Dual Lane Vision X Series convection soldering system enables simultaneous lead- and Pb-free reflow in a single machine. Comes with two conveyor lanes that can be operated asynchronously at different speeds and asymmetrically with different lane widths. Can be loaded with diverse PCBs printed with different solder pastes, while a flexible heating system enables the selection of ideal reflow profiles for the separate products. Homogenous, non-separated heating and cooling zones across the entire width of the conveyor are said to increase operating convenience and reduce investment cost. Comes with air or nitrogen atmosphere and integrated residue management system.

Rehm Thermal Systems, www.rehm-group.com

X3 x-ray and AOI comes with proprietary tomographic imaging technology for gathering multiple oblique images to digitally construct 3-D renderings. Offers unobstructed inspection of solder- and component-related defects on double-sided boards. Multiple slices, or inspection planes, can be generated from the same set of oblique images at any time. Selectively uses 2-D or 3-D x-ray. Programming said to take less than 45 min. For in- or off-line.

Yestech, www.yestechinc.com

FlexSolder S3532 is for high-speed stamp soldering a controlled nitrogen atmosphere. Is said to provide advantages over typical multi-flow types; does not use any pumps, and is fast and clean, with no overspray. Top and bottom contour plates keep the PCB in place in X, Y and Z, and control board warpage caused by either previous double-sided reflow or the PCB characteristics. Requires minimal programming; no CAD, Gerber or other data needed.

Juki Corp., www.jas-smt.com

RED-E-SET board support reportedly can reduce component damage caused by misaligned bottom-side board support tooling or placement pressures. Is for screen printers, dispensers and automated assembly machines. Can reportedly be configured in fewer than three minutes. Is said to provide zero defects; eliminates board flex using a spring-loaded support pin system.

Production Solutions Inc., www.production-solutions.com

SE500 3-D solder paste inspection system inspects assemblies with a >70 cm²/sec. inspection speed. Can inspect pad sizes down to 01005. Has two models that accommodate different panel sizes. Features a conveyor that can transport panels from 50 x 50 mm up to 510 x 510 mm. SE500X can transport panels from 100 x 100 mm up to 810 x 610 mm. Features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and Process Tracker SPC charts with alarm capability.

CyberOptics Corp., www.cyberoptics.com

Friendly green wipes are low-linting, absorbent, soft and said not to scratch. Are for light duty tasks and delicate surfaces. Are chemical extractables made of 100% recycled cellulose. Come as single-ply wipes measuring 15 x 16.6" or 4.4 x 8.3". Presaturated version removes non-reflowed solder pastes. Are biodegradable and made of cotton non-woven fabric. Feature easy-release dispenser for one-at-a-time dispensing.

High-Tech Conversions, www.high-techconversions.com, www.friendlygreen.org

The 10W x-ray tube is said to have submicron feature recognition. Uses sealed-transmissive x-ray tube technology, providing user-selectable choice of 100 nm feature recognition at up to 4W across the tube kV range. Reportedly offers x-ray flux at the best resolution; ideal for imaging slight density variation and for improved computerized tomography analysis. Is available in XD7600NT100 digital x-ray inspection system, which can be equipped with CT providing 3-D modeling, measurements and virtual microsectioning of solder joints; said to be suited for analytical analysis of solder interconnections for stacked die, MEMS, package-in-package and package-on-package.

An expanded line of precision linear shafts is available. Are frequently used in machine building and in the design of industrial automation machinery and systems. Come in a variety of design options, including radial wrench hole drilled at one or both ends; precision option with perpendicularity tolerance of 0.03 mm; high-precision piloted shafts with pilot concentricity tolerance of 0.02 mm; both ends stepped and tapped with wrench flat, and both ends tapped and one end stepped with wrench flat. Come in standard and configurable sizes and lengths, as well as in a selection of materials/grades (e.g., bearing steel, stainless steel, carbon steel) and surface treatments (e.g., chrome plating, LTBC plating). Can configure dimensions of more than 90 different machined end variations.

Misumi USA Inc., www.misumiusa.com

The Y.Cheetah combines x-ray technology with high-speed flat panel detection. Features synchronized tube and detector motion for constant image contrast at high resolution. Repositions imaging components at constant magnification for higher contrast and power, lower noise, or fast imaging and 3-D scanning. Both are one-click steps. Offers 2-D to high-speed 160 kV, 64W microfocus computed tomography (µCT). Inspection area is 18" x 16" (460 x 410 mm) and can be viewed at ±70° even at the highest geometric magnification.

Yxlon International, www.xylon.com

GoSelective selective soldering system now comes with a fiducial recognition function with automatic PCB alignment. Registers PCB to be soldered optically and compensates for various types of misalignment such as offset, rotational error and linear shrinkage within the PCB. Wrongly placed PCBs are detected and are not soldered. Up to three fiducial marks are selected in a learning procedure. Captures images of these fiducials and memorizes their location. The machine moves to the previously memorized positions automatically and captures PCB image. The correlation between this actual live image and the learned image is calculated and gives a correction value for each fiducial. Can then calculate offset, rotation and linear shrinkage of the PCB compared to the board used for the learning procedure. Generates a position correction for each production board. Contains an error-proof function that checks the loading of the correct soldering program and controls each board for positioning.

SEHO Systems, www.seho.de

 

LMF Series Fiber Laser Markers are capable of making contrasting marks on plastics, and annealing and engraving metals. Pulse waveform of LMF2000 reportedly makes the marker the ideal tool to make fine cuts in copper, steel or aluminum up to 0.02" thick. Enables prototyping of lead frame, other featured sheet parts or steel tubes. Can be used to modify an existing design. Uses no direct assist gas. Can be tuned for speed and quality with an underside burr of less than 0.0005".

Miyachi Unitek, www.muc.miyachi.com

The VT-S700 inline AOI system uses a telecentric lens with a 2-MP camera. Is said to reduce image distortion and improve inspection accuracy at the edges of large field-of-view. Delivers inspection of up to 10 µm for components as small as 01005 and down to -0.012" pitch. Uses three-color highlight system that illuminates PCB in a 360° dome. 3-CCD camera enhances solder shape recognition accuracy. Other features include color-enhancing capability, integrated graphical user interface and logic customization. Optical character verification is available. Resolution can be selected for 10, 15 or 20 µm. Separate models are available to handle 10 x 13" and 18 x 20" boards.

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