This pick-and-place system is capable of placing 3-D-MID technology. Is based on inline pick-and-place FLX2011-LCV system. Is completed by a palette transport system, a five-axis robot and a dispensing head with two valves. A free-motion robot arm is located in the chassis and grips the 3D-MID module from the transport system. Dispensing head is equipped with two individual touch-less dispensers: one for precise dispensing of solder paste, the other for accurate metering of fast-curing adhesive. Solder paste is applied to the electrical contact surfaces. Glue is dispensed on other locations to hold the SMD part until the reflow process and absorb mechanical stress. SMD components are placed with a vacuum tool and are picked from feeders, measured and aligned by an optical centering system, then placed to contact surfaces. Standard components are aligned on-the-fly with a laser system. For BGA, QFN and QFP, Cognex Vision is used.

Essemtec AG, www.essemtec.com
 

DispenseJet DJ-100 piezoelectric jets are said to be suitable for a range of fluid types and viscosities. Three models are available, each designed to dispense different types of fluid: DJ-100 Standard, DJ-100 NC for low viscosity materials, and DJ-100 GH, designed for highly viscous fluids. Novel “Jet on the Fly” technology reportedly shoots precise volumes in dots, lines and patterns. Reportedly eliminates Z-axis movement. Can achieve flow rates up to 200 mg/sec. and shot rates up to 150 dots per sec. Come with a serialized hardware set that includes a matched ball and seat. Calibrated Process Jetting uses weigh scale feedback to maintain consistent dispense volume. Achieve dot diameters as small as 200 µm.
 
Asymtek, www.asymtek.com
 

Niton XL3t is said to deliver improvements in light element detection, overall sensitivity and measurement times as much as 10 times faster than conventional Si-PIN detectors, and up to three times more precise than conventional silicon drift detectors. Permits light element detection of magnesium, aluminum, silicon, phosphorus and sulfur without helium or vacuum purging. Incorporates 80 MHz real-time DSP and dual embedded processors for computation, data storage, live video processing, and communication. Software permits users to customize the instrument; set user permissions; generate custom reports; print personalized certificates of analysis; remotely monitor and operate the instrument hands-free from a PC or PDA. Can locate areas of interest on a sample using the integrated color CCD camera and optional integrated 3-mm small-spot collimation.
 
Thermo Fisher Scientific, www.thermofisher.com
 

Pressurex Zero tactile pressure-indicating sensor film characterizes tactile contact surface pressure down to 7.2 psi (0.5 kg/cm²). Is flexible and placed between contacting or mating surfaces to measure and map pressure magnitude and distribution. Variations in contact surface pressure are said to be immediately visible by the impression made on the film; spatial resolution is fine enough to expose minute surface defects and other imperfections. Ranges from 7.2 to 28 psi. Comes as a thin, clear plastic sheet; is available in eight different pressure ranges with highest measuring impact up to 43,200 psi. Changes color directly proportional to the actual pressure applied. Can be scanned through an optical imaging system. Is used in design, manufacture, calibration and quality control. Is said to be ideal for invasive, intolerant environments and tight spaces not accessible to conventional electronic transducers. 
 
Sensor Products Inc., www.sensorprod.com
 

 
 

 
 
 
 
 

T40W Baking Dry Boxes can restore surface mount devices and assemblies that have serious damage or failure from ambient moisture absorption. Dual-capability systems are low-temperature baking ovens that reclaim MSDs and are also desiccant cabinets. Meet J-STD-033B maximum safe temperature requirement of 40ºC. Provide an RH level of less than 5%. Available in four models with capacities from 8.5 to 42.4 cu. ft.
 
Manncorp, www.manncorp.com/dry-boxes
 
 

Anritsu 3-D laser inline inspection system features horizontal resolution of 10 µm/20 µm interchangeable, and vertical resolution of 1 µm, high-speed inspection (33 sq. cm./sec. at 20 µm resolution; 13.8 sq. cm./sec. at 10 µm resolution). Program generation is said to be accomplished in approximately 5 min. and consistent results are provided. Offers automatic calibration function, SPC software, and zero plane reference points.
 
Seika Machinery Inc., www.seikausa.com
 
 

 

 

BluePrint-4-PADS for Mentor PADS permits simplification and automation of documentation for PCB fabrication, assembly and inspection. Is node-locked and includes drag-and-drop and automatic formatting of PCB views; uses PADS ASCII file for intelligent PCB view display; imports Gerber, DXF, PDF, JPEG, BMP, AVI, WAV; built-in word processing with spell check; intelligent note blocks on multiple pages; hyperlink between notes, callouts and details; imports PADS logic schematics as OLE objects; automatic drill chart creation; support for drill tolerances; automatic layer stack-up detail creation; unlimited PCB views on a single sheet (topside, bottom side, inner layers); view assembly variances on assembly drawing; assembly reference designation placement; support for mechanical components in BOM; no hiding and displaying of layers to produce documentation; real-time viewing of PCB documentation (no output required); export to HTML for web viewing, and free document viewer download.
 
DownStream Technologies, www.downstreamtech.com