Circuits Assembly Online Magazine - News

Products

Solsys-8460IRTP reflow oven operates via IR or hot air. Has eight heating zones (16 heaters). Uses a pin-chain conveyor that runs from 0.3-1.5 m/min. Has eight blowers and four cooling fans. Dimensions: 3650 x 1055 x 1410 cm in size.

Antom, www.antom.co.jo

The EM multifunctional placement machine series is rated at 13,000 cph per IPC-9850 and places components ranging from 0201 to 45 mm QFPs. Accuracy is a reported +/-0.06 mm at 3-Sigma. Has a three-stage conveyor, and includes up to 120 feeders, and can pick from tape, sticks or trays. SMEMA compatible.

Evest, www.evestcorp.com

RTV 800 Series UV/dual cure silicone technology reportedly has cure speeds of less than 1 sec. Is said to permit curing of paste products up to 5/8" thick with minimal energy requirements. Physical properties can be varied.

Novagard Solutions, www.novagardsolutions.com

Niton Data Transfer software release 6.4, for handheld Niton XL3 Series analyzers, introduces features such as TestAll technology, live spectra and peak identification, simplified Chinese language support, and a consumer goods screen. Provides support for small spot focus in mining applications and for small spot alloy helium mode. Permits customization of displayed Sigma value. For existing customers, the upgrade is available at no charge.

Thermo Fisher Scientific, www.thermo.com/niton

The Servo-Flo 401 series servo-motor drive meter system is designed to apply small precision beads and metered shots of adhesives, sealants or lubricant materials from 1 to 8.5 cc in robotic and manual dispensing applications. Dispenses thixotropic and cohesive materials such as 1-part silicones, epoxies, urethanes and heat or ambient cure materials. Incorporates positive rod displacement precision metering of fluids. Is said to provide precise and repeatable bead profiles and variable flow-rate metered shot volumes. Is designed to provide a variety of preset material dispensing profiles. Meter accepts flow-rate commands from automation controls or can be preset to vary the flow rate during dispensing.

Sealant Equipment & Engineering, Inc., www.sealantequipment.com

MTpro software is said to simplify conveyor system planning and application by using 3-D solid model and electronic catalog technology. Contains all components and systems for VarioFlow modular chain conveyors, TS-family assembly conveyors, aluminum structural framing, and Manual Production Systems. Integrated product configurator supports user selection of technical parameters and directly displays chosen configuration as a 3-D model. Users can transfer 3-D models and 2-D drawings into internal systems via direct interfaces to all common CAD programs. Enables retroactive modifications to components and parts list information in selected CAD systems.

Bosch Rexroth, www.boschrexroth-us.com

The LTS200 Lead Tinning System is a programmable, automated machine that reconditions component leads for hi-rel and/or RoHS applications. Can be used for conventional lead tinning or for re-conditioning SnPb parts. Built using designs and components from KISS Selective Soldering systems, including the KISS-ware OS. Has a central fluxing station with two solder pots. Can be programmed to handle transistors, capacitors, diodes, axials, radials, QFPs, pin grid array, sips, dips and connectors.

ACE Production Technologies, www.ace-protech.com

A series of nine turnkey lines are targeted to diverse production and budget demands. Each include a pick-and-place machine, stencil printer and Pb-free reflow oven, with conveyors and board-handling equipment available. Lines include high-mix, mid to high-speed, as well as low-volume starter and lab.

Manncorp, www.manncorp.com/turnkey

The SV-100 Slider Valve for solder paste dispensing is said to be up to 20% faster than standard auger dispensers; reportedly achieves 20,000 dots per hr. (on 1 mm grid) while delivering dots of less than 300 µm (0.012") for solder paste types 4, 5 and 6. Dots as small as 125 µm (0.005") in diameter can be achieved with type 6 paste. Dispenses dots and lines of pastes and fluids that contain metal additives with minimal clogging. Is compatible with Pb-free and no-clean solder pastes and silver-filled epoxies. Is for solder paste dots for passive components smaller than 0603, rework of BGA and QFN electrical connections, lines and patterns for RF shield attach, low-volume/high-mix applications, and unique patterns of conductive epoxy.

Asymtek, www.asymtek.com

Loctite 5210 is a fast-cure thixotropic silicone material said to be ideal for devices in harsh environments. Offers alternative to hot-melt glues. Is a non-corrosive room temperature vulcanization silicone material designed for wire tacking, selective sealing, vibration dampening, and rework/repair applications. Reportedly has dispense times as little as 31 sec. for two connectors and a tack free time of fewer than 5 min. Offers a high UPH alternative. Material reportedly will hold its form and will not spread or migrate to other locations. Cures at room temperature.

Henkel Corp., www.henkel.com/electronics

Circuit Suds biodegradable cleaner was formulated to be environmental friendly. Is said to be suitable for no-clean, rosin, and Pb-free processes. No special handling or disposal reportedly required in the majority of applications; is non-flammable and non-volatile. Can be disposed of as ordinary wastewater with few exceptions. For hand-cleaning through automated lines. Comes in 1 gal., 5gal. and larger containers.

Circuit Suds, www.circuitsuds.com

Easyplacer 7.2 is a software upgrade for the CLM/FLX-Series placement systems. Is said to enhance the application range. Was standard on all FLX-Series deliveries after Feb. 1. The package includes Easyplacer version 7.2.0.0, BOX version 7.5.0.0, LIB version 7.2.0.0, and optional CAD version 7.2.0.0. Includes job function, lifetime counter, production time counter, selectable speed or accuracy optimization, 01005 placement with special nozzle, warning message if a local fiducial mark is not found, and more precise placement of MFOV components. BOX 7.5.0.0 includes expanded job function. LIB 7.2.0.0 includes corner marking of palettes, selectable speed or accuracy optimization for each component, free definable rotation speed of a-axis for each component, vacuum activation at pick position, and definable vision window angle for each component in advanced setting.

Essemtec AG, www.essemtec.com