Alusol-SN and Alusol-SN-X solder pastes have been developed for soft soldering and tinning of aluminium and aluminium alloys with pure tin and formulated so no separate solder feed is necessary.

MekCare is designed to meet differing support requirements.

AEC-Q200-qualified TCQ series conductive polymer chip capacitors are for automotive, industrial, and telecommunications applications.

LCCI series ultraminiature multilayer ceramic chip inductors are for high-frequency RF applications.

ii-A2 is equipped with a pair of high-speed Pulsar pipette heads.

Europlacer ii-A1 is an ultra-flexible placement module featuring single Tornado turret head.

Max-M12 high-speed connectors include X coding with support for 10Gb/s (1000M Ethernet with CAT6 cable) data transmission and S coding for safer connection with First Mate Last Break.

Supreme 70CN two-part epoxy adhesive is formulated using a natural, renewable and sustainable ingredient.

Heavy Flex handling system is capable of inspecting assemblies weighing up to 15kg.

Siplace TX Micron has improved 20-nozzle SpeedStar high-speed placement head.

70cc Optimum syringe barrels hold assembly fluids, such as adhesives, epoxies, sealants and solder pastes.

IPC-2591 v. 1.3, Connected Factory Exchange (CFX) includes messaging upgrades for predictive maintenance, energy management and improved alignment with IPC-HERMES-9852.