VacuNest shape memory board support system is said to handle large board products up to 450 x 450 mm, including backplanes, solar and fuel cell panels and multiple substrate printing. Designed to eliminate problems associated with conventional dedicated or programmable pin tooling systems. Each module consists of a pliable, anti-static chamber containing a foam former surrounded by polymer granules. The chamber can be profiled to match the contours of different populated board undersides. Under vacuum, that profile can be locked into place indefinitely without shrinkage. Releasing the vacuum, manufacturers can reset the nest as an elastic material brings the chamber back to its original position.
 
Novatec EAP, www.novatec-eap.com
 
 

SP200-AV2 stencil printer includes Trans-Stencil-Vision; has PCB shuttle mechanism. The upper part of the machine frame contains vision cameras, the print head and the stencil-frame guide. Squeegee does not have to be removed for stencil change. Vision cameras look directly through the stencil apertures to the PCB. Cameras are mounted with spring-operated clamps. Print head comes standard with a continually operating squeegee-pressure control. Metal and synthetic squeegee blades can be used. Offers a 23" stencil frame system with a print area of 360 x 400 mm. Includes theft-proof laptop. Software runs on Windows XP.
 
Essemtec AG, www.essemtec.com
 

SN100e Pb-free solder is manufactured from tin, copper and cobalt. Is RoHS-compliant and reportedly reduces copper dissolution. Is said to provide brighter, shinier solder joints compared to SAC alloys. Is compatible with all SAC and SnCu alloys. Performs with ENIG, immersion tin, immersion silver, OSP, and HAL board finishes. Meets requirements of J-STD-006.
 
Qualitek International, www.qualitek.com
 

KIC 24/7 thermal management system now comes standard with a feature that reportedly transforms a reflow oven to a transparent process tool. Generates reports for defects per million opportunities and reflow process yield. This information is said to be instantly understandable.
 
KIC, www.kicthermal.com
 

 

The Mixpac F System consists of a manual or pneumatic dispensing gun, a cartridge and a static mixer, all designed to work together. Cartridge dispensing systems are used to dispense two-component adhesives in a variety of volumetric ratios. Features a nose plug interface. Permits mixing and dispensing of high-viscosity adhesives.
 
ConProTec Inc., www.conprotec.com
 

 

Scapa 815 is a heat-resistant, non-silicone tape said to withstand temperatures up to 350°F. Is designed to mask and hold tools, forms and parts for metal and composite bonding, and for masking PCB contacts during conformal coating. Consists of a high-temperature nylon backing, single coated with a rubber adhesive that reportedly eliminates the potential for silicone contamination. Is 0.0032" thick.
 
Scapa North America, www.scapana.com
 

DSP862 no-clean Pb-free solder paste is said to have a broad processing window and accommodates a range of applications. Complies with ROL0 IPC and IPC Class III. Available in standard form as well as green for SAC and most other Pb-free alloys. Has brick definition, extended stencil life and “response-to-pause” time. Provides print speed window from 25 to 150 mm/sec. Handles CSP and QFN on a Pb-free board finishes, OSP-Cu, immersion Ag, immersion Sn, ENIG and LF HASL. Reportedly will perform for at least 8 hr. of continuous printing. Is said to yield no or low solder beading and solder bridging. PWB assemblies in both air and nitrogen reflow using straight ramp or soak profiles up to 200°C. Tack life said to be greater than 48 hr.
 
Qualitek International Inc., www.qualitek.com