Grid-Lok Gold fully automatic tooling solution for board and substrate support. Offers the same automation, high-density pin array and locking technology as HD Grid-Lok. Has an enhanced design and foolproof electrical connectivity ergonomics. Features a half-size control enclosure. Accommodates diverse product demands from basic SMT to high-density, double-sided assemblies. Once the substrate is loaded, the system automatically takes control to raise the high-density array of pneumatically controlled pins. These conform to the board topography, including underside components, and lock firmly into place. The support pin array maintains its configuration until independently reset for the next board. Eliminates operator intervention and reduces support tooling setup to fewer than 20 sec.

Ovation Products, www.ovation-products.de

Aquasol water-soluble solder paste can be used with any common soldering alloy. SnPb and Pb-free SAC and SN100C versions are available. Exhibits excellent performance in printing (including fine-pitch capability), placement, reflow and cleaning. There is efficient separation from the squeegee and good aperture release with long stencil life. Is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Features excellent slump resistance; residues can be removed with de-ionized water. Has extended tack time. Voiding is minimized in air and nitrogen processes. Post-soldering flux residue can be removed using hot de-ionized water with or without cleaning agents.

Cobar Solder Products, www.cobar.com

Fineplacer Core rework system is for a wide spectrum of SMT components, ranging in size from 0201 to 50 x 50 mm BGAs. Handles PCBs up to 300 x 400 mm. Semiautomated design includes force measurement with automatic component lift-off and placement. Is a compact, versatile hot-gas system that handles de-soldering, site dressing, paste print, reballing and component replacement.

Finetech, www.finetechusa.com

The suitcase-sized kit cart uses the single-package, single-location control feature. Provides non-dedicated, high-density, flexible component package storage and Web-based inventory control. Is designed to accommodate complete SMT kitting function for the production floor. With Web-based software, it provides location, inventory accuracy and correct component validation for feeder loading and replenishment. Displays the InoCart MSD unit, along with two versions of the InoCart material handling system.

Inovaxe, www.inovaxe.com

 

Anthem lead tinning system is ANSI, MIL, IEC and GEIA compliant. Is for high-precision, low- to mid-volume components and lead re-tinning. Features include two dynamic solder pots, preheat station, and flux station; high-precision ball screw drives; PID temperature control, and Windows PC. Programming control includes solder temperature; dynamic solder flow; emersion depth acceleration, deceleration, and feed rate; dwell time; X and Z axes, and optional rotary motion.

RPS Automation LLC, www.rpsautomation.com

Dual-VU inspection system delivers magnified real-time x-ray and optical component images simultaneously and at the same level of magnification. Can make direct, simultaneous comparisons between optical and x-ray images of a complex component. Reportedly reveals hidden solder bridges, voids and surface problems on BGAs in one pass. Simultaneously verifies solder joint integrity and placement accuracy of leaded IC components. Views component surface and interior at the same magnification, usually 15X. In failure analysis, signal traces on multilayer boards can be identified visually and tracked. Confirms electrical continuity of plating after drilling.

Glenbrook Technologies, www.glenbrooktech.com

TestWay reference coverage analysis tool quantifies and qualifies test coverage for a range of inspection and test equipments. Features probe analyzer, an interactive, rules-based routine to identify possible probe locations based on copper surface. Coordinates access constraints, spacing checks, test points assignment, use of largest probe size, pin offset and bead probes, and company-specific guidelines. Estimates ICT and FPT test coverage based on measurement capabilities of the targeted test equipment. Generates accessibility report that states whether adequate probe locations were identified for each net. Defines the test line and combines ICT or FPT with complementary test techniques, such as AOI, AXI, BST, FPT, ICT, MDA and functional test.

Aster Technologies, www.aster-technologies.com

FR-830 compact hot air preheater is said to deliver consistent heat through closed-loop temperature control, permitting preheating temperature between 300° and 572°F. Optional extension pipe extends airflow an additional 27 mm. vertically and a port to permit the preheating cycle to be activated by remote foot switch or hand switch. Can be integrated with Hakko FR-803B, so the start of the preheating cycle is directly controlled by the FR-803B rework profile. ESD-safe.

American Hakko Products, www.hakkousa.com

Paraquda SMD pick-and-place machine uses new materials for high-speed control. Features short changeover times, an intuitive operation system (Eplace), and an integrated quality management system. Has 210 feeder capacity. Head can simultaneously hold and measure four components. Component range is 01005 up to 4" sq., up to 1" in height. Min. pitch is specified with 0.01". High-resolution fly-by vision system is equipped with latest Cognex SMD image processing technology.

Essemtec, www.essemtec.com

 

 

Offline teaching program II software has an XML data structure that enables a bidirectional data exchange; taking solder programs out of the offline teaching program and into the machine and vice versa is possible without further conversions. Differences between the original solder program and the program stored in the machine control system can be displayed automatically. Can process image data from cameras and scans. Automatically eliminates common picture distortions. Offers globally storing periodical process parameters for use with particular solder points or soldering passages when developing new solder programs. After teaching all solder points, the program computes the fastest way to minimize handling. This prospectively computed cycle time is displayed directly.

SEHO Systems GmbH, www.seho.de

No. 945 is an electrically heated 500°F universal oven used for various curing tasks. Workspace dimensions are 54" x 36" x 36".  6.6 KW are installed in Nichrome wire heating elements, while a 600 CFM, 1/2-HP recirculating blower provides horizontal front to rear airflow. Has 4" insulated walls, an aluminized steel exterior and Type 430 stainless steel interior. Equipped with an integral leg stand with casters and leveling pads. Controls include a digital indicating temperature controller, manual reset excess temperature controller with separate contactors, recirculating blower airflow safety switch and SCR power controller.

The Grieve Corporation, www.grievecorp.com

NL932 no-clean, Pb-free, halide-free solder paste is said to feature good solderability, improves stencil life, and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index across all board designs. Provides print release down to 0.55 SAR when used with the Slic Stencil. Features excellent wetting on OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a wide range of temperatures (65°-85°F) and relative humidity (25-65% RH). Reportedly stencil prints at up to 200 mm/sec.; voiding exceeds IPC Class III.

FCT Assembly, www.fctassembly.com