SC-BP3 multi-purpose bubbling cleaning system reportedly cleans flux five times faster than immersion cleaning.
CW-232 flux-cored wire combines wetting speed and spread with low-spatter performance.
Aerosol Jet HD2 3-D additive manufacturing printer produces high-resolution circuitry, including ability to dispense conformal 3-D interconnects between die, chips, components and substrates.
Elpespec R 5807 cleaning agent avoids side reactions in moisture cross-linking silicone coatings.
Cheetah and Cougar EVO microfocus x-ray systems now include visualization with FF CT software as standard.
IHXL-1500VZ-51 through-hole inductor delivers 420A saturation current for 30% inductance reduction in 1500 case size.
HiTech CU21-3240 and CU31-2030 are one-component capillary underfills designed to protect assembled chip packages on printed circuit boards.
High-precision TR77000QM SII 3-D AOI has 5.5µm high-res 12mp imaging technology for semiconductor and packaging industry and other industries.