TO263-7L package includes BM2SC12xFP2-LBZ AC/DC converter ICs with built-in 1700V SiC MOSFET.

GT90 and GT120 soldering systems have software upgrades that offer combination of inductive heating technology with adjustable temperature control.

PolyStyle ESD flooring is designed for industrial and production areas, warehouses and high-traffic aisles.

APT-1400F-SL-A flying probe test system for assembled PCBAs delivers larger testing area (635 x 610mm) to accommodate 5G communications and battery management system applications.

Loctite Ablestik ABP 8068TD high thermal die attach paste is for use in applications where no die back-side metallization is required.

PF918-P250 SnAgBi3 alloy offers high thermal impact reliability.

ProMetrics monitors thermal profiles during soldering. For single- and dual-lane systems and suitable for vacuums.

GT90 and GT120 Soldering Systems now have software updates allowing users to set temperature profiles for various components or solder joints.

TR7007 SII Ultra 3-D high-speed solder paste inspection performs at speed up to 180 cm²/sec.

WeldInspect DIM is an optical inspection system designed to inspect welds and other shiny surfaces.

UBC 550 series ultra-broadband capacitors are designed to deliver performance from 16KHz to 70+GHz in ultra-broadband microwave and millimeter-wave RF applications with stringent operating requirements.

OvenSentinel continuous monitoring technology now has Profile SnapShot, a one-button, on-demand oven profile confirmation that delivers a data file, rather than a profile image only.