i7090 massively parallel board test system performs tests in parallel on multiple PCB assemblies.
iX7059 heavy duty inline automated inspection x-ray system has a newly developed transport system that handles workpiece carriers and soldering frames.
TempSave soldering materials address reduction of peak reflow temp. to reduce defects contributing to package warpage, reduce energy consumption during reflow, and avoid potential damage to temperature-sensitive devices.
W20 water-soluble solder paste is a zero-halide/halogen flux formula engineered for enhanced wetting performance on all solderable electronic surfaces.
XQuik II Plus component counting system has cycle time less than 20 sec. for both single reel and quad counts.
FH63S series shielded flexible printed circuit connector has patented single-action flip lock technology.
ASM Factory Equipment Center software is for company-wide asset and maintenance management.
LLC152D70G105ME01 ultra-thin LW-reversed, low equivalent series inductor multilayer ceramic capacitor has capacitance value of 1.0µF ±20% for 4 Vdc-rated automotive applications.