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Series 500 ultrasonic stencil cleaners are designed for fine-pitch, low-volume stencils. Are said to be entry-level for users not able to purchase a fully automatic system; reportedly offer similar cleaning results. Are equipped standard with a heated wash and other basic requirements for cleaning Pb-free solder paste, pallets and adhesives. Can be customized. Model 520 cleans up to 20" stencils; Model 529 cleans larger stencils.
 
Smart Sonic, www.SmartSonic.com
 
The K4000 PCB depanelizer is for singulating skip-routed PCB panels up to 24" long. Includes right, left blade guards. Front and back support and take-up table are height adjustable. Is available with optional light beam safety curtain across the front of the blades. Includes conveyor belt. Tooling to align panels is optional. Blades are made of tool steel and can be re-sharpened.
 
FKN Systek, www.fknsystek.com

This Hi Output Line includes a 4-head pick-and-place and an inline automatic stencil printer, an 8-zone reflow oven and pass-through conveyor. Reportedly has 10,500 cph placement speed. Pick-and-place features Cognex flying vision-controlled MC683 conveyorized dual gantry system; two heads pick as the other two simultaneously place with reported accuracy of ±0.01 mm. Included is an offline loadable plug-and play modular smart feeder trolley. Is said to have registration accuracy of ±0.025 mm. Automatic stencil cleaner built in. CR8000 reflow oven has eight independent upper and lower heat zones and PID temperature control to 300ºC. Boards travel on an edge-pin conveyor adjustable to 450 mm width.
 
The 2008 Aerospace/Defense Symposium papers are now available free on CD. The fifteen technical papers reflect two tracks: test system development and military communications test. Also included is information on wideband vector analyzer calibration issues and time interval analysis measurements for radar.
The DispenseJet DJ-9500 fluid jetting valve is for high-speed underfill applications and jetting silicone for LEDs. Has a flexible pneumatic design. Reportedly can jet a wide variety of fluids up to 10 times faster than existing needle type dispensers. Controls fluid break-off at the nozzle tip. The needle assembly is said to last 5 to 10 times longer than other tested assemblies. Enhanced temperature controls maintain the fluid at a consistent viscosity.
 
Asymtek, www.asymtek.com
ZIP contacts for semiconductor test feature planar contact surfaces produced by test pin manufacturing processes. The Z Interconnect Pin is available in three design configurations: radial, flat, and hybrid. Radial uses machined 3-D components; flat employs 2-D components, and hybrid combines both. Are designed for interchangeability in the same test tool. Available for 0.5, 0.8, and 1.0 mm test pitches with 1.27, 0.4, and 0.3 mm designs.

Everett Charles Technologies, www.ectinfo.com

ProLINE-RoadRunner XLF inline automated programmer programs flash memory and microcontroller devices using FlashCORE II. Extra large format supports device sizes up to 32 mm sq. and tape widths of 32 mm and 44 mm. Can be reconfigured to support small- to medium-sized devices in tape widths of 16 mm and 24 mm. Features automatic supply application software. Initially available exclusively for Siemens assembly machines.
 
Data I/O Corp., www.dataio.com
 
The upgraded YTV F1 Series AOI inspects solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is said to be for high-volume or high-mix manufacturing environments; also for pre/post-reflow applications. Has four oblique viewing cameras; offers inspection for R-nets. Improved Fusion lighting, with multi-color solder joint inspection, reportedly delivers 20% higher detection capabilities compared to previous models. Offers offline programming and a standard package library. Real-time SPC monitoring is standard.
 
YESTech Inc., www.yestechinc.com
The PC3200 series of fast-setting, one-component conductive adhesives is for connecting passive components and bare dies on lead frames and PCB substrates. Uses are said to include smart cards and flexible circuits found in camera phones, automotive or semiconductor applications. Is a one-part system that reportedly requires no premixing. Does not have to be stored below 40ºC, nor shipped in dry ice. Solvent-free and formulated for stencil print, screen printing or dispensing applications.
 
Heraeus Contact Materials Division, www.4cmd.com/circuitmaterials       

The enhanced 4000HS High-Speed Bondtester includes high-speed trigger capture software and a rising table work holder for cold bump pull bondtesting. Provides energy measurements during bondtesting. Is JEDEC-compliant.
 
Dage Precision Industries Inc., www.dage-group.com

KIC Explorer 9 thermal profiler uses modern hardware and features a total of nine thermocouples using the standard type K TC connectors. The channel completes the range of compact profilers. Software is said to be easy to use. The optional auto-focus process optimization software automatically selects the best oven setup for each application.
 
KIC, www.kicthermal.com
 
Zestron DS 100 solvent-based defluxing agent is for water-free and low-temperature cleaning applications. Is designed to remove flux residues from assemblies, ceramic hybrids, power modules and leadframes in self-regenerative closed-loop cleaning systems. Is said to ensure extended bath life, short cycle times and residue-free drying. Is halogen-free; meets new RoHS and WEEE guidelines.
 
Zestron America, www.zestron.com
 

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