VP5000 inline 3-D SPI system has a large field of view said to reduce the number of images required to inspect the board. Has tabbed menus in touch screen interface. Includes warning thresholds to the pass/fail outputs. Comes with an interface to Qup-Navi software that enables the height calculation and volumetric inspection data to be incorporated into a root cause of failure analysis. Uses color stripe phase shift method. Combines RGB (red-green-blue) light sources and a 3-CCD camera with texture mapping or gradation displays. Inspects for average height, volume, excessive deposition, insufficient solder, smearing, misalignment and bridging. Has an interface to import Gerber and CAD data. Locations of defective pads are displayed on the substrate map with up to eight raw images of defective pads. Multi-data station 5000DS uses one PC and can handle up to six machines for off-line programming and analysis of production data, line status, and machine waiting time for parts. Accepts substrates from 2" x 2" up to 18" x 20" and provides 12 µm resolution with a 23 x 31 mm field of view. A 2-D code reading option enables the camera to read Data Matrix (ECC200) and QR (Model 2) codes.

Omron Electronics, www.omron247.com  
 

 

The free Intermediate Data Format Plug-In is the first plug-in module for PCB123 based on the v. 3.1 Software Developer’s Kit. Enables import of PCB designs for use in mechanical and electrical CAD systems in a bidirectional, neutral format within the ECOsystem Design Environment. Imports outline definitions of the PCB as specified by the mechanical CAD tool, synchronizing the mechanical design work with the PCB development work.
 
Sunstone Circuits, http://www.sunstone.com/products-services/cad-software.aspx
 
 

FLX2010C is for placement of special components on film or flex boards. Features a conveyor system said to permit flexible and fast placement on the substrate. Can be placed upstream in the line before a die bonder. In a downstream pick-and-place process, components reportedly are accurately placed on these dice, where the sandwich carrier will be inserted from the left side and stopped by a "stopin" mechanism. The carrier is located with a chuck. Nozzles suck in from the underside of the sandwich carrier at defined positions. The substrate can be populated from conventional component feeder systems after the alignment of the fiducials. The film leaves the placement machine via the conveyor after the release of the sandwich carrier from the vacuum.
 
Essemtec AG, www.essemtec.com
 

 

The SP003-ML-V stencil printer is for small and medium volumes. Has an integrated vision system. Offers control over squeegee and speed attributes and reportedly can reproduce them securely. Consists of two quick-fix cameras that look directly through the stencil apertures down to the PCB. Images are simultaneously displayed on two 8" monitors to check alignment. Correction of X, Y and theta axes is possible using backlash-free adjusting screws. Comes standard with a universal PCB fixture mechanism. Adjustable magnetic table can accept single- and double-sided substrates. Print area measures up to 360 x 400 mm; screens and stencils can be mounted in frames with up to 23" x 23" in size.
 
Essemtec AG, www.essemtec.com
 

The Agilent U8101A display tester is for custom setups for visual testing of up to five major display formats. Is suitable for testing FPD and CRT displays, and LCD panels in PC and TV manufacturing. Is said to support all major analog and digital interfaces and permits future upgrades. Has multiple plug-in card slots to customize instrument configuration. Uses a 5.7" color LCD display and Windows-based graphical user interface. Can select different display formats, test configurations and other frequently used functions on front panel. Has capability to recall up to 16 test sequences and patterns. USB capable.
 
Agilent Technologies Inc., www.agilent.com
 
 

The 2151-482 Series Servo-Mix Dynamic Mix and Dispense Valves are designed mixing and dispensing two-component materials in robotic and semiautomatic assembly processes. Applications include mixing epoxies, silicones and urethanes for bonding, gasketing, coating, potting and filling. Features include a standard disposable static mixer attached to the drive shaft of a variable speed servo motor and No-Drip KISS Series fluid control valves to start and stop the flow of materials. Include carbide ball needles and seats.
 
Sealant Equipment & Engineering Inc., www.sealantequipment.com
 
 

 

Vigon A 250 water-based defluxing agent is for spray-in-air processes with low- to medium-pressure cleaning with long exposure times. Is an MPC technology-based cleaning agent recommended for removing leaded and Pb-free flux residues from electronic assemblies in batch, centrifugal and ultrasonic cleaning applications. Has high bath loading capacity. The surfactant-free formulation is said to eliminate formation of white residues on cleaned parts and cleaning equipment. Is an aqueous cleaning agent and is halogen-free. Meets RoHS and WEEE guidelines. Passed standards such as IPC-A-610A, J-STD-001D, IPC-TM-650 and J-STD-003.
 
Zestron America, www.zestron.com
 

AdPro Plus adhesion promotion technology is said to increase adhesion between Parylene conformal coatings and various substrates. Reportedly improves adhesion of Parylene to materials such as titanium, stainless steel, gold, chromium, Santoprene, polyimide, polycarbonate and solder mask. Has demonstrated improved stability at elevated temperatures.
 
Specialty Coating Systems, www.scscoatings.com