SFX-6308 I/O module, part of the Scanflex JTAG/boundary scan hardware platform, features eight independent analog I/O channels with additional digital resources and supports application-specific in-system reconfiguration by means of VarioCORE. Reportedly provides four output channels with extended current yield of up to 200mA at ± 10V and four bipolar input channels with a range of ± 10V. All channels have a 12 bit resolution and can be disconnected from the UUT via relays. Is supported in System Cascon from version 4.x on.
 
Goepel Electronic, www.goepel.com
 
 

The XSD series of 1% RH dry cabinets is designed to meet J-STD-033 for handling moisture-sensitive devices. Is said to deliver precision measurement, 24/7 data logging and ergonomic touch-screen operator interface. SDR series combines features of XSD in a configuration that accepts full feeder trolleys from all pick-and-place manufacturers. Both deploy self-regenerating desiccant.
 

The PCT-1000 benchtop programmable preheater is said to deliver more heat to difficult boards, while maintaining high levels of thermal control and lower operating temperatures. Is reportedly ideal for Pb-free, multilayer boards and large ground planes. Delivers forced convection heat that can be controlled with four time and temperature zones, and an additional cooling zone. Provides thermal boost for boards that demand heat because of large ground planes, multiple layers or Pb-free solders. Features “external” thermocouple input. Design creates a convection vortex. Operates in manual or automatic mode. Up to 50 thermal profiles can be stored. 
 
The BH-1000 optional board holder consists of two independent post-rail assemblies that can be positioned as close as 12 mm. Each post-rail assembly is 300 mm long and has a 30 mm height adjustment.
 
OK International, www.okinternational.com
 

The KISS line of selective soldering equipment now includes a wave height monitor and control module. Reportedly maintains solder wave heights to within +/- 0.005". Is said to be effective when working with the wave nozzle sizes from 6 mm to 1.5 mm, and selectively soldering tight pitch component areas. Monitoring methodology incorporates resistive measurements of wave height relative to a known reference. Is performed at programmable intervals during extended production runs; closed-loop feedback is then used to automatically adjust solder pump speeds.
 
ACE Production Technologies Inc., www.ace-protech.com
 

Cover-Extend Technology is a limited access solution for in-circuit test. Is said to eliminate the need for physical test points. Is part of VTEP v2.0 Powered test suite. Is a hybrid between Boundary Scan and VTEP Vectorless Test. Relies on stimulus provided by Boundary Scan cells. Benefits reportedly include improved test coverage (up to 50% node access); savings on fixturing, and strain relief on solder joints.
 
Agilent Technologies Inc., www.agilent.com 
 

RTV 800 Series UV/Dual (UV/moisture) cure materials, for encapsulating and staking sensitive components, have reported cure speeds of fewer than three seconds. Patented chemistry permits paste-like products to cure up to 5/8" thick with minimal energy requirements. Viscosity of encapsulant ranges from a few hundred centipoises (for spraying and dip coating) to several thousand for thick coating and deeper potting applications up to 3/8" thick. Are self-leveling and flowable, and shadow cure at room temperature. Are based on silicone chemistry, translucent, and do not degrade or yellow on long-term exposure to light. 
 
Novagard Solutions, www.novagardsolutions.com
 
 
 

The large-area Photon Vi print platform is designed for integrated manufacturing and process optimization. Delivers flexible substrate image size range from 1.5" x 2.0" up to 24" x 24", a reported 30% increase over the standard platform. Is able to handle board products up to 16.5 lb. and 0.236" thick. Accommodates Instinctiv productivity tools. Has adjustable transport rails and a two-speed board transport control system with software time lag control. Is preconfigured with an upgraded understencil cleaner deploying a 4-stage head, providing cleaning for a 24"wide image using wet, vacuum and dry strokes.

DEK, www.dek.com
 

Instinctiv V9 machine control software now incorporates enhanced control of HawkEye post-print inspection technology, easing paste-on-pad verification. Reportedly provides post-print verification of every board, and operates at line beat rate, delivering go/no-go indication for each board and isolating faulty boards in real-time. Identifies pad exhibiting the lowest paste volume.

DEK, www.dek.com

 

 

V-Works 24 is said to delivers uniform condensation heat transfer to the single component rework environment. Permits use of absolute limits of maximum temperatures and small delta at peak temperatures. Comes with 24" x 24" working envelope, split mirror and camera vision system for aligning components; on-board recipe storage; touch-screen operator interface; manual x, y and z adjustment; vacuum system; bottom-side global preheat; semiautomatic cycle for component removal and replacement; and cool-down function.

R&D Technical Services, www.rdtechnicalservices.com

Expert-SAFP semiautomatic pick-and-place system is for prototype quantities. Has an air-suspended pick-and-place head, integrated vision and placement system, and picks from reels, sticks, rest tape strips and loose components. Includes turning station for upside-down components standard. Comes with dispenser and reflow tool.

Essemtec, www.essemtec.com

 

Enhanced 7^th Generation programmer models 1710, 2710, 2710M, 4710, 4710-M, 3710MK2 and 3710MK2-M feature high-speed USB 2.0 standard bus, to increase communication speeds and reliability. Support devices with densities up to 4 Gb. Replace existing 7^th Generation product line.

BPM Microsystems, www.bpmmicro.com

“Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality,” version v.08 makes recommendations regarding appropriate specifications and fabrication notes on drawings for printed circuit boards, general procedures to qualify PCB shops, and testing procedures to verify quality and reliability. Provides necessary material selection information to supplement IPC-4101 slash sheets. Contains recommended examples of fab notes for SnPb solder assemblies and Pb-free assemblies, for use as general specifications on PCB drawings, a basic questionnaire to supplement to IPC-1710 for qualifying PCB shops, and recommendations for ongoing activities to ensure qualified PCB shops maintain internal quality. 

Engelmaier Associates, engelmaier.com