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WE-KI now includes ceramic inductor variants in 0603 and 0805 packages.

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SC-BP3 multi-purpose bubbling cleaning system reportedly cleans flux five times faster than immersion cleaning.

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CW-232 flux-cored wire combines wetting speed and spread with low-spatter performance.

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Aerosol Jet HD2 3-D additive manufacturing printer produces high-resolution circuitry, including ability to dispense conformal 3-D interconnects between die, chips, components and substrates.

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Elpespec R 5807 cleaning agent avoids side reactions in moisture cross-linking silicone coatings.

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Cheetah and Cougar EVO microfocus x-ray systems now include visualization with FF CT software as standard.

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IHXL-1500VZ-51 through-hole inductor delivers 420A saturation current for 30% inductance reduction in 1500 case size.

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HiTech CF31-4010 is a one-component, high filler content, heat-curable cornerfill.

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HiTech CU21-3240 and CU31-2030 are one-component capillary underfills designed to protect assembled chip packages on printed circuit boards.

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18KLF solder recovery system has a 40lb pot.

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Low-ESD polyimide masking tape has width options ranging from 0.125" to 3.000".

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High-precision TR77000QM SII 3-D AOI has 5.5µm high-res 12mp imaging technology for semiconductor and packaging industry and other industries.

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