Dowsil TC-3065 one-part, thermally conductive gel was developed to dissipate high amounts of heat away from sensitive electronic components.
Jean-151 SN100CV solder paste is halide-free and classified according to J-STD-004A as ROL0. SN100CV is high-reliability variant of silver-free SN100C series.
Easy Arm 1 and 2 fume extraction units supply a three-stage filter system to clean process air.
Multi-Cure 9037-F encapsulant cures in seconds upon exposure to UV/visible light and has secondary heat cure for shadow areas caused by high-profile components on PCBs.
S8708A Advanced Performance Test Toolset optimizes performance of 5G devices that use MIMO and massive MIMO technology.
Dowsil VE-8001 flexible silicone adhesive is for flexible and foldable displays, smartphones, wearables, laptops, TVs and other types of electronic devices.
PNA and PNA-X network analyzers contain low-spurious direct digital synthesis source, enabling accurate measurements with less phase noise interference.
ScanWorks v. 4.8 JTAG-based hardware debug, validation and test tools are for testing device interconnects between silicon chiplets in multi-die packages.