MRSI-705 high-volume configuration 5μm die bonder offers horizontal turret feature to increase speed and throughput without sacrificing flexibility, accuracy, or reliability.

DryBox cabinet is designed to store and protect 3-D printing filaments in a humidity-controlled environment.

ICCON Block and ICCON Insert connectors address high current rating demands from high-speed board-to-board and board-to-busbar data communication applications.

Palomar 8100 automated, thermosonic high-speed ball-and-stitch wire bonder performs ball bumping and customized looping profiles.

VEMD4010X01 and VEMD4110X01 surface-mount automotive-grade silicon PIN photodiodes come in 0805 case size with 0.7mm profile.

DEK TQ stencil printer can operate for up to 8 hr. without operator assist.

APC Series surface mount resistors have been qualified for use in environments exposed to sulphur-bearing gasses.

Four new models of AR series environmental stress chambers for rapid-rate temperature cycling provide temp. cycling and humidity performance needed to validate quality and reliability for automotive, electronics and other products.

EP1 wet tantalum capacitor has new ratings in B and C case codes.

WE-MK multilayer ceramic inductors have resonant frequency > 10GHz.

EO-MC-001 liquid flux can be mixed with water or alcohol and can be used for tinning process in electronics industry and mechanical engineering.

6 series B mixed signal oscilloscope extends performance to 10GHz and 50GS/sec.