T4AB58-HF360 and T4AB58-HF360D solder pastes are for low-temp. reflow soldering processes designed for printing and dispensing applications.

Desktop dispensing robot integrates different dispensing technologies: from time-pressure to volumetric dispensers to electropneumatic or piezoelectric jet dispensing.

BCcomponents SMDY1 surface-mount AC-line-rated ceramic disc safety capacitors offer Y1 rating of 500VAC and 1500VDC.

SMT 158N is a non-flow, low-temp., slow-cure, high-purity liquid epoxy underfill and capillary underfill encapsulant.

FlashFOX provides embedded ISP for programming electronic assemblies.

GoFA and SWIFTI cobots complement YuMi and Single Arm YuMi.

Job Data Convert function enables automatic generation of data for board inspection on Saki 3D-AOI systems by using component information data generated for pick-and-place machines.

iCube HighFlex selective solder machine offers all-in-one package.

ACAS 0606 AT and ACAS 0612 AT automotive-grade thin-film chip resistor arrays have higher resistance ratios up to 1:100 and operating voltages up to 100V.

CT Plus open has microfocus tubes for continuous scanning at power and voltages up to 300kV.

Master Bond EP77M-FMed is a two-part epoxy adhesive and sealant designed for use in assembly of medical devices.

PicoShot NC-5M jetting solder paste is designed for halogen-free no-clean SAC 305 solder paste for Mycronic MY600/MY700 jetting systems or add-on and repair modules.