SFP-DD I/O interconnects are new double-density cages and surface mount connectors.

JTAG ProVision 2020 PCBA test development software further simplifies processes for testing modern PCB assemblies fitted with miniature components in highly integrated packages.

Eco-Cycler rinse water recycler is now in its third generation.

Dale IHLD-2525GG-5A automotive-grade, low-profile, high-current dual inductor in 2525 case size is designed to replace two inductors required in automotive Class D audio amplifier with single device.

Infra-Scope no-contact 1080P high-definition surveillance system uses facial recognition and high-temp. alarm.

Delo Monopox EG2596 die attach adhesive offers high strength after aging.

AccuID produces a unique reel ID barcode label for each SMT component reel. Benchtop system has simple user interface; operator places reel in system and scan begins automatically.

GSP 2633/RX and GSP 2933/RX fluxes have shelf life of 12 months.

NearStack 100 Ohm and NearStack 85 Ohm high-speed cable assembly help reduce insertion loss and improve signal integrity.

813-76 is a two-component room-temp.-curing thermally conductive and electrically insulating adhesive.

Lead-free Soldering Process Development and Reliability, edited by Jasbir Bath, covers Pb-free soldering, such as developments in process engineering, solder alloy development, intermetallic compounds, PCB surface finishes and laminates, underfills/encapsulants, conformal coatings and reliability assessments.

TF-M881R tack flux is for BGA/CSP component applications.