KD-2077 is a high-speed dispensing system that features three standard dispensing heads for a rate of 0.1 sec/shot. Provides automatic syringe pressure compensation, dot size confirmation, low adhesive warning and independent temperature control for each head. Features up to four adhesive dots per dispense cycle. Supports a range of components from 0603 chips to aluminum electrolytic capacitors, SOPs and QFPs. Is compatible with Chinese RoHS and is backward compatible with KD-775 dispenser.

Juki Corp., www.jas-smt.com

The MC-12 pick-and-place is said to pack up to 120 feeders into a 1.25 m x 1.44 m machine. Has a top speed of 36k components per hr. Offers board size support of 510 x 460 mm, component side-view camera, and a complete set of software options. Has 12 mm high-performance electrical intelligent feeder platform. Feeder indexing is controlled using advanced servo controls. Includes self-correcting pickup. Recognition system deploys a moving scan camera; measures the components in X and Y directions and from the side. Reportedly can achieve 72k components per hr. in 2.5 m. Comes with two 60-position feeder bars, with a feeder exchange system and a built-in tape cutter as options. Accepts components from 01005 up to 20 mm x 20 mm; is said to place chips with 50µm accuracy at 3 sigma.

Assembléon, www.assembleon.com

The VK-9700 Color 3D Laser Scanning Confocal Microscope has the capabilities of SEMs and non-contact profilometry. Features are said to include 18,000x magnification and 0.001 µm precision. Performs surface profile, roughness, 3D and comparative measurements. 3D display works with the virtual trackball method and a computer mouse to control viewing angle, lighting angle, zoom level and Z-axis height. 3D images can be illuminated with pseudo-light. VK-Viewer, VK-Analyzer and VK-Assembler are available software programs. An optional adjustable stand permits measurement of objects up to 3.94". Larger stages for wafers up to 11.81", electric stages for automatic image assembly, and a separate measuring head are available.

Keyence Corp. of America, www.keyence.com

Laser cut stencils are said to deliver aperture definition and superior dimensional tolerances for pitch apertures down to 0.016". On a 600 x 600 mm area, it reportedly is possible to cut features with an aperture of ±9 µm and a positional tolerance of ±12.5 µm. Permits cutting of circular pads with a diameter of 30 to 800 µm. The LPKF MultiCut is designed for the best possible metal stencil cutting quality; permits minimum apertures of 40 µm diameter.

Fine Line Stencil, www.finelinestencil.com

The free V7.01 IPC-7351 Land Pattern Calculator is said to generate results that match the LP Viewer library documentation. Component families that have been added: aluminum electrolytic capacitors; 2-pin crystals, and land grid arrays. Is a scaled-down version of the LP Wizard. Calculates CAD library parts that comply with the latest IPC-7351 revision.

PCB Matrix Corp.,

http://www.pcblibraries.com/news/templates/news.asp?articleid=51&zoneid=3

Nonlinear vector network analyzer is for the PNA-X microwave network analyzer. Features nonlinear component characterization, nonlinear scattering X-parameters, and nonlinear pulse envelope domain capabilities. Can measure the calibrated amplitude and cross-frequency relative phase of measured spectra from 10 MHz to 26.5 GHz. Component characterization is enabled by measuring and displaying both the amplitude and phase of the full spectra in the PNA-X network analyzer. Data can be displayed in time, frequency, power or user-defined custom domains.

Agilent Technologies Inc., www.agilent.com/find/nvna

The Reprint R23 Semi Automatic Screen Printer is designed to take stencil sizes up to a max. of 23". Has Windows-based interface. Large pad areas, BGAs and 01005 pad sizes are said to be easily handled. Features include 23" standard frame; closed loop servo motion control; dual squeegee print carriage; vertical motion profile for stencil/PCB separation; interlocks incorporated for safe operation; twin camera vision system for ultra-fine pitch printing; Mylar alignment aid, and a 17" LCD TFT flat screen monitor.

Eco-Plus S03X7C-56M Pb-free wire is said to reduce or eliminate flux splatter, joint overheating and solder tip erosion and carbonization, while also improving wetting and solder joint strength. Reportedly reduces tip consumption caused by traditional Pb-free wires.

Adtool Corp., www.adtool.ca

Solder cup headers and mating socket connectors terminate discrete wires into a pluggable interconnect. Are said to provide a pluggable, reliable path between your wired applications. Are manufactured using precision-machined brass alloy and beryllium copper contact clips; assembled in high-temperature thermoplastic. Reportedly offer a gas-tight connection when mated with solder cup header pins. Are pre-aligned in the connectors. Are available in single and double rows up to 64 pins.

Mill-Max, www.mill-max.com