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Hysol FF6000 reflow-cured encapsulant material combines flux functionality and underfill protection. Is formulated to provide flux for Pb-free solder joint formation. When cured, reportedly delivers protection against mechanical stress. Bottom-side spheres are dipped prior to component placement; device is placed onto PCB or substrate, and then travels through reflow. Flux provides action necessary for solder joint formation, and the epoxy encapsulates each solder sphere. Is said to eliminate the need for dispensing equipment and the time required for underfill application and cure. Is suited for package-on-package device configurations and large BGAs and CSPs.
 
Elpeguard SL 1307 FLZ series conformal coatings are 1-pack fast-drying polyacrylic resins for yellowing resistance. Cured ink film can be soldered through at soldering iron temperature; can be removed by means of the product-specific thinner. The colorless fluorescent adjustments are approved as permanent coatings per UL 94; meet requirements of IPC-CC-830B.
 
The Twin-cure DSL 1600 E-FLZ series has low viscosity thick-film lacquers. Offers corrosion protection. Meets requirements of UL 94 and IPC-CC-830B. Has short processing times. Thin protective coats of around 80 µm can be realized.
 
The yellowing-stable white-opaque photoimageable solder resist Elpemer SD 2491 SM-TSW and corresponding marking ink Elpemer SD 2691 TSW are applied by screen printing and developed in aqueous-alkaline media. The latter corresponds to the flame class V-0 according to UL 94, meets requirements of IPC-SM-840D and is halogen-free per JPCA-ES01-2003/IEC 61249-2-21.
 
Wepuran casting compound VU 4490/31 K is based on polyurethane resin and is yellowing-resistant. The smooth white surface gives a high-grade finish. Is said to be easy to process in mixing and dispensing equipment; can be processed by hand despite short pot life. Is said to be fast curing. After slight heating to 40°C, the potting can be removed from its mould after 10 min.
 
Lackwerke Peters, www.peters.de
vPlan version 1.2 introduces features intended to enhance the ability to transfer production between lines and factories, even when CAD and AVL data are not available. Reportedly can create efficient manufacturing process definitions, even when incoming data are of poor intelligence-level. Adds coverage for additional machine models. New features include re-optimization of legacy NC programs; the ability to import existing machine programs; re-engineering of Gerber data; extraction of footprint data and component list from Gerber; enhanced ability to align CPL data with Gerber data; bottom-up auto generation; alternate IPN Support; moving BoMs from one line to another and moving parts data automatically; standard workflows; 10,000 vShapes added to built-in shape library.
 
Valor Computerized Systems Ltd., www.valor.com
iMentor is a Web-based training and support system that incorporates step-by-step guidance supported by screen shots. Can set up programs while navigating through easy-to-follow instructions. A search feature enables users to input keywords to find corresponding articles from the online manual. Acts as a portal to the latest product and company information. Front page instantly alerts users about new software releases and MainStampLibrary updates. Can be used offline.
 
Marantz Business Electronics, www.escapethegreyworld.com
The S3088-II high-speed AOI system includes Viscom 8M sensor technology and an EasyPro3D user interface. Offers inspection of assemblies on PCBs up to 450 x 350 mm. On-demand high-res enables a resolution of 11.7 or 23.4 µm/pixel at the same image size to be chosen for each analysis. Can inspect components as small as 01005. Offers color evaluation as standard. Operator interface comes with automatic parameter optimization and a comprehensive LIB2007 inspection library. Library contains more than 1,600 component types.
 
Viscom Inc., www.viscom.com
EZReball solder ball preform is said to simplify the reballing process. Permits reliable replacement of solder balls on a BGA device. Alignment is reportedly simple with the edges being “squared up” with the sides of the package; is said to eliminate the need for custom frames or fixtures. Adhesive holds balls firmly in place until after reflow. After reflow, the stencil is peeled off. Comes in packages of 15. Stencils are custom made, including SnPb and Pb-free alloys.
 
BEST Inc., www.solder.net
EnviroMark 923 is a halogen-free, Pb-free and no-clean paste. Is said to have excellent wetting, low voiding and soft pin probeable residues. Reportedly has consistent solder paste volume deposits regardless of idle time, stencil life and print speed. Offers 0201 print and reflow capabilities with standard Type 3 powder. Capable up to 200 mm/sec print speed and bridge resistant.
 
Kester Inc., www.kester.com
EnviroMark 828 is a Pb-free water-soluble paste with ultra low BGA voiding. Is said to create no foam in inline washers and has excellent solderability. Has non-slumping chemistry.
Kester Inc., www.kester.com

The DXBG bench dispenser is for two-component reactive resins of a variety of ratios. Permits A and B components of flowable adhesives to be gravity-fed from separate, refillable two-gal. containers. Components are forced by metering rods directly into a disposable static mixer. Comes with a foot pedal actuator. Permits hands-free operation. Stand is adjustable over three axes.

Mixpac Equipment Inc., www.mixpacequipment.com

MPM 125 screen printer is for low-to-medium volume applications. Reportedly features ±12.5 µm accuracy at Six-Sigma, with Cpk ≥ 2.0. Includes CANOpen motion control architecture, benchmarking software and Windows XP, and setup Wizards for ease of use.
 
Speedline Technologies, www.speedlinetech.com 
 
 
High retention Type A and B USB interfaces (USBR Series) are said to comply with the Class 1, DIV II minimum withdrawal requirement of 15 Newtons. These connectors have an orange color-coded insulator to differentiate them from standard withdrawal force connectors. Are available in surface mount and through-hole designs with a choice of standard right angle or vertical top-entry orientation.

Samtec, www.samtec.com

 
 
A scaled-down version of the MK-II, the Advantage 16e, was designed to counteract any penetration by smaller knockoffs of the MK-II in Asia. Is said to be stripped down for buyers looking for lower cost system. Is about ¼ the size of MK-II and includes fewer operational controls, including recordkeeping. Includes vacuum pump, booster blower and unitary chassis design. Includes 16 level, horizontal planar electrode configuration (24" W x 18" D x 1.25" spacing), 1,000W 13.56 MHz solid state air-cooled R.F. generator, process temperature control, two mass-flow meters with precision needle valve, automatic nitrogen purging and touch-screen interface.
 
Plasma Etch Inc., www.plasmaetch.com

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