GoReflow-plus convection reflow soldering system has eight heating zones and active heated area of 2,980mm.

TR7700QE-S 3-D AOI inspects and detects defects in wire bonds, die bonds, SMD, bumps, wafer IC/chip, underfill, and solder joints.

Seho PlasmaFluxer uses cold-active plasma to melt micrometer-sized powder of adipic acid and deposit it on PCB.

NB-IoT 3GPP Release 15 wake-up signal reduces power consumption of NB-IoT devices.

MT-200 MiniTweez thermal tweezer is designed to rework tightly spaced micro-components such as 0201s, 0402s and 0603s.

Net Signal Wave (NSW) technology enables flying probe testing of PCBAs for large or small and single- or double-sided PCBs.

Multi-reflection suppression-enabled 3-D MX3000 final vision inspection system is for memory modules.

Universal LED Backlight HD-127 has intensity adjustment control.

Berquist microTIM mTIM 1000 microthermal interface coatings dissipate heat.

5G device benchmarking toolset automates testing and reporting across device builds and models.

UMT-W pulse-proof SMD ceramic fuse has time-lag tripping characteristics. Is reportedly suitable as fail-safe device in demanding applications.

R&S TS8996 RSE test system measures radiated spurious emissions from 5G components in frequency ranges FR1 and FR2.