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The Extech i5 compact IR camera is for thermal imaging, with focus-free viewing and 5000-image miniSD card storage. Monitors and detect the thermal condition of electrical system components. Reportedly can inspect areas that can’t be reached with thermocouples or other contact-based instruments. High-res images pinpoint problems in need of repair. Is said to deliver accuracy of 2% and thermal sensitivity of 0.18°F/0.1°C. Is 12 oz. Features a 2.8" high-res color LCD.
 
Extech Instruments, www.extech.com
The Nexus System workbench is designed for electronics, research, assembly and technical work. Can be customized. Has heavy-gauge upright frames with notches in the front and back, to mount accessories on either side. Accessories include tool rails, lights, shelves, pivoting arms, and monitor/accessory trays. Electrical and air power attachments can be added as well.  Overhead cabinets can be added for storage. Is ergonomically designed.
 
Lista International Corp., www.listaintl.com
 
 
 LFM 48 N is a no-clean, Pb-free alternative to gel pastes traditionally used in BGA PoP stacked device applications. Is for holding larger area devices that often exhibit warpage during reflow. Combines ultra-fine solder spheres and a low-voiding, thermally stable flux vehicle. Formulation comprises SAC 305 with a solder powder size of 4 to 24 µm. Features reported open time in a dipping tray 8 hrs. at 23°C and 50% RH, and up to 8 hrs. process window time between dipping and reflow.

Almit Ltd., www.almit.com


The Horizon 01i screen printer now has a reported accuracy of 2.0 Cpk @ +/-25 µm, and can output DPMO statistics. The Horizon 03i now comes with Cyclone understencil cleaning, said to reduce changeover times and paper volume. And the Horizon platform range now comes with HawkEye post-print verification, said to verify 100% of boards in line beat rates (acquisition speeds: 750 to 1700 sq. mm per sec.). 
 
Lites Wipes are a generic version of Kimberly Clark’s Kimwipes. Reportedly are exactly the same but at a lower cost. Are made with absorbent low linting cellulose. Two sizes are available: 4.5" x 8.3" in 300/box quantities; 15" x 16.6" in 140/box quantities. Push-up dispensers are also available.
 
High-Tech Conversions Inc., www.high-techconversions.com
V400 software reportedly reduces programming time 40%. Creates customer libraries automatically, permitting users to deploy the same library in different process stages from first-off inspection until post-reflow or post-wave soldering. Includes a calculation algorithm that operates with synthetic imaging algorithms; facilitates the deployment of rule-based algorithms. Is said to be ideal for high-volume production. Features an improved color-modeling algorithm.
 
Marantz Business Electronics, www.marantz.com/bus/eu/
The Nitrogen Peel-Off Jet is said to improve fine-pitch selective soldering results. Provides a 360º, directional jet of preheated nitrogen to assist in minimizing solder accumulation on specific solder joints. Reportedly wets surface with minimal amount of solder required.
 
ACE Production Technologies Inc., www.ace-protech.com
 
Model LX30 single-axis actuator comes with or without a motor bracket, with one or two short blocks, or one or two long blocks. All configurations are available in a covered version. Model LX45 (to be introduced July 1) will come with or without a cover, with or without a motor bracket, and in the same block configurations as the LX30. LX Series models will be available in 1,000 possible configurations. Provide precision linear motion for automated assembly operations. 
 
Misumi USA, www.misumiusa.com
 
Spectrum S-822 has dual-shuttle stages for chip scale package underfill and other electronics applications. Is standalone and offers controlled precision dispensing capabilities. Permits parallel processing on two shuttle stages for continuous dispensing; stages automatically slide in and out through an opening in the front of the machine. Options include choice of impingement or contact heated stations. Jet-on-the-Fly dispenses lines of dots continuously. Calibrated process jetting uses weight control. Dynamic dispense control offers flexible control parameters through closed-loop servo technology. Mass flow control uses weight-controlled dispensing and automatic calibration. Comes with Fluidmove software and ESD glass and has passed all EMC testing for CE certification.
 
Asymtek, www.asymtek.com
 
Amkor’s middle stacked package that makes a Triple Stack PoP package is available in a dummy version. Is identical to the live package, without the die. Is said to be made of the same materials on the same manufacturing lines and have the same size, thermal and soldering properties as the live equivalent.

Practical Components, www.practicalcomponents.com
 
 
The FLX2010 MKL placement machine now comes with a three-head system that performs material dispensing and consecutive placement of LEDs on film substrates. Features a placement axis with an integrated component adjustment mechanism, as well as two independent axes with a piezo flow valve and a time-pressure dispenser gear. Dispensing valves are mounted on motorized, closed-loop driven linear axes. Is said to handle substrates up to 800 x 600 mm. Substrates are vacuum-secured. Vacuum is activated with a foot-operated switch, and the film substrate sticks to the table. A time-pressure dispenser applies three dots of isolating adhesive on the substrate. Solder paste dots are applied on the substrate solder pads using a piezo-controlled PFV nozzle. LEDs are picked from standard feeders, adjusted and placed. The isolating adhesive reportedly eliminates unwanted electrical contact between the solder dots.

Essemtec AG, www.essemtec.com
CircuitSpace v2.2 permits bi-directional communication between layout and a PDF schematic. Is said to provide instant selection and verification of design elements such as components, nets or pins, within Cadence Allegro and schematic. Cross-probing permits populating any selection set through interactive clustering. Is said to reduce board layout and placement time to minutes with AutoClustering, design reuse, and cross-probing. Features concurrent layout development project wide; template generation for global library usage across divisions; template usage with and without etch; automated layout reference designator propagation; advanced sustaining engineering and ECO process; automated change report between layout designs and availability.
 
DesignAdvance Systems Inc., www.designadvance.com

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