The Conap Conapoxy series passes UL 94 5VA and UL 94 V-O requirements to provide insulation and protection. Conapoxy FR-1047/EA-87, FR-1047/DPEA-25652, and DPFR-29589/DPEA-25652 exhibit flame retardant characteristics; are said to be well suited for use in potting pumps, coils, stators, transformers, capacitors, and other electrical and electronic devices. Reportedly have excellent resistance to thermal shock, low exothermic temperatures, and outstanding arc resistance. Are non-abrasive and provide low room temperature processing viscosity. FR-1047/EA-87 has a four-hr. gel time and a mixed viscosity of 6,800 cps at 25°C. FR-1047/DPEA-25652 has a 90-min. gel time and a mixed viscosity of 4,000 cps at 25°C. FR-1047/DPFR-29589 has a 70-min. gel time and a mixed viscosity of 6,800 cps at 25°C. All three are filled with a non-abrasive filler.
The ESD-safe, battery-operated PAC-VAC Vacuum-Tweezer P/N V3200 provides portability for handling. Tips included are said to permit handling of SMD parts from 2.54 mm (0.10") to several inches in diameter. The mini high-performance diaphragm vacuum pump generates up to 16" of mercury with an open-air flow of 750 ml. Included in the kit are the vacuum generator, 9-volt alkaline battery, push-button vacuum pen with 4 ft. of coiled vacuum hose, and a set of nine vacuum tips.
The Marantz iSpector is an automatic optical inspector, reportedly the first system designed to be field upgradeable from bench top to inline capability.
The Koh Young KY 3020T bench top solder paste inspection system is said to offer 100% inspection of all solder deposits at production speeds.
Other new products include the Japan Unix Model 414R robotic soldering system and the Koki Tec Taku Robo bench top selective soldering system.
New precision washers and collars for machine and equipment assembly are available, many in configurable dimensions of thickness, ID and OD down to 0.1 mm increments. Materials include 1018 carbon steel, 1045 carbon steel, 2017 aluminum alloy, brass, 304/316/420 stainless steel and 01 low alloy tool steel. Surface treatments are offered for application-specific uses and include black oxide, electroless nickel plating, low temperature black chrome plating and clear anodized. Shapes offered include tapped, flanged, counterbored, countersunk, slotted and screw tapped. A full line of metal collars, pipe collars and spacers are available, as well as a line of resin washers and collars. Resin materials available include polyacetal, MC nylon, Bakelite, ceramics of various types, high heat-resistant laminates, epoxy glass, fluroresin and PPS.
A special twin vacuum table, for the FLX2011-MKL placement machine, eases flex board and film substrate handling and reportedly doubles productivity. Has twice the size of the former table and its ends protrude alternately from both sides of the placement machine. Features a pneumatic servo drive said to move easily and without vibration. Has a working area of 31.5 x 23.6".
A single user version of the EMA Component Information Portal that gives engineers access to the Digi-Key part database through Cadence OrCAD Capture CIS is available in two versions: CIP and CIP Enterprise. Both include a Digi-Key interface, a starter CIS database, a Web-based solution, and weekly CIP Webinars.
SunKIC thermal profiler is designed for photovoltaics production. Is a 19 mm (0.75") tall thermal shield. Includes easy-to-use software and displays relevant process data such as peak temperature, dwell time in various temperature ranges, and slope gradients. Measures the area under the curve at any temperature level. Comes standard with a prediction feature. Process Window Index instantly confirms whether the profile is acceptable.
V8901-HLM-B Vacuum-Tweezer, for handling SMD packages, is self-contained and manually operated. Pen-Vac has six cups and probes. Cup sizes are 1/4", 3/8" and 1/2". Comes with two of each cup, one on a straight probe and the other on a bent probe. Is made from ESD-safe materials, and has no hoses or batteries to replace. Tube is machined aircraft aluminum.
The SP150 printer is a manual or semiautomatic printer with metal or rubber squeegees. Features squeegee lengths of 130 mm, 220 mm, 260 mm, 300 mm or 400 mm. Has an adjustable print pressure force of 4-140 N, programmable printing speeds of 10 to 99 mm/sec, and adjustable separation speed from 1 to 5 mm/s. Print cycle counter records from 0 to 999,999. Has a manual drawer and manual drawer alignment. Reportedly can handle PCBs up to 410 mm x 400 mm, a print table of 460 mm x 520 mm, a maximum printing area of 390 mm x 360 mm, and a substrate height from 1 mm to 4 mm. Provides manual width adjustment, two support bards with lengths of 410 mm, four vacuum fixation pins, 10 support pins, two centering pins with 3 mm diameters, and a Venturi-type vacuum pump. Features XY alignment range of ±3 mm, theta of ±2° and accuracy of ±30 µm. Is said to print maximum frame size of 23" x 23".
The VWP-500 wafer pen is said to accept all of the company’s press-fit wafer tips and an adaptor that accommodates die/SMT handling tips. Available for handling wafer sizes from 2" to 12" in diameter, and for 1/16" ID or 1/8" ID vacuum hoses. Is available as a standalone wafer pen or as a kit with vacuum hose, holder, vacuum source and wafer tip.
VisualCAM 2006 and GerbTool 15.2 feature version 8.0 ODB++; flip panel; IPC-D-356B support; nearly 200 enhancements and defect fixes; ability to “see through” composite layers, and flying probe test point generation. Choose to export full IPC D-356/A/B (with 099 records for test points) or scaled-back version with test point features only.
Kester 295 No-Clean Flux is free of halides and bromides. Designed for cored solder wire. Tested to conform to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01, with no chlorine and bromine detected. Designed with blend of rosin and proprietary activator system. Reportedly eliminates splattering and the need for cleaning. Residues are non-conductive and non-corrosive. Is available in a variety of alloys, wire diameters and flux percentages. Is classified as type ROLO flux. Can be used for both lead and Pb-free soldering. Recommended solder iron tip temperature: 260°C to 370°C for Sn63Pb37 and 350°C to 400°C for Pb-free SnAgCu alloys.