EA1400 XRF uses detection technology coupled with x-ray optics designed for rapid screening of RoHS substances.

EZReball 6,000 ball count BGA preforms consist of 4,000 solder balls on a 0.4mm pitch over a 45mm x 45mm package.

CX90B series top-mount USB 2.0 Type-C connector has 16 contacts. Is reportedly ideal for applications susceptible to high-vibration and drop impacts, including control systems, drones, medical devices, smart meters, point-of-sale equipment, imaging equipment and other small portable devices.

EP21ARLV two-part epoxy may be used as adhesive, sealant, coating or encapsulant. Is capable of withstanding prolonged exposure to 70% sulfuric acid, 10% hydrochloric acid, 10% nitric acid and butyl acetate.

MKP1848H series of automotive-grade DC-Link metallized polypropylene film capacitors are optimized for high humidity environments.

WS-829 for printing and pin transfer applications, including LED die-attach, can be used for ball-attach on substrate in a standard BGA process, especially for sphere applications <0.25mm, as well as wafer-/panel-level packaging.

RCX320/340 software plugin is for Asyril Asycube intelligent parts feeder.

PCB antennas are for Wi-Fi, GSM, CDMA, 3G, 4G, LTE, GPS, Bluetooth, ZigBee, ISM and NB-IoT applications.

Fujipoly tube-shaped thermal interface covers improve transistor cooling.

SR100E replenishment rack is designed for operation on the production line next to pick-and-place machines to facilitate efficient feeder replenishment.

F98-AJ6 series capacitors are available in 0603 and 0805 chip sizes with max. heights of 1mm and 0.8±0.1mm and feature facedown under-tab terminations designed to achieve high capacitance, high volumetric efficiency, and high PCB assembly densities.

SFP-DD I/O interconnects are new double-density cages and surface mount connectors.