SelectaFlux Retrofit ultrasonic selective fluxing system has been designed to retrofit into all major selective soldering machines and is said to be compatible with all flux types, including Pb-free. Requires a simple trigger signal to operate and has controlled velocity spray. Combines Microspray ultrasonic atomizing nozzle with low air pressure. Spray is restricted through a separately controlled module that handles input and output. The distance between the nozzle and substrate can be varied from near-contact to approximately 50.8 mm. Contains a digital display for nozzle power and panel-mounted nozzle power, flow rate and air pressure adjustments, plus an alarm output for nozzle malfunction. Is 432 mm width x 305 mm height, and 221 mm diameter.
 
Sono-Tek, www.sono-tek.com

 

LMF Series fiber laser markers have high peak power and pulse frequencies; can mark text, barcodes or graphics and can be integrated into existing lines. Mark "on the fly," enabling marking/engraving of a moving product. Come in 10W and 20W versions capable of Q-switch frequencies of 2 to 500 kHz. Features include PC, touchscreen, standalone or pendant operation, intuitive and customizable marking interface, integrated rotary and XYZ motion, LAN connectivity, and an inline camera option.

Miyachi Unitek, www.muc.miyachi.com  

ProFlow Evolution enclosed print head adds ProFlow Tx, for alternative process applications, including deposition of enzymes, ink, underfill and glue; and ProFlow Atx, for advanced paste materials. Now able to mix and condition materials and deliver uniform performance control. Updates include the use of industry standard materials syringe packaging, a modified chamber design and direct material loading capability.
 
DEK, www.dek.com 

LTS-QFP is a programmable, automated machine that reconditions QFP and FP component leads for high reliability or RoHS applications. Has robotic part handling device that picks QFPs from a loading platform with a vacuum head. Component is inspected by camera for location. Flux is applied to the leads. Has two solder pots said to eliminate bridging. Is based on the LTS200 platform. Can be programmed to handle transistors, capacitors, diodes, axials, radials, pin grid array, sips, dips, connectors and more.
 
ACE Production Technologies Inc., www.ace-protech.com

Medalist i1000D in-circuit tester has digital test capabilities. Offers per pin programmability; digital PCF/VCL library-based testing; native boundary scan capabilities; I2C/SPI serial programming; simple, low-cost long-wired test fixture; and a flexible, easy-to-use GUI.

Comes with full native boundary scan test capabilities and VTEP v2.0 Powered vectorless test suite, including Cover-Extend.

Agilent Technologies, www.agilent.com 

ESD badge holders are for use with ESD-sensitive components. Have yellow header and ESD protective symbol. RTT is 1 x 10¹⁰Ω; tribocharging is less than 100V. Available in horizontal and vertical formats with or without a clip.
 
Menda, www.mendapump.com

 

PanaCIM Enterprise Edition electronics assembly manufacturing execution system software includes nine modules: production analysis, production planning, production monitoring and dispatch, material verification, traceability, material control, product changeover and control, maintenance, and enterprise link. Includes production monitoring and dispatch’s centralized and real-time data monitoring to identify events such as part exhausts, changeovers and process shifts. Dispatches tasks to the necessary labor resources via email, PDA, or visual display; generates reports for analysis of event history by product, operator and equipment.
 
Panasonic Factory Solutions Co. of America, www.panasonicfa.com

Next Production Modular is a single-platform modular assembly machine with interchangeable, plug-and-play placement heads for nearly any component. Integrates solder paste inspection, adhesive dispense, post-placement inspection and screen-printing capabilities. Both heads of each NPM unit work on both stages. The Dual Screen Printer module performs parallel, simultaneous printing of two unique products. Has area productivity of up to 25,000 cph/m2. Uses features of CM series placement equipment, including intelligent feeders and nozzles with interchangeable head capabilities. Exchange carts reportedly provide virtually zero downtime during changeover.

Panasonic Factory Solutions Co. of America, www.panasonicfa.com/?id=NPM

TS6500CIM Series cartridge mixer automatically mixes two-component material filled in a cartridge kit. Is said to accommodate all standard size cartridge kits ranging from 2.5 to 20 oz. 74 to 591ml) and is usable anywhere with its accompanying tools, accessories and universal power supply.

Comes with automatic fluid level sensing device and user-friendly electronic control system, for quick, simple setup. Automatic injection feature provides even distribution of hardener into resin during the mixing cycle to ensure a uniform mixed result. The high torque motor maintains speed to allow for the continuous mixing of high viscosity materials. Safety features include a two-hand start, emergency stop button and the required closing of the protective enclosure to ensure maximum protection for operators. Conversion kit available for 1/10 gallon (325 ml) cartridge kit size.

Techcon Systems, a division of OK International, http://www.techconsystems.com

XF-300 is a 0.005" coated polyamide, pressure-sensitive label material, designed for barcode or alphanumeric identification of connectors, wires and cables. Is coated with a high opacity, matte white topcoat specifically designed for thermal transfer printing. Can be printed using dot matrix printers and certain felt-tip or ballpoint pens. Is for labeling curved parts and surfaces. Is coated with a permanent pressure-sensitive acrylic adhesive that will adhere to most clean, dry surfaces. Has a temperature rating up to 293°F.

 

XF-596 (0.001") and XF-597 (0.002") high-gloss polyimide label materials for higher barcode print density are coated with a high opacity, gloss white topcoat specifically designed for thermal transfer printing. High-gloss topcoat permits high barcode printing densities when using 600 dpi thermal transfer printers. Label sizes can be reduced compared to standard density barcodes. 2-D barcodes, such as IDMatrix or PDF417, are said to be easily printed on these materials. The temperature resistance (rated up to 932°F) is critical for the dimensional stability of the label required for efficient barcode scanning. Come laminated with a high-temperature, permanent, pressure-sensitive acrylic adhesive.

 

XF-509 is a 0.001" polyimide film coated with a high opacity, black topcoat. Is designed for thermal transfer printing with white resin-based ribbons. Is laminated with a high-temperature permanent pressure-sensitive acrylic adhesive designed for industrial environments. Labels can withstand chemicals and temperature extremes up to 932°F. Is used in situations where reflected light from standard white labels can cause “ghosting.” Also offers aesthetic advantages when the label is used on a dark surface. Retains high dimensional stability at high temperatures.

 

All comply with ROHS, REACH, and halogen-free.

 

Polyonics, www.polyonics.com

Dross-B-Gone powder separates dross from molten solder. Applicable for wave soldering and other processes involving considerable volumes of solder. Is claimed to recover in several minutes almost 90% of the pure solder originally used. Is effective with both Pb-free and SnPb solders. Eliminates dross by quickly oxidizing it into an easily removable powder that is discarded, while pure molten solder remains in the pot and becomes reusable. Is sprinkled on the molten solder at an approx. ratio of 10 g per 1000 g of solder dross. The pure solder recovery rate is 880 g.
 
Manncorp, www.manncorp.com/wave-solder/dross-b-gone/.

 

ZelFlex Protect is a reusable stencil frame system that is an alternative to glued stencil frames. Stencil foil can be stored as a flat sheet if not in use. Can stay on the stencil to permit safe handling and quick changeover. Changing a stencil is said to take 30 sec. or less. Comes in industry standard form factors and reportedly is compatible with virtually any stencil printer. Outer dimension is 23" x 23" and total thickness is 1".
 
LPKF Laser & Electronics, www.lpkfusa.com