e.dot+ compact electric hot melt adhesive guns are said to offer a combination of accurate dot or bead placement, easy installation and quiet operation, while requiring minimal space for installation and service. Reportedly ideal for high-speed dotting applications. Operate in combination with a small diameter hose and an external gun driver, permitting direct plug-and-play connections between the adhesive melter, gun, driver and hose. Are said to have on-times as low as 0.4 ms, cycle rates as fast as 1.8 ms, and a service life in excess of 200 million cycles. Features a removable armature and seat, and a number of interchangeable nozzles. Manual stroke adjustment permits re-zeroing of the module after servicing.

Nordson Corp., www.nordson.com
 

A dummy version of Amkor's FusionQuad lead frame-based plastic package is available. Is based on the addition of exposed bottom lands within a standard VQFP package format. Is said to extend the I/O range of classic leadframe packaging to nearly 400 unique pins; delivers an approximate 50% reduction in package size for a given leadcount. Reportedly provides short signal paths to bottom lands and high power dissipation capability with the solderable exposed die attach paddle.
 
Practical Components, www.practicalcomponents.com
 

Data Miner 2.0 data reporting software for manufacturing is said to bring the concept of lean to the development of manufacturing reports and analytics. Reportedly can retrieve, visualize, interrogate, and report on process, quality, production WIP, traceability, and performance information without requiring IT assistance, any database or reporting skill. Provides interactive, graphical way to incorporate historical manufacturing data in preconfigured reports without employing SQL. Reports are readily saved and delivered later by email or Web-based access. Once report is created and saved, the system can generate and send a report automatically. May be used alone or with iMonitor.
 
Aegis Software Corp., www.aiscorp.com
 

TechniShield is a plating process for individual shielding of active components. Offers direct plating to the molding compound; is said to create nonporous deposit that eliminates the need for metal caps or lids. Uses novel chemistry to roughen and plate the epoxy molding compound. Is chrome-free. Reportedly maintains excellent adhesion through multiple reflows and produces a pore-free surface.
 
Technic Inc., www.technic.com    
 

2200-545 Series adjustable stroke mix-dispense valves are designed for controlled flow of 2-component adhesives and sealants, such as silicones, epoxies, urethanes and acrylics. Are based on the No-Drip valve body design for fluid control, featuring the integration of carbide ball-end needles and carbide seats. The adjustable stroke feature permits the operator to fine-tune the flow rate by rotating the threaded stem on the back of the valve. The valve is also available with an eyelet stem for attaching to a tool balance. Are 2.25" in diameter by 5.5" long, and are rated for 3,500 psi (240 bar). Double air actuated with two 1/8 NPT ports for a 4-way pneumatic valve connections.  Body has two 1/4 NPT fluid inlet ports for Part A and B materials and accepts a wide variety of motionless mixers; has two screw holes and two dowel holes.

Sealant Equipment & Engineering Inc., www.SealantEquipment.com/2200-545
 
 

 

 

The Amkor 15 mmm Dummy PoP comes in a 0.65 mm pitch with a 160 I/O top and a 0.5 mm pitch, 605 I/O bottom. Is for PSvfBGA. Is the mechanical equivalent of a live component used only when physical properties are required.