FlexiCoat EMI ultrasonic coating is designed for conformal spraying of EMI shielding material onto semiconductor packages.

Kyzen E5631 stencil cleaner is formulated to clean flux and uncured adhesives from stencils and misprints.

PCU-285 Spiral Viscometer is designed to measure solder paste viscosity.

Overlay assisted inspection is for digital camera inspection systems.

PQ50 series rugged high-power connector for industrial environments is available in lightweight plated plastic resin or Zinc die cast shell.

Master Bond EP30DPBFMed is a two-part, flexibilized epoxy-urethane hybrid for bonding, sealing, coating, and encapsulation.

KP13B Nano SIM card connector reportedly reduces required PCB mounting space by up to 26%.

IHDF-1300AE-10 through-hole inductor is comprised of an edge-wound coil. Features low loss ferrite core for high-performance designs with minimal AC power losses.

A-351 gantry motion system is driven by linear motors and guided by mechanical linear bearings.

Amphenol Rugged Connector (ARC) series now include additional SMA connectors designed for performance in harsh conditions, including outdoor applications where extreme weather conditions may be a consideration.

Monopox TC2270 is a thermally conductive adhesive for chip bonding and other applications where electrically insulated heat transfer is required.

Alpha Cut HR2 laser-cut stencils retain shape, positional accuracy and wall quality associated with standard Alpha Cut material; have improved print definition and reduced variation in solder deposits.