The low-resistance W-Series Matrix Connector is for interconnecting LGAs with 200 or more board I/Os. Reportedly eliminates need to solder or rework components. Is embedded with 300 to 2,000 gold-plated wires per cm² and provides a carrying capacity of 500 mA/mm². Is available in sizes up to 50 x 50 mm and thicknesses of 0.50 or 1.0 mm.
 
Fujipoly America Corp., www.fujipoly.com
 

The SL-V Safety Light Curtain incorporates highly visible indicators to facilitate setup and see current operating status. Conforms to IP-65 and IP-67 rating standards. Has edge-to-edge mounting and side-exit cabling; curtain reportedly fits perfectly into equipment, with the cabling tucked away. Can immediately determine whether curtain is active. Emits green lights when beam axes are properly aligned; red lights indicate location of a curtain blockage. Standard, Thin, L-Shaped, E-to-E, Tough Standard and Space Saving brackets available. Up to 3 curtains (or 240 beams) can be connected in series. Curtain lengths range from 150 to 2390 mm. Includes automatic interference reduction function. Optional waterproof front protection cover protects sensor. Clear lens cover is recessed. Has built-in external device monitoring function and built-in muting and interlock functions.
 
Keyence Corp. of America, www.keyence.com
 

 

C250 Pb-free wave solder machine is 50" x 30" and handles boards up to 10" wide in its adjustable corrosion-resistant finger conveyor. Is equipped with automatic defluxing, IR preheating, air-knife cooling and a low-volume solder pot. Is available in single or dual wave configurations for through-hole and surface mount assemblies. Includes built-in solder pot loading, a maintenance platform with locking support mechanism and dial-adjustable wave height control.
 
Manncorp, https://www.manncorp.com/wave-solder/c250/
 

S6053BO-V fully automatic wire bond inspection system is for small wire bond analysis. The camera technology and the transport reportedly can be adapted to varying production demands. Is equipped with a universal, high-resolution VHR camera module. Can inspect down to 2 to 5 µm per pixel. Camera module can be arrayed with one or several cameras and illumination units. Bond wires smaller than 20 µm in diameter can be inspected 100%. Is available in a dual track configuration, including an integrated shuttle that loads the second track as an inspection is conducted on the first track. Is configured for fine bond wire analyses. Also said to inspect components and ASICs with high accuracy.
 
Viscom, www.viscom.com
 

Easy Lift is an ergonomic workbench with 20" of adjustable work surface. Serves as a workbench, assembly station and adjustable desk. This ESD-safe work surface is approved for static-sensitive electronics assembly and non-ESD applications. The table moves vertically and has a 250 lb. load capacity. Comes standard with a 24 x 30" static dissipative powder-coated steel tabletop with ESD-safe Blue Softsurface matting material. Has foot pedal and adjusts from 19" to 39".

 

The 2D Inspection (2Di) V9 software tool monitors the print process. Is said to inspect boards or stencils to determine if print quality is deteriorating. Permits operators to identify when a stencil clean or paste dispense is required, and prevent bridging, misalignment, stencil smear, stencil blockage and reduced paste volume. Includes simple setup, on-board guidance, enhanced operator prompts and automated post-print inspection feedback highlighting sites requiring attention. Has full-page zoom function.
 
DEK, www.dek.com
 

VP5000 inline 3-D SPI system has a large field of view said to reduce the number of images required to inspect the board. Has tabbed menus in touch screen interface. Includes warning thresholds to the pass/fail outputs. Comes with an interface to Qup-Navi software that enables the height calculation and volumetric inspection data to be incorporated into a root cause of failure analysis. Uses color stripe phase shift method. Combines RGB (red-green-blue) light sources and a 3-CCD camera with texture mapping or gradation displays. Inspects for average height, volume, excessive deposition, insufficient solder, smearing, misalignment and bridging. Has an interface to import Gerber and CAD data. Locations of defective pads are displayed on the substrate map with up to eight raw images of defective pads. Multi-data station 5000DS uses one PC and can handle up to six machines for off-line programming and analysis of production data, line status, and machine waiting time for parts. Accepts substrates from 2" x 2" up to 18" x 20" and provides 12 µm resolution with a 23 x 31 mm field of view. A 2-D code reading option enables the camera to read Data Matrix (ECC200) and QR (Model 2) codes.

Omron Electronics, www.omron247.com