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Elpespec R 5807 cleaning agent avoids side reactions in moisture cross-linking silicone coatings.

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Cheetah and Cougar EVO microfocus x-ray systems now include visualization with FF CT software as standard.

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IHXL-1500VZ-51 through-hole inductor delivers 420A saturation current for 30% inductance reduction in 1500 case size.

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HiTech CF31-4010 is a one-component, high filler content, heat-curable cornerfill.

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HiTech CU21-3240 and CU31-2030 are one-component capillary underfills designed to protect assembled chip packages on printed circuit boards.

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18KLF solder recovery system has a 40lb pot.

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Low-ESD polyimide masking tape has width options ranging from 0.125" to 3.000".

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High-precision TR77000QM SII 3-D AOI has 5.5µm high-res 12mp imaging technology for semiconductor and packaging industry and other industries.

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RMCP thick-film chip resistor with high power capability now comes in resistance values up to 10mΩ.

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OM-372 Pb-free, no-clean solder paste is designed to provide ultra-high electrochemical reliability on fine-pitched, low-standoff components.

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Ant-i2 offline selective soldering machine is designed for high-volume offline production for small printed circuit boards and good flexibility for large PCBs.

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D.FL75 75 ohm, 4K/UHD transmission coaxial connector supports 12G-SDI standard and SMPTE ST 2082-1.

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