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Surveyor monitors the thermal performance of a reflow oven every hour, day and shift. Features include SPC analysis and out-of-tolerance condition identification. Is said to eliminate the need for test boards, while simplifying profiling. Consists of fixed sensors that reportedly eliminate variables associated with thermocouple attachment, an adjustable frame that rides on the oven’s rail or mesh belt, and new surveyor software that automatically stores profiles.
 
Datapaq, www.datapaq.com
 
CmController5 Compact measurement and analysis tool is designed as a universal measuring and analysis tool for SMT production. Includes a complete measurement system with measurement software for vision and statistical analysis. Helps analyze production process with error rate reduction. Offers a third-party independent method and validation for ISO, IPC and automotive standards. Weighs approx. 130 kg. Can be equipped with a wheel lift system.

CeTaQ, www.cetaq-americas.com
 
The SCBL-99 15 Vertical Buffer station has new software, including a hold and release timer function and system status monitoring menu. Is said to permit selection of a desired minimum buffer time before release. Is a 15-slot vertical buffer designed to control line flow. Can handle PCBs up to 18" in width and 20" in length. Current modes of operation include LIFO, FIFO or PASS through conveyor. Has all-belt buffer design. Monitoring screen shows current status of the station.

Promation, www.Pro-mation-Inc.com

The KE-2060 light high-speed flexible mounter (limited edition) comes with a quadruple placement head with laser alignment, one high-precision placement head, and vision and laser alignment. Is rated per IPC-9850 at 12,500 cph (laser alignment) and 1,750 cph (vision centering). Handles components ranging from 0201 to 75 x 75 mm or 50 x 150 mm, and up to 12 mm in height. Placement accuracy is ± 30 µm @3 Sigma using vision centering and  ± 50 µm @3 Sigma using laser alignment. Options include exchangeable feeder trolleys, a high-precision camera for µBGA and 0.3 mm pitch BGAs, and TR-6 matrix tray changer.

Juki Automation Systems, www.jas-smt.com

 
The iPAG integrated paste and glue dispenser module is production ready and can be integrated within EKRA's high-end printers. Comes with single or double heads, permitting glue, solder paste or both to be applied to substrates after printing.
 
The SonoDry 1000 spray drying system has a nonclogging ultrasonic spray nozzle. Is said to be suitable for aqueous/aqueous and solvents/solvents feeds. Features an ambient drying temperature of 250°C, accuracy of ±1°C (steps of 0.1°C through PLC) and an air heater capacity of 1.8 kW. Has a blower capacity of 120 Nm3/hr.; 0-250 mm of water column vacuum and a feed pump capacity of 1600 ml/hr. with a 2 mm ID tube controlled through PLC. Weighs 90 kg; is portable on wheels and has dimensions of 650 x 1625 x 55 mm. Three models are available: SonoDry 750 Twin Cyclone Table Top System, with a water evaporation rate up to 750 ml/hr; SonoDry 1000 Twin Cyclone Mobile Stand-Alone System, with water evaporation rate up to 1000 ml/hr; SonoDry 1500 Advanced Twin Cyclone Mobile Stand-Alone System, with water evaporation rate up to 1500 ml/hr. Sizes range from small tabletop R&D systems to advanced floor models.
 
Sono-Tek Corp., www.sono-tek.com  
 
 
The Slice-Filter-Technique is for double-sided PCB solder joints inspection. Complete object information is included. Is based on an image-processing algorithm that separates image data of the printed sides. Uses pattern matching methods for solder joints and components. Is for prototypes and small batch production. Can test and verify the complete batch or complete series of the product type for the upper side and bottom part. Comes on all MatriX X2 and X 2.5 series models; is offered as upgrade package for the previous MX model. Designed for an inspection area of up to 460 x 350 mm and a variable inspection window of 10 x 10 mm to 30 x 30 mm. Reported resolution to below 5 µm; inspection time is 4 images/sec.
 
MatriX Technologies, www.m-xt.com
 
The Firefly laser-based selective soldering system includes a new automatic development environment said to reduce program time. Improved algorithms and faster loop control reportedly enable automatic management of PCB characteristics and environmental factors. X-Y-Z control of the laser head enables control of the position of the laser beam, rotating it 180° around the pin or joint to be soldered.

Seica S.p.A, www.seica.com 
 
Reztore hand lotion is a clean, unscented formula in an 8 oz. squeeze bottle. Contains no fragrance or dyes. Is said to contain no silicone or other chemicals that may contaminate and cause solderability problems and corrosion of electronic components. ESD-dissipative formula. Will not insulate skin. Reportedly helps provide reliable path-to-ground when using proper grounding devices such as wrist straps or gloves. Helps lower skin electrical resistance. Contains vitamins A, D, E and aloe vera. Surface resistance is 106 ohms.

Menda, www.mendapump.com
 
PicoDot Jet dispensing system deposits controlled amounts of fluid on hard-to-access areas, uneven surfaces, or in applications where a conventional dispensing needle cannot be used. Does not contact substrate. Speeds up to 150 dots per sec. Multiple configurations make it possible to dispense a variety of low, medium and high viscosity fluids. Capabilities include noncontact jetting, including 3-D substrates; covering areas with droplet arrays, with shot size starting at 0.002 µl (2 nl) to flow rates up to 300 g/min. (10 oz./min.); optional precision needle adapter; integrated heater.

EFD Inc., www.efd-inc.com
 
 
This 27-gauge tapered dispensing tip applies small, precise amounts of silicones, epoxies, lubricants and other thick assembly fluids. Designed for use with air-powered dispensing equipment; will produce dots and lines as small 0.008" wide. Is reportedly the smallest tapered dispensing tip available. Is silicone-free and molded from clear polyethylene. Is said to provide faster flow than straight dispensing needles when using thick or particle-filled materials. Features SafetyLok threads.
 
EFD Inc., www.efd-inc.com

The FP-1MAS-2 adjustable flatpack former and cutter is designed to form and cut leads to a surface mount reflow configuration with adjustability for body-to-bend, standoff height, and foot length with no tooling changes. Is said to permit various radii and lead thicknesses. Has a shuttle mechanism for transporting the component from form stage to cut stage. Die is designed to process one side of leads at a time. Adjustments are made via digital micrometers. A removable nest for component loading is included.

Manix Manufacturing Inc., www.manixmfg.com

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