BC-60 and BC-100 conveyors have 3-mm wide ESD edge belts and handle PCBs up to 18" wide. Features include variable speed control, front ESD work surface with grounding strap (green or royal blue mats available), Inspect and Pass mode selection with hand and foot pedal for PCB release, and PLC. BC 60 is 600 mm long with a single drive; BC 100 comes with single 1M drive or two 500 mm drives.
Siplace X4i reportedly has a placement speed of more than 100,000 cph. Comes standard with a flexible dual-lane conveyor and four 20-nozzle heads. In dual-lane mode, it is said to achieve placement of 110,000 cph for board sizes up to 250 mm x 380 mm. Larger boards up to 436 mm x 380 mm can be processed when running in single conveyor mode. Has a footprint of 8 ft². Is designed to shorten gantry travel distance between feeders and board. A productivity lane enables parallel mode.
This solder delivery and inert atmosphere control system features a
flow monitor that uses nitrogen pressure levels to indicate the level of solder
in the solder pot, and a heated nitrogen path. Is said to provide accurate
solder pot capacity information. Replaces mechanical probes. Has a method to
‘super-heat’ the nitrogen supply. Reportedly enhances flowed solder
performance.
The Ribbon Spreader Tip is designed to apply a flat 1"
or 1.5" bead of adhesive. Snaps on the end of a static mixer. Is said to
be ideal for any application where a wide, flat ribbon of adhesive is
preferable to a bead shape.
The CR6000 forced hot air Pb-free reflow
system is 12.5' long, computer-controlled, and has six individually managed
upper and lower heat zones. Is said to have large-oven capabilities including a
DT of ±2ºC edge-to-edge heating conformity integrated with a 3-channel
profiler, and a motor-adjustable 17.7" pin conveyor over a 22.4"
stainless steel mesh belt. Has an automatic oiler and an enhanced flux
management system. Includes removable panels. The base unit includes a PCB air
cooler. Optional water-to-air cooling is available, as is nitrogen atmosphere.
Includes 5, 8 and 10-zone models.
Multicore DA100 is a dispensing grade die attach solder paste. Is said to offer thermal management, while providing ease of removal during cleaning. Is comprised of high lead solder with a liquidus/solidus range of 278°C to 305°C; has been optimized for higher temperature processes, typically in excess of 350°C. Has been designed so that the flux residues are easily cleaned with various solvents. Reportedly no incompatibility issues with flux residues and mold compounds. Is said to maintain integrity of copper leadframe. Has been developed to provide low voids, averaging less than 5%.
The Trident Automatic Defluxing and Cleanliness Testing System E-Learning presentation is 17 minutes and covers control and cleaning technology; cleanliness testing and drying technology; discharge configurations; throughput configurations and general features. The presentation can be viewed, paused and navigated at any time.
The M1 AOI offers 3 MP resolution, telecentric optics and proprietary lighting, for inspecting bond wires, die placement, SMT components and substrates. Footprint is smaller than 1 sq. meter. Works in- or offline. Options include magazine loader and unloader, top and bottom laser and ink markers, and remote location recipe development. Uses a standard SMT package library to simplify training and portability.
“How to Optimize Your Assembly Operations” is a free, 12-page guide comparing synchronous and non-synchronous flexible assembly conveyors, complete with supporting illustrations and charts. Includes a detailed diagram of a non-synchronous pallet-based modular conveyor with callouts of all major components. Features tips on when to consider modular conveyors, and a listing of benefits of modularity, including phased implementation; integration of automated processes; line balance flexibility; integration of test functions; implementation of process controls; material flow options; reduced work-in-progress; improved ergonomics; reduced footprint and reusability. Also offers illustrations of how the modular conveyor line can be reconfigured or expanded over time, as well as system configurations.
Siplace Fast System Recovery v. 1.0 software ensures line computers can be made operational again after such problems as hard drive disk errors and accidental file deletions. Creates fast and highly configurable data backups on local media or servers over the Siplace network. Provides reliable data restoration by identifying the data’s source and target locations. Backs up specific directories and files or the entire hard disk in the form of an image. This backup can be written to a local USB stick or DVD writer, or to a central server on the Siplace network. Is administrator-controllable.
System 120 benchtop wave solder system is for single-point or single-edge soldering and removal of ICs, including DIPs, QFPs, PGAs, connectors and odd forms. Is said to be ideal for short runs requiring selective soldering of single components. Has adjustable temperature range to 399ºC. Is for Pb-free or SnPb processing. Includes three processing nozzles.
The SL101 RoHS-compliant CE mark digital dispenser is said to be a self-teach bench-top dispenser with 10 memory locations to automatically cycle 10 self-taught programs. Other operation modes include manual-mode, enabling a dispense operation controlled by a foot-pedal, and timed-mode that will dispense at a preset time. Is programmed with touch sensitive controls, with dispense periods from 0.01 – 9999 sec. Available in 110V and 220V versions. Air input is 70 – 100 psi (5 -7 bar). Dispense output air pressure can be programmed from 1 – 100 psi. Includes adjustable suck-back feature.