Staydry Z20 is a silicone film moisture getter for hermetic packages.

Master Bond EP17HTS-DA is a one-component, no-mix, electrically conductive die-attach epoxy.

R&S RTO-/RTP-K133 advanced jitter analysis option for R&S RTO and R&S RTP oscilloscopes helps development engineers gain insight into individual jitter components of transmission interface.

TMBS Trench MOS Barrier Schottky rectifiers are now with 16 2A and 3A devices in eSMP series low-profile SMP package.

YRM20 chipshooter uses two head types: a high-speed, multi-purpose rotary head that, when combined with the high-speed feeder, delivers performance under optimal conditions of 115,000cph, as well as a one-head solution via inline (HM) head.

Design and test workflow reduces product development time for double-data rate dynamic random-access memory (DDR5 DRAM) systems.

Micro-Mini (SMP/SMPM) extreme frequency subminiature RF/coaxial push-on solderless PCB compression mount connectors are for high-frequency printed PCBs.

LX-1000 inline large-area optical inspection system offers 630mm x 630mm inspection area with single-or dual-sided imaging.

FlexiCoat EMI ultrasonic coating is designed for conformal spraying of EMI shielding material onto semiconductor packages.

Kyzen E5631 stencil cleaner is formulated to clean flux and uncured adhesives from stencils and misprints.

PCU-285 Spiral Viscometer is designed to measure solder paste viscosity.

Overlay assisted inspection is for digital camera inspection systems.