New precision washers and collars for machine and equipment assembly are available, many in configurable dimensions of thickness, ID and OD down to 0.1 mm increments. Materials include 1018 carbon steel, 1045 carbon steel, 2017 aluminum alloy, brass, 304/316/420 stainless steel and 01 low alloy tool steel. Surface treatments are offered for application-specific uses and include black oxide, electroless nickel plating, low temperature black chrome plating and clear anodized. Shapes offered include tapped, flanged, counterbored, countersunk, slotted and screw tapped. A full line of metal collars, pipe collars and spacers are available, as well as a line of resin washers and collars. Resin materials available include polyacetal, MC nylon, Bakelite, ceramics of various types, high heat-resistant laminates, epoxy glass, fluroresin and PPS.

Misumi USA Inc., www.misumiusa.com

A special twin vacuum table, for the FLX2011-MKL placement machine, eases flex board and film substrate handling and reportedly doubles productivity. Has twice the size of the former table and its ends protrude alternately from both sides of the placement machine. Features a pneumatic servo drive said to move easily and without vibration. Has a working area of 31.5 x 23.6".

Essemtec, www.essemtec.com

A single user version of the EMA Component Information Portal that gives engineers access to the Digi-Key part database through Cadence OrCAD Capture CIS is available in two versions: CIP and CIP Enterprise. Both include a Digi-Key interface, a starter CIS database, a Web-based solution, and weekly CIP Webinars.

EMA Design Automation Inc., www.ema-eda.com/CIP

The SP150 printer is a manual or semiautomatic printer with metal or rubber squeegees. Features squeegee lengths of 130 mm, 220 mm, 260 mm, 300 mm or 400 mm. Has an adjustable print pressure force of 4-140 N, programmable printing speeds of 10 to 99 mm/sec, and adjustable separation speed from 1 to 5 mm/s. Print cycle counter records from 0 to 999,999. Has a manual drawer and manual drawer alignment. Reportedly can handle PCBs up to 410 mm x 400 mm, a print table of 460 mm x 520 mm, a maximum printing area of 390 mm x 360 mm, and a substrate height from 1 mm to 4 mm. Provides manual width adjustment, two support bards with lengths of 410 mm, four vacuum fixation pins, 10 support pins, two centering pins with 3 mm diameters, and a Venturi-type vacuum pump. Features XY alignment range of ±3 mm, theta of ±2° and accuracy of ±30 µm. Is said to print maximum frame size of 23" x 23".

Essemtec, www.essemtec.com

The VWP-500 wafer pen is said to accept all of the company’s press-fit wafer tips and an adaptor that accommodates die/SMT handling tips. Available for handling wafer sizes from 2" to 12" in diameter, and for 1/16" ID or 1/8" ID vacuum hoses. Is available as a standalone wafer pen or as a kit with vacuum hose, holder, vacuum source and wafer tip.

Virtual Industries Inc., www.virtual-ii.com

VisualCAM 2006 and GerbTool 15.2 feature version 8.0 ODB++; flip panel; IPC-D-356B support; nearly 200 enhancements and defect fixes; ability to “see through” composite layers, and flying probe test point generation. Choose to export full IPC D-356/A/B (with 099 records for test points) or scaled-back version with test point features only.

Wise Software Solutions Inc., www.wssi.com

Kester 295 No-Clean Flux is free of halides and bromides. Designed for cored solder wire. Tested to conform to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01, with no chlorine and bromine detected. Designed with blend of rosin and proprietary activator system. Reportedly eliminates splattering and the need for cleaning. Residues are non-conductive and non-corrosive. Is available in a variety of alloys, wire diameters and flux percentages. Is classified as type ROLO flux. Can be used for both lead and Pb-free soldering. Recommended solder iron tip temperature: 260°C to 370°C for Sn63Pb37 and 350°C to 400°C for Pb-free SnAgCu alloys.

Kester, www.kester.com

A solder analysis and identification feature has been added to the LeadTracer-RoHS XRF system. Is said to accurately identify all solder alloys within minutes. Performs a solder pot analysis, permitting users to track changes. Addresses potential weak links in production chain, including boards for second-side assembly on a non-continuous line; boards taken off-line for inspection and analysis; reflow boards moving to wave or selective soldering; boards split into two batches because of line shortages; boards moving from production to rework areas; boards held for missing parts or for component recovery; components held in rework areas, and components from placement reject trays.

RMD Instruments LLC, www.rmd-leadtracer.com

SchmartSolder is said to make hand-soldering through-hole components simple. Is loops of solder produced to fit over component leads. Reportedly melts and flows into the hole quickly.
 

SchmartBoard, www.schmartboard.com

The scanner-based FA-Inspector optical inspection system uses a high-res scanner and computer-based image processor to provide image acquisition, fault identification and SPC reporting. Incorporates proprietary optics, custom illumination and AOI Software. Board handling is said to be up to 19" x 24" with area of inspection of 11" x 16" in a single scan. Defect coverage includes SMT and PTH parts down to 0402, part presence/absence verification, part polarity and pin #1 orientation, part position and skew errors, laser marking, wrong part and device differences. Two modes of operation: AOI and Comparator.

FocalSpot Inc., www.focalspot.com