ESD Pro Event Detector is a lightweight handheld device capable of distinguishing various levels of ESD events. Detects and counts discharges and shows relative electrical strength of each event on a bar graph display. Provides a quick measure ESD protection effectiveness. Offers variable settings of discharge alarm thresholds to detect and count only ESD events that exceed the user-set threshold. Provides an audio alarm and a 10-LED bar graph. If the discharge exceeds the set alarm level, the LEDs turn red. The unit’s four-digit counter provides a count of discharges occurring above the set threshold, while disregarding those programmed as insignificant. Can measure multiple consecutive discharges. Waveform analysis algorithm in charge device model mode rejects most non-ESD EMI events.
Revolution x-ray inspection system adds a Quad View facility and dual LCD monitors to enhance viewing capabilities and ease of use. Displays up to four images at once, and can separate x-ray images from the software control for reported clutter-free viewing. Samples can be safely placed within 250 µm of the focal spot, for up to 13000x magnification at all angles over the 400 x 400 mm manipulator scan area.
The SCBL-77G Passageway Gate system is designed for high-volume production. Combines a small footprint passageway station with a vertical buffering station. Is 1500 mm in length and is said to offer a continuous pathway for PCBs to flow. When the gate is requested to be open, the 15-slot vertical buffer is enabled to accept PCBs from the line. The vertical buffer has 15 stacked edge belts, each at 30 mm standard spacing. Spacing is selectable in every slot, every other, every third and every forth slot. Can operate in either LIFO or FIFO modes, in addition to the lift gate function.
Omano OMPCB-23/99 electronic inspection microscope enables continuous 3-D inspection, across the length and breadth of a PCB without the need to constantly check positioning. Features a choice of 7-45X or 6.5-45X zoom stereo microscope body. Includes oblique viewing attachment with integrated 0.3X Barlow lens; enables the operator, with fingertip adjustments, to view PCB vertically as well as from all sides. Features a built-in, rotatable, light mount that will fit most brands of fiber optic illuminators and a large sliding stage that enables quick scans across PCB length and breadth. Weighs 46 lbs.
Omano OM2300/V3 combines the OM2300 7-45X zoom stereo microscope body with a new V3 base. The base is made of solid metal alloys and designed for ergonomic, repetitive inspection and soldering procedures. Measures 12" x 12" with beveled edges for operator comfort and a black/white contrast plate. Options include Omano OM99 6.5-45X microscope body. Weighs 18 lbs.
Trek Model 900 is a diagnostic tool for identifying or investigating suspected ESD incidents. Includes a voltage-sensitive antenna that can be positioned near potential problem areas to monitor ESD events. Detection is conveyed via an audible buzzer and/or a visual color-coded light display that depicts intensity. Is compact, portable and powered by batteries or continuous AC. CE compliant.
The YTX X3 3-D x-ray inspection system is for PCBs with BGAs and other hidden solder joints. Proprietary imaging technology gathers oblique images to construct a 3-D rendering used to identify solder and component-related defects on both single and double-sided boards. Selectively uses 2-D or 3-D to inspect specific regions on a board. Programming is said to be fast and intuitive, with a typical complete inspection program created in fewer than 30 min. Is suited for in- or offline applications and reportedly offers fast throughput and low false calls. Included are remote programming and real-time SPC software.
Press-Fit, Solderless Interconnect Technology permits assembly of a terminal or electrical lead with a plated through-hole to create a solderless electrical connection. Reportedly is fully tested to meet operating requirements, and has passed standard automotive testing requirements for vibration and for temperatures up to 125°C. Material thicknesses for eye-of-the-needle-based press fit designs are 0.64 and 0.80 mm.
The SM400 Series is designed on the SMART platform. Integrated software features a common operating interface, which is said to provide a stable base platform that is scalable and modular with a space-efficient design. Includes flying-vision centering with individual cameras for each spindle. Identifies component centers during travel from the feeder to the placement location. Head is designed for simultaneous component pickup from the SM feeders. The SM411 Dynamic Chip Shooter is said to place at a rate of 42,000 cph with placements accurate to ±50 µm at 3-sigma (Cpk ≤ 1.0). Dual gantry system includes a dual-lane PCB transport with three on-demand production configurations. The SM421 Advanced Flexible Mounter is reportedly capable of handling up to 72 mm SMT connectors. Is said to reach placement speeds up to 21,000 cph with accuracy of ±30 µm at 3-Sigma (Cpk ≤ 1.0). Has optional external side tray handler and intelligent feeder system.
Progressive Energy Dynamics is based on computational fluid dynamics (CFD) modeling to maximize mechanical, thermal and chemical energy in the various functional stages of a cleaner. PED consists of manifolds, nozzles and pumps said to significantly improve residue removal and conveyor speed. Come on AAT’s inline cleaning systems.
The vision centering system offered on the L-Series Pick-and-Place uses features of Cognex machine vision. Bottom, top, on-the-fly, or fly-by centering options are available. Is said to ensure placement of 0201s, µBGAs, and ultra fine pitch QFPs. Customizable.
The Lynx stereo zoom microscope offers magnification up to 120X and a modular design to permit a range of camera and optical accessories. Now comes with 14-point LED ring light with intensity control. An optional oblique viewing accessory permits components to be viewed from a 34º angle, which can then rotate a full 360º to provide easy inspection all the way around a component.