SP08 parallel flash programmer allows fast onboard programming of PCB assemblies.

TransGuard Automotive VGAH series high-temperature, glass-encapsulated multilayer varistors (MLVs) are qualified to AEC-Q200, rated for operating temperatures up to 150°C, and designed for use in a variety of high-energy, harsh-environment automotive underhood, industrial, and oil and gas applications.

FactoryLogix 2019.1 manufacturing execution software incorporates more customer-reported enhancements.

Master Bond EP29LPTCHT is a two-component, low-viscosity epoxy compound that can be used for underfill and encapsulation applications.

Inspectis software 5.0 offers overlay features, including a built-in DXF creator and editor for producing scaled overlay graticules.

Microcut 6080 offers positioning and cutting tailored to requirements of small apertures, for cutting exact openings with a size of 18μm on the laser entry side and 10μm on the exit side, in 30μm stainless-steel foil.

JNASE is for rework of 0402, 0201, 01005 and 008004 components.

ASM ProcessExpert consists of ASM ProcessLens 5-D SPI system and ASM ProcessEngine software.

i3070 series 6 in-circuit test enables electronics manufacturers to improve test throughput and operational efficiency of PCBA manufacturing.

Vortik progressive cavity pumps have process controls for mass flow control and automated ratio control system for mixing two-component fluids.

UltimusPlus air pressure fluid dispenser has built-in features that enable applications with high accuracy and reproducibility, while improving productivity in applications for life sciences, electronics, consumer goods and automobiles.

VP-9000 3D-SPI system is used in printed circuit board manufacturing process for production of electric devices.