S6053BO-V fully automatic wire bond inspection system is for small wire bond analysis. The camera technology and the transport reportedly can be adapted to varying production demands. Is equipped with a universal, high-resolution VHR camera module. Can inspect down to 2 to 5 µm per pixel. Camera module can be arrayed with one or several cameras and illumination units. Bond wires smaller than 20 µm in diameter can be inspected 100%. Is available in a dual track configuration, including an integrated shuttle that loads the second track as an inspection is conducted on the first track. Is configured for fine bond wire analyses. Also said to inspect components and ASICs with high accuracy.
 
Viscom, www.viscom.com
 

Easy Lift is an ergonomic workbench with 20" of adjustable work surface. Serves as a workbench, assembly station and adjustable desk. This ESD-safe work surface is approved for static-sensitive electronics assembly and non-ESD applications. The table moves vertically and has a 250 lb. load capacity. Comes standard with a 24 x 30" static dissipative powder-coated steel tabletop with ESD-safe Blue Softsurface matting material. Has foot pedal and adjusts from 19" to 39".

 

The 2D Inspection (2Di) V9 software tool monitors the print process. Is said to inspect boards or stencils to determine if print quality is deteriorating. Permits operators to identify when a stencil clean or paste dispense is required, and prevent bridging, misalignment, stencil smear, stencil blockage and reduced paste volume. Includes simple setup, on-board guidance, enhanced operator prompts and automated post-print inspection feedback highlighting sites requiring attention. Has full-page zoom function.
 
DEK, www.dek.com
 

VP5000 inline 3-D SPI system has a large field of view said to reduce the number of images required to inspect the board. Has tabbed menus in touch screen interface. Includes warning thresholds to the pass/fail outputs. Comes with an interface to Qup-Navi software that enables the height calculation and volumetric inspection data to be incorporated into a root cause of failure analysis. Uses color stripe phase shift method. Combines RGB (red-green-blue) light sources and a 3-CCD camera with texture mapping or gradation displays. Inspects for average height, volume, excessive deposition, insufficient solder, smearing, misalignment and bridging. Has an interface to import Gerber and CAD data. Locations of defective pads are displayed on the substrate map with up to eight raw images of defective pads. Multi-data station 5000DS uses one PC and can handle up to six machines for off-line programming and analysis of production data, line status, and machine waiting time for parts. Accepts substrates from 2" x 2" up to 18" x 20" and provides 12 µm resolution with a 23 x 31 mm field of view. A 2-D code reading option enables the camera to read Data Matrix (ECC200) and QR (Model 2) codes.

Omron Electronics, www.omron247.com  
 

 

The free Intermediate Data Format Plug-In is the first plug-in module for PCB123 based on the v. 3.1 Software Developer’s Kit. Enables import of PCB designs for use in mechanical and electrical CAD systems in a bidirectional, neutral format within the ECOsystem Design Environment. Imports outline definitions of the PCB as specified by the mechanical CAD tool, synchronizing the mechanical design work with the PCB development work.
 
Sunstone Circuits, http://www.sunstone.com/products-services/cad-software.aspx
 
 

FLX2010C is for placement of special components on film or flex boards. Features a conveyor system said to permit flexible and fast placement on the substrate. Can be placed upstream in the line before a die bonder. In a downstream pick-and-place process, components reportedly are accurately placed on these dice, where the sandwich carrier will be inserted from the left side and stopped by a "stopin" mechanism. The carrier is located with a chuck. Nozzles suck in from the underside of the sandwich carrier at defined positions. The substrate can be populated from conventional component feeder systems after the alignment of the fiducials. The film leaves the placement machine via the conveyor after the release of the sandwich carrier from the vacuum.
 
Essemtec AG, www.essemtec.com
 

 

The SP003-ML-V stencil printer is for small and medium volumes. Has an integrated vision system. Offers control over squeegee and speed attributes and reportedly can reproduce them securely. Consists of two quick-fix cameras that look directly through the stencil apertures down to the PCB. Images are simultaneously displayed on two 8" monitors to check alignment. Correction of X, Y and theta axes is possible using backlash-free adjusting screws. Comes standard with a universal PCB fixture mechanism. Adjustable magnetic table can accept single- and double-sided substrates. Print area measures up to 360 x 400 mm; screens and stencils can be mounted in frames with up to 23" x 23" in size.
 
Essemtec AG, www.essemtec.com