WPI (Wave Process Inspection System) brings process monitoring, process control and traceability to the wave solder process.

Sidefill CV5797U is for surface mount assembly applications.

Closed loop PPM control system for Centurion reflow oven is designed to be used in a nitrogen environment with Cathox to maintain PPM setpoint range.

VarioTAP processor emulation technology is now available for processors from STMicroelectronics.

Sensitive Wire Feeder can be used in conjunction with a laser, iron or induction system for soldering assemblies.

Reel Smart incoming material Stations come in two models: Reel Smart Lite (IMS-100) and Reel Smart Pro (IMS-200).

PF606-EP305 joint enhanced solder paste (JEP) and solder joint encapsulation material (SJEM) flux SMEF-Z52 are epoxy-based solder materials for very fine pad size (70μm) soldering, especially for advanced display packaging and assembly.

T4AB58-HF360 and T4AB58-HF360D solder pastes are for low-temp. reflow soldering processes designed for printing and dispensing applications.

Desktop dispensing robot integrates different dispensing technologies: from time-pressure to volumetric dispensers to electropneumatic or piezoelectric jet dispensing.

BCcomponents SMDY1 surface-mount AC-line-rated ceramic disc safety capacitors offer Y1 rating of 500VAC and 1500VDC.

SMT 158N is a non-flow, low-temp., slow-cure, high-purity liquid epoxy underfill and capillary underfill encapsulant.

FlashFOX provides embedded ISP for programming electronic assemblies.