SECS/GEM communication package for MPM Edison printer is a semiconductor market communication standard that provides a common interface between manufacturing equipment.

10 650V silicon carbide (SiC) Schottky diodes feature merged PIN Schottky (MPS) design.

SMT 158D8 high thermal conductive underfill is a diamond-filled, reworkable liquid epoxy. Has thermal conductivity of >6W/mK, high salt-moisture resistance, and excellent adhesion.

W series embedded Wi-Fi antennas offer range of standard solutions with ultraminiature form factors, PCB or FPC antenna technologies capable of supporting single- and dual-band operating frequencies up to 6GHz, performance-enhancing foam coatings, and various mounting options.

R&S NRP67S and R&S NRP67SN three-path diode power sensors have max. measurable frequency of 67GHz.

WE-KI now includes ceramic inductor variants in 0603 and 0805 packages.

SC-BP3 multi-purpose bubbling cleaning system reportedly cleans flux five times faster than immersion cleaning.

CW-232 flux-cored wire combines wetting speed and spread with low-spatter performance.

Aerosol Jet HD2 3-D additive manufacturing printer produces high-resolution circuitry, including ability to dispense conformal 3-D interconnects between die, chips, components and substrates.

Elpespec R 5807 cleaning agent avoids side reactions in moisture cross-linking silicone coatings.

Cheetah and Cougar EVO microfocus x-ray systems now include visualization with FF CT software as standard.

IHXL-1500VZ-51 through-hole inductor delivers 420A saturation current for 30% inductance reduction in 1500 case size.