WS170 water-soluble solder paste is intended for Sn62/Sn63 applications. Reportedly produces fully wetted, shiny solder joints, and has the activity necessary to solder to common hard-to-wet alloys such as gold, platinum, palladium, silver, Alloy 42 and bare copper. Print speeds of up to 6"/sec. have been tested with full aperture fill and no slumping noticed. Benefits are said to include non-hygroscopic formulation, broad process window, 24-hr. stencil life and tack time, minimal to no foam when cleaned, easy-to-clean post-process residues, excellent wetting, repeatable paste deposition, and compatibility with all plating types. Provides up to 8 hrs. response-to-pause time without print degradation.
 

SMT3000LD automatic defluxer and cleanliness tester is reportedly capable of removing all flux residues, including rosin, no-clean and water-soluble, lead and Pb-free. Is equipped with automatic chemical injection and closed-loop wash solution recycling systems. Wash solution is heated automatically and sprayed onto assemblies; is directed back to holding tank for reuse. Rinse water is sprayed onto assemblies, is directed through the pre-drain filtration system and sent to drain. Assemblies are dried via on-board convection and radiant forced air-drying system. Standard features include programmable maintenance reminders, remote SPC viewing, SPC data USB export and a built-in chemical management system. Zero-discharge evaporation system is optional. Is said to be capable of defluxing and cleanliness testing up to 200 101 x 152 mm boards and up to 28 457 x 508 mm boards per hr.
 
Aqueous Technologies Corp., www.aqueoustech.com