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A free, multi-part series of application notes explains how to control Linux-based PCB test systems. Cover the basics of using Linux in test systems; using Linux to control LXI instruments through VXI-11; using Linux to control LXI instruments through TCP communication; using Linux to control USB instruments, and using Linux in soft real-time applications.
 
Agilent Technologies, www.agilent.com/find/linux; www.agilent.com/find/sdg_signup
 
DataMan 100V verifiers are said to check the quality of Data Matrix codes to ensure only well marked parts enter the manufacturing and supply chains. Are reportedly easy to use and include automatic report generation; meet MIL-STD compliance applications. Measure label and direct part mark quality to industry standards, including ISO15415 and AS9132.

Cognex Corporation, www.cognex.com 
The X2.5 is a high-speed x-ray system with programmable angle shot capability. Is said to be suitable for automatic solder joint inspection of double-sided PCBs with high throughput. Includes variable angle control from 0° to 45°; enables automatic inspection of bump solder joints (BGA hardball) or filling level checking of PTH/THT solder joints for connectors. Uses slice-filter technology for hidden or overlapped joints. Uses wide beam x-ray source with a radiation cone of up to 100°. Is said to have a minimal x-ray focal spot of 5 µm. Uses CMOS flat panel technology with a pixel resolution of up to 25 µm; object resolutions of 5 to 10 µm. The linear drive table can position the object with an accuracy of up to < +/- 5 µm and max accelerations of up to 1G; achieves test speeds up to 4 x-ray images/sec., including input and processing.
 
MatriX Technologies, www.m-xt.com
The Verifier H Series horizontal beam x-ray inspection system is for industrial, automotive and medical applications. Provides assessment and defect detection of components and assemblies such as inkjet cartridges, automotive sensors, castings, electronics modules and electromechanical devices, and medical assemblies. The four-axis, 360° sample manipulator reportedly provides unlimited viewpoints. Is offered in configurations of 75kV (FSX-H75) for general-purpose applications or 90kV (FSX-H90) for applications requiring additional power. Comes standard with a PC-based VIP image processor.
 
FocalSpot Inc., www.focalspot.com
The Spectrum S-920 series of scalable dispensing features software and hardware control based on Fluidmove XP software with process control features. Rapid response heater system reportedly minimizes startup time and delivers uniform heat across entire part surface. Controlled process heat software can be added. Includes programmable fluid and valve pressure, mass flow control, calibrated process jetting, and a digital vision system. Can be configured with single or dual lanes, and one to three heat stations. Platform can be upgraded and configured to meet dispensing requirements. Uses noncontact jetting technology for applications such as stacked die underfill, chip scale package underfill, and UV gaskets for LCDs. Reportedly dispenses into 200 µm gaps; offers dispensing with flow rates up to 500 mg/sec. and shot rates up to 200 dots/sec. Footprint is 600 x 1321 mm with a single heat station, 850 mm x 1321 mm for two heat stations, and 1100 x 1321 mm for three.
 
Asymtek, www.asymtek.com
Hysol PC62 toluene-free conformal coating is based on the Hysol PC52 platform; is a one-component solvent-based acrylic conformal coating. Is reportedly quick drying. Designed for harsh environments, particularly automotive, military, aerospace, industrial and consumer avionics applications. Is compliant with UL746 and IPC-CC-830 requirements; is suited to application with non-atomized selective spray coating equipment.
 
Henkel, www.henkel.com/electronics
The Quadris-3 quad-gantry model achieves a reported maximum throughput of 95,000 cph by maximizing SW sequences and minimizing delay times between motion sequences. Uses the same software and hardware as the Quadris-S, but with improved ease of use and maintenance. Handles components from 0201 to 44 x 44 mm, in tape and tray feeders including dual-track feeders. Transparent acryl cover on the top and side enhances visibility.

Universal Instruments , www.uic.com
The ShareGen SPA 1000 Solder Paste Analyzer provides testing to control and manage solder paste in the production process. Is said to reduce a range of defects, including missing components, tombstoning, component misalignment, and non-wetting. Reportedly can perform up to six separate tests. Can be used to conduct solder paste open time testing.
 
Ascentech LLC, www.ascentechllc.com
The System 855A benchtop rework station’s profiling adjustments include push-button settings for temperature, airflow volume and duration. Unit proceeds automatically through three preheating zones and two reflow zones before auto shutoff. Up to 10 profiles can be stored in the memory. Has temperature range of up to 350°C. Includes external thermocouple on the PCB and an adjustable ceramic underheater. The production cycle begins as a heating nozzle is attached to the head, and then z-lowered onto the component. When reflow is complete, the head is automatically lifted, as solder residue is cleared.

Manncorp, http://www.manncorp.com/specialty-soldering-equipment/855-solder-rework-station/ 
Loctite 3508 cornerbond underfill material for BGA and CSP devices is a one-component epoxy that is pre-applied to the board at the corners of the CSP pad site using a standard dispensing system. Can be applied inline with existing capital equipment, with curing during the solder reflow process. Is Pb-free compatible and permits rework. Has a pot life greater than 30 days. 
 
Henkel Corporation, www.henkel.com/electronics
Siplace X4i placement machine is said to have a speed rating of 102,000 cph per IPC-9850, and a maximum theoretical performance rating of 135,500 cph. Features a dual conveyor, in which each of the two heads populates one board independently of the other, shortening travel between feeders and PCB. A third transport track moves PCBs through the machine to be processed in parallel on another machine. Another feature pushes two boards together on a single track and processes them as a single board.

Siemens, www.siplace.com
Indium8.9 no-clean Pb-free solder paste reflows in air and is said to be probe testable, low voiding at via-in-pad and in BGAs/CSPs, and easy to print and wet. Formulated to produce consistent print volumes even through stencil apertures below 0.66 ratios. Voiding reportedly in 5% range over many profiles when soldering BGAs with via-in-pad.

Indium Corp. of America, www.indium.com

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