preparing a design an order of magnitude faster and easier than using traditional automation techniques. Attributes are now provided with a complete and meaningful name, making it easier for DfM users to setup and be productive. Analysis for thermal impact of embedded pads has been improved to calculate the percentage of perimeter for the covered area to minimize incorrect identification of DFM issues. 

Supra-E AOI uses iPro and comes standard with a 5-MP camera with Tri-Color illumination. Has resolutions between 7 and 17 µm; is capable of inspecting 01005 components to solder joint level. Is capable of board handling of 20 x 18". For low- to high-volume and low- to high-mix environments. Can reportedly be placed at any position in the production line without configuration changes. Programming times said to be 10 to 90 min.

 

Machine Vision Products Inc., www.machinevisionproducts.com

SMP200 Screen Printer includes precision stencil-to-board vision alignment for paste deposition and automatic PCB conveyor width adjustment to reduce setup and changeover time. A PCB alignment and clamping system coupled with advanced stencil separation control compliment the auto-leveling squeegee head system. Is said to have three-sigma accuracy. Has integrated under-stencil stencil wiping system with wet/dry/vacuum capability and second post-print inspection system.

 

Samsung Techwin, www.samsungtechwin.com

Dynatech Technology, www.dynatechsmt.com

 

LE40V automated pick-and-place machine is for prototyping and short run, high-mix manufacturing. Uses Cognex Vision. Provides on-the-fly component centering with top and bottom cameras, fiducial correction, bad board mark and pattern recognition. Reportedly provides accurate placement of 0201s, µBGAs, CSPs and 0.015 fine pitch QFPs at up to 3000 cph with ±0.001" placement accuracy. Includes self-contained vacuum.

 

APS Novastar, www.apsgold.com

SS4/ST4 series narrow body, super fine pitch low-profile board-level interconnects have a 4 mm wide socket strip and 5 mm wide terminal strip, with 0.4 mm pitch. Standard mated stack height is a low profile 4 mm from board-to-board with a choice of applications specific heights from 4.5 mm to 6 mm. Available with up to 40 positions per row in a double row design and rated at 7 GHz in single-ended and 4.5 GHz in differential pair configurations when mated.

 

Samtec, www.samtec.com

FMPS/FMPT is a hinged, 25A version of the PowerStrip/25 family. Is for blind mating or tight PCB real estate applications. Permits 90° or horizontal (planar) board-to-board interfaces and a 90° mating radius. Can be mated at an angle convenient for production and rotated to the permanent required orientation. Comes with up to 8 power pins on 0.200" and achieves a current rating up to 25A per contact at 75°C. Locking clips and screw down configuration for the socket are optional.

 

Samtec, www.samtec.com 

Ultra IV AOI system large format inline AOI inspects boards up to 20 x 24". Comes standard with a 5-MP camera with Tri-Color illumination. Has resolutions between 7-17 µm; is capable of inspecting 01005 components to solder joint level. Can be configured for multiple positions in the production line, including 2-D/3-D paste inspection, pre- and post-reflow, or wave solder. Is capable of metrology-based reporting. iPro software permits programming times within 10 to 90 min.

 

Machine Vision Products, www.machinevisionproducts.com

 

The Zero Point Clamping System is a quickchange fixture that combines ease of alignment, accurate positioning, and high clamping forces with hydraulic or pneumatic actuation. Is said to reduce machine setup procedures into one step. Unlocking and removing the clamping device is simpler; the system eliminates the need to search for the bore. Is compact but reportedly provides holding and pull-in forces. Balls are 784% larger than those used in competitive locking systems. Balls roll freely in the form-fitting ball channel. Stainless steel components.  

Jergens Inc., www.jergensinc.com