The KISS-104F inline fluxer is said to flux only the specific components to be selectively soldered. The board enters on the (SMEMA) edge conveyor, located in a known position, and flux applied via X-Y motion under programmable control. The board proceeds to the next station: the inline preheater module or directly into the KISS-104 for selective soldering. Reportedly will reach all areas of a PCB panel up to 18" x 24". Features standard precision aerosol flux applicator with a deposition range of 4 to 25 mm, and an optional drop-jet applicator with dot size as small as 1.5 mm. Can be configured with multiple applicators to apply mixed flux chemistry. Options include an airless drop jet fluxing system and multiple nozzles. Accepts all conventional flux chemistries.
OptiCon AOI now includes standard inspection of 01005 components and 0.3-mm pitch solder joints. Is achieved with an increase in lens resolution in the camera module. Is said to improve detail recognition for the inspection of the smallest structures. The telecentric lens reportedly offers faultless image recording independent from the components’ position; height extension has been retained. Is enabled by the use of a pixel-adapted lens; design has been adjusted to the pixel geometry of the CCD matrix. A resolution of 10.5µm per pixel is achieved.
New communication software integrates process traceability and a monitoring system with a proprietary reflow oven. Is said to enable quick programming of KIC 24/7 by reading the current Seho oven configuration and set points, as well as automatic download of an optimized recipe. Reportedly prevents errors associated with manual inputs. Alarms can be integrated. Enables automatic loading of the correct 24/7 program once the reflow oven recipe is selected for a new production run with continuous process monitoring. Integrates optional features to the reflow oven line; includes automatic profiling, Cpk charting, process traceability and troubleshooting.
The WT-100-2C XL inline workstation is 1000-mm long and handles PCBs up to 18" x 18". Touts dual 500-mm drives, each with independent variable speed control, front work surface, overhead lighting and a rear parts bin panel. Current modes include check and pass through conveyor with both hand and foot pedals for PCB release. Other optional features include overhead tool trolley, tool balancer, additional parts bin panel on swing arm, eight-outlet power strip, and wire mesh shelf. Included for a limited time are six ESD jumbo-style hanging part bins. Offer 10 ¾" D x 8 ¼" L x 7" H storage and is ESD-safe.
The KY-8030 inline solder paste inspection system is for high-mix/low-volume applications. Incorporates optical and image processing technology and feedback tools. Uses full parametric inspection algorithms. Is said to deliver results based on 100% inspection of every paste deposit. Reportedly programs in fewer than 15 min.
XF3 Pb-free solder paste reportedly accommodates extended reflow profiles without use of nitrogen. Is based on patented SN100C alloy, which reportedly has demonstrated long-term fatigue strength over silver-containing SAC-alloys. Is said to remedy copper migration into tin regions of the solder joint. Wetting on all common metal surfaces is said to be excellent. Prints at 150-200-mm per sec.
System Caston boundary scan software is said to enhance integration with flying probe testers. Enables interaction between flying probe and boundary scan access for board level test applications, embracing IEEE1149.1 applications. Includes management of boundary scan and non-boundary scan components and automatic test program generation, using automatic pin fault diagnostic, graphical fault localization, and debugging. Has new control algorithm. Detected faults are diagnosed after test execution by means of intelligent pin fault diagnostic processors. Includes ScanAssist multi-mode debugger.
NC162 is a third-generation liquid flux for use with high-activity, halide-free no-clean alloys, especially in palletized processes. Is said to work well with SN100C alloy, and for soldering through-hole and mixed-technology assemblies. Benefits include halide-free, Pb-free compatible, low post-process residues and activity to promote hole fill. Is said to become more robust in high-temperature applications. Can be sprayed, foamed or dipped.
ESD antistatic wrist straps are adjustable and comfort-stretch. Offer a 1 MΩ resistor and a choice of a 6 or 12' coil cord and 1/4 or 3/8" snap.
ESD antistatic heel straps attach to shoes and provide a large contact surface. Width of grounding area is said to provide good floor contact.
ESD antistatic three-layer vinyl floor and table mats are used to assist in ESD protection. Use a three-layer construction consisting of conductive metalized fleece sandwiched between a vinyl top surface and a foam bottom layer. Two-layer rubber floor matting is comprised of a top antistatic layer and a conductive bottom layer to provide a high-temperature static dissipative surface.
ESD nylon gloves are static dissipative with cleanroom quality. Are breathable with conductive fibers running through the glove. Six dozen gloves per case.
ESD FCS-F6R static dissipative finger cots are available in S, M, L and XL. Are spore black, powder-free and come rolled or unrolled, with 720 pieces per bag.
Vision5 ESD cleanroom laundered wipes feature conductive fibers knitted with continuous filament polyester for low lint properties. Are said to be abrasion resistant, low in nonvolatile residue and ionic levels, individually inspected and double-bagged in cleanroom bags.
ESD static shielding bags are non-corrosive and feature high seam strength. Reportedly provide low surface resistivity and are available in numerous sizes and thicknesses. Static and/or moisture barrier types of bags are available.
ESD swabs are safe for static-sensitive surfaces. Are said to be absorbent and low in particulates. Four types are available with 50 swabs per bag: A1806-PF features an overall handle length of 6" with an antistatic polyolefin handle and an antistatic foam head. Head width is 3/16" and length is 11/16"; A1806-WCF features a handle length of 6" with a wooden handle and an antistatic foam over a regular cotton tip head. Head width is 3/8" and length is 1"; A1806 WF features a handle length of 6" with a wooden handle and an antistatic foam head. Head width is 3/16" and length is 13/16"; A1805-PF RECT features a handle length of 5 1/8" with an antistatic polyolefin handle and a rectangular antistatic foam head. Head width is 11/16" and length is 11/16".
ESD brush bristles are made from conductive fibers mixed with natural hair. Handles are made from static dissipative plastic. Will not create a charge. Available in three bristle types: hard, semi-fine and fine.
The S3X48 Series halide-free no-clean solder pastes from Koki Company Ltd. are said to demonstrate excellent performance across a wide range of Pb-free processing applications. Developed originally for fine-pitch BGA and CSP applications. Perform well at high reflow temperatures; rapid wetting of commonly used Pb-free alloys. Have a wide process window and six-month shelf life. Are said to eliminate “pillow” defects on BGA and CSP devices.
The ShareGen SPA 1000 solder paste analyzer provides testing to help control and manage solder paste in the production process. Is said to help reduce defects, including missing components, tombstoning, component misalignment and non-wetting. Is a 6-in-1 solder paste test system that reportedly can perform up to six separate tests that previously would have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. Can be used to conduct solder paste "open time" testing.
The OUC-500 wave unload flat belt conveyor now has three banks of cooling fans. Unloads and cools PCBs exiting the wave soldering process machine. Is variable speed controlled. Has 500-mm wide flat belt and is said to be capable of handling PCBs up to 17.7" in width. Open framing system can be adjusted to meet most wave exit and off-load heights. Three fans per bank (nine fans total) provide cooling for higher temperature Pb-free products.