TechniShield is a plating process for individual shielding of active components. Offers direct plating to the molding compound; is said to create nonporous deposit that eliminates the need for metal caps or lids. Uses novel chemistry to roughen and plate the epoxy molding compound. Is chrome-free. Reportedly maintains excellent adhesion through multiple reflows and produces a pore-free surface.
2200-545 Series adjustable stroke mix-dispense valves are designed for controlled flow of 2-component adhesives and sealants, such as silicones, epoxies, urethanes and acrylics. Are based on the No-Drip valve body design for fluid control, featuring the integration of carbide ball-end needles and carbide seats. The adjustable stroke feature permits the operator to fine-tune the flow rate by rotating the threaded stem on the back of the valve. The valve is also available with an eyelet stem for attaching to a tool balance. Are 2.25" in diameter by 5.5" long, and are rated for 3,500 psi (240 bar). Double air actuated with two 1/8 NPT ports for a 4-way pneumatic valve connections. Body has two 1/4 NPT fluid inlet ports for Part A and B materials and accepts a wide variety of motionless mixers; has two screw holes and two dowel holes.
Bondjet BJ820 automatic wedge bonder, for round wire and deep access ribbon and wire bonding, is said to handle fine-pitch applications on a single platform, including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive – using aluminum or gold wire or ribbon. Reportedly has speeds up to 7 wires/sec. Axis repeatability of 1 μm at a balanced encoder resolution of 20 nm. A 12" x 16.1" work area can serve as two or more smaller stations. Capabilities include 12.5 to 85 μm diameter wire bonding; ribbon bonding from 6 x 35 μm to 25 x 250 μm; constant loop height and wire length; parallel loops within mixed reference system; auto teach for linear applications. Has a footprint of 720 x 1250 mm.
Conap Conathane EN-3010 is a filled two-component polyurethane potting compound. Is UL94 V-O recognized and RoHS compliant. Is flexible and is said to have a fast cure rate and low viscosity. Reportedly exhibits mix of 70 Shore A hardness, 100% modulus of 668 psi, and 139% elongation; has processing properties of 2,400 cps mixed viscosity at 25° C, 2:1 volumetric mix ratio, fast gellation, excellent storage stability, and a non-abrasive filler. Is suited for aerospace, automotive, computer, and defense SMT applications.
The Amkor 15 mmm Dummy PoP comes in a 0.65 mm pitch with a 160 I/O top and a 0.5 mm pitch, 605 I/O bottom. Is for PSvfBGA. Is the mechanical equivalent of a live component used only when physical properties are required.
Select Technomelt hot melt adhesives are offered in finger-sized, ready-to-use packets. Load directly into the dispensing tank; the dry outer casing melts with the adhesive. Designed to replace sticky cavity packaging and plastic waste. Are available in 28 lb. boxes. Available in ethylene-vinyl-acetate, polyolefin and pressure sensitive technologies. Are used to manufacture filters, packaging, pressure sensitive adhesive films, insulation, textiles, vehicles, and structures.
The ‘First-Time-Right’ NPI Stencils Initiative for the Alpha product line is said to reduce NPI cycle times. Provides design recommendations for accurate paste volumes and locations; automated application of preprogrammed customer and OEM/product-specific design rules; means to apply a single set of design rules across multiple sites; PCB scaling service that optimizes stencils to better correct for board stretch; regular monitoring and control of the positional accuracy of lasers; stepped stencils and aperture designs to permit single stencils designed for range of deposit volumes.
Indium9.32 Die-Attach Solder Paste is a halogen-free, no-clean, die-attach solder paste. Is used in high-volume manufacturing for Pb-free die-attach applications. Is said to exhibit low voiding (<5% total voiding achievable in most instances), as well as ultra-low residue.
K7000 circular linear blade depanelizer singulates pre-scored PCBs with tight component spacing. The linear blade is 12" long and has a 0.030" thin symmetrical cutting edge. The circular blade is 3.8" in diameter and has the same cutting edge profile as the linear blade. This blade is mounted on a shaft with the center line passing through the middle of the support bearing. For singulating panels with components such as BGA sockets that encroach on the edge of the board. Unit weighs less than 30 lbs.
An updated Model 5500 Benchtop Stencil Printer reportedly provides vertical separation of the stencil from the PCB prior to the lifting of the stencil frame. Includes tooling for double-sided boards and dual squeegees mounted to linear slide bearings for side-to-side squeegee motion. Includes squeegees with stainless steel blades and rubber blades. Self-locking dial adjustments permit X, Y, Z, and R axis settings. Maximum print area is 500 x 550 mm, and maximum frame size is 600 x 600 mm. Net weight of approximately 165 lbs.
These electrostatic dissipative workstations are certified to meet specific electrical property requirements; said to ensure static dissipation at a safe rate. Pedestals and workbench components can be protected by static dissipative powder-coat finishes available in three standard colors. Feature work surfaces and shelves with static dissipative plastic laminate; have ground bolts with a 12' grounding cord. Can be configured in a variety of heights and lengths, with cabinet pedestals and/or legs.
The X3 3-D x-ray system inspects PCBs with BGAs and other hidden solder joints. Gathers multiple oblique images to construct a rendering used in identifying solder and component-related defects on both single and double-sided boards. Selectively uses 2-D or 3-D to inspect specific regions. Permits discrimination between top and bottom sides of boards. A typical inspection program is said to be created in fewer than 45 min. Reportedly is suited for inline or offline applications. Has remote programming and real-time SPC software.