Flashstream will support up to 32 Gb by year-end. Speed has incorporated use of cache-programming modes in select devices, reportedly pushing top speed on NAND memory to 8.23 Mb per sec. data transfer during programming. Now supports MLC flash memory using a bit error rate tolerance method. Managed NAND architecture like eSD/eMMC such as Samsung MoviNAND, Micron e-MMC, and Sandisk iNAND are now supported. Vector Engine has been enhanced with address-data multiplexed (A/D MUX) NOR devices. Bad block management options in the BPWin software have been enhanced; reportedly more than 90% of “standard” bad block management schemes can be addressed without the need for customization. Bad block parameters permanently can be recorded to the master-programming file and transferred to manufacturing facilities globally. Now available in multiple automated handling systems.
 

This thermal die lid attach adhesive is said to replace using two existing materials, such as a thermal interface material and a lid attach adhesive. Uses non-silicone polymer. Polymer is filled for high conductivity; additives are used to improve material properties. Reportedly shows little or no change in thermal conductivity, as measured by laser flash methods and adhesion, based on shear testing, after 150 cycles under standard reliability testing. 
 
Lord Corp., www.lord.com
 
 

Gelease material has some cross-linking; reportedly has strength to stay in place and does not pump out. Gel is soft; absorbs movement of surfaces caused by CTE differences of assembled parts. Is built on the same cure chemistry as MG121, but reportedly offers higher conductivity, lower modulus and an improved thermal conductivity value (3.8 W/mK). Was designed for syringe dispensing or stencil printing. Is said to be ideal for automotive and consumer electronics. 
 
Lord Corp., www.lord.com
 

 

 

The DX dispensing system includes a mobile handheld dispenser with a refill station for two-component materials. Is said to dispense a variety of ratios. Multiple handheld dispensers can be refilled with one refill station; uses two transfer pumps that feed from 5 gal. bulk containers, each equipped with follower plates.
 
Mixpac Equipment Inc., www.mixpacequipment.com
 
 

BluePrint for PCBs Version 2.0 documentation-authoring tool automates the creation of documentation that drives PCB fabrication, assembly and inspection processes. Now integrates with CAM350. Reportedly can be used to create and distribute all the deliverables required for a PCB fabrication and assembly release package in one electronic file. Supports a module for panel document creation. Includes flip panel; universal release package navigator; CAM350 embedding, and usability updates. 
 
DownStream Technologies, www.downstreamtech.com
 

Series 500 ultrasonic stencil cleaners are designed for fine-pitch, low-volume stencils. Are said to be entry-level for users not able to purchase a fully automatic system; reportedly offer similar cleaning results. Are equipped standard with a heated wash and other basic requirements for cleaning Pb-free solder paste, pallets and adhesives. Can be customized. Model 520 cleans up to 20" stencils; Model 529 cleans larger stencils.
 
Smart Sonic, www.SmartSonic.com
 

The K4000 PCB depanelizer is for singulating skip-routed PCB panels up to 24" long. Includes right, left blade guards. Front and back support and take-up table are height adjustable. Is available with optional light beam safety curtain across the front of the blades. Includes conveyor belt. Tooling to align panels is optional. Blades are made of tool steel and can be re-sharpened.