The large-area Photon Vi print platform is designed for integrated manufacturing and process optimization. Delivers flexible substrate image size range from 1.5" x 2.0" up to 24" x 24", a reported 30% increase over the standard platform. Is able to handle board products up to 16.5 lb. and 0.236" thick. Accommodates Instinctiv productivity tools. Has adjustable transport rails and a two-speed board transport control system with software time lag control. Is preconfigured with an upgraded understencil cleaner deploying a 4-stage head, providing cleaning for a 24"wide image using wet, vacuum and dry strokes.

DEK, www.dek.com
 

Instinctiv V9 machine control software now incorporates enhanced control of HawkEye post-print inspection technology, easing paste-on-pad verification. Reportedly provides post-print verification of every board, and operates at line beat rate, delivering go/no-go indication for each board and isolating faulty boards in real-time. Identifies pad exhibiting the lowest paste volume.

DEK, www.dek.com

 

 

V-Works 24 is said to delivers uniform condensation heat transfer to the single component rework environment. Permits use of absolute limits of maximum temperatures and small delta at peak temperatures. Comes with 24" x 24" working envelope, split mirror and camera vision system for aligning components; on-board recipe storage; touch-screen operator interface; manual x, y and z adjustment; vacuum system; bottom-side global preheat; semiautomatic cycle for component removal and replacement; and cool-down function.

R&D Technical Services, www.rdtechnicalservices.com

Expert-SAFP semiautomatic pick-and-place system is for prototype quantities. Has an air-suspended pick-and-place head, integrated vision and placement system, and picks from reels, sticks, rest tape strips and loose components. Includes turning station for upside-down components standard. Comes with dispenser and reflow tool.

Essemtec, www.essemtec.com

 

Enhanced 7^th Generation programmer models 1710, 2710, 2710M, 4710, 4710-M, 3710MK2 and 3710MK2-M feature high-speed USB 2.0 standard bus, to increase communication speeds and reliability. Support devices with densities up to 4 Gb. Replace existing 7^th Generation product line.

BPM Microsystems, www.bpmmicro.com

“Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality,” version v.08 makes recommendations regarding appropriate specifications and fabrication notes on drawings for printed circuit boards, general procedures to qualify PCB shops, and testing procedures to verify quality and reliability. Provides necessary material selection information to supplement IPC-4101 slash sheets. Contains recommended examples of fab notes for SnPb solder assemblies and Pb-free assemblies, for use as general specifications on PCB drawings, a basic questionnaire to supplement to IPC-1710 for qualifying PCB shops, and recommendations for ongoing activities to ensure qualified PCB shops maintain internal quality. 

Engelmaier Associates, engelmaier.com

Friendly Green presaturated wipes are low linting and designed to remove all solder pastes, resins, water-soluble, no-clean, leaded and Pb-free from stencils, screens, misprints and other surfaces. Are said to be effective in cutting through tough, dried solder paste and flux residue. Do not harm stencil construction materials (aluminum frame, stainless steel or polyester screen and stainless steel, brass or nickel metal etched foil). Are saturated with low-toxicity compounds, contain no solvents, and are biodegradable. Meet or exceed current and reasonably anticipated VOC requirements (EPA, AQMD, SCAQMD).

High-Tech Conversions, www.high-techconversions.com

The Flexys-10 intelligent placement system is for low- to medium-volume high-mix production and NPI requirements. Rated at 10,000 cph (IPC-9850: 8,600 cph). Comes with eight new turret positions, an eight-position rotary head with on-the-fly vision. Feeder capacity of 128 x 8 mm tapes and 10 matrix tray locations. Places 0201 to 2.75" sq QFP/BGA. Has a reported accuracy of 0.0014" for QFP/BGA and 0.0035" for chips at 3-Sigma. Accommodates tape, stick or tray feeder types. Options include standalone or in-line conveyors, intelligent belt feeders, barcode reader, glue dispenser, fixed upward vision camera, component test verification and more.

Europlacer, www.europlacer.com

The EL thermal imaging system includes a new camera with a 320 x 240 uncooled detector array with <0.05ËšC sensitivity and 16-bit digital camera link interface. Said to capture and display images at a rate of 30 frames/sec. and provide a resolution of 70 µm.

For use in locating shorts, stressed components and other defects, and analyzing thermal behavior of individual components. Model Board Comparison locates defects by comparing thermal behavior of defective boards to a known good board model.

OptoTherm, Inc., www.optotherm.com

 

Design For Manufacture (DfM) Add-On for Altium Designer is free and factory-certified. Implements Sunstone’s manufacturing capabilities interactively inside Altium Designer. Is said to reduce costs by reducing design errors; reduced time by using existing rule decks instead of user-created versions; and simplify design processes by following a factory-certified rule deck.

Sunstone Circuits, www.sunstone.com/pcb-resources/downloads.aspx.

VarioTap in-system emulation technology integrates JTAG emulation and boundary scan test for real interlaced test operations and multivalent flash in-system programming. Supports in principle all JTAG/IEEE1149.1 compliant µProcessor or µController, independent of scan chain configuration, up to multi-processor or multi-core applications. Adaptive streaming technology reportedly executes emulation tests in a test program parallel or interactively to boundary scan tests.

Goepel Electronic, www.goepel.com

Flexible silicone conformal coating is said to meet IEC 61086-2. Said be fast drying and has passed all coatings tests for assembled PCBs including thermal aging, flexibility, damp heat and salt mist. Visual inspection using ultraviolet light revealed no voids, holes or delamination on samples, and no loss of adhesion or discoloration of copper conductors. A tackiness test reportedly revealed that when a 500g load is applied for 1 min., it remains non-tacky. Has operating temperature ranging from -50Ëš to 125ËšC; is touch dry at 20ËšC in 10 to 15 min. Available in 400 ml aerosol and 5 liter bulk container. Contains no isocyan­ates. Meets V-1 level of the UL approval.
 
Electrolube, www.electrolube.com