When through-hole connectors move during soldering, damage to the nozzle ensues.
This month we we look at through-hole connectors and component pin float. All connector pins should be held in place by the body molding and not move during soldering. The connector should not be used outside of its specification. Suppliers typically define the temperature and time the pins and body of the part are exposed to a specific peak temperature. It is the designer’s job to ensure the correct parts are defined for the process. It is the purchasing department’s job to ensure the correct parts are ordered.
In the images shown, the pins in the connector have floated down. This happens easily during soldering or rework. In an automated process, if the pins drop down 1 to 2mm below the board in selective or wave soldering, they can cause damage. Pins can contact the solder nozzle or wave former, which will jam the machine. Using low-temperature solder with a lower specification connector will work fine, but consider the rework temperatures if parts must be removed.
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Questions to ask before action is taken.
Most who perform statistical analyses that guide organizations to solve problems do not have advanced degrees in statistics. We’ve attended classes at university, engaged in varying levels of Six Sigma training, or conducted self-study.
But I think it is safe to say we all have learned that statistically evaluating a set of data is complicated and rife with uncertainty. We choose among many possible statistical tools, and numbers “pop” out telling us if our hypothesis is correct. From those data, we proceed to either take an action or not take an action, depending on the statistical results.
Yet how many finish an analysis and wonder what if it is wrong? Did I have enough data? Did I choose the proper statistical tool? Do I even know the proper statistical tool? Arghh! (I suspect doctors of statistical science also have “arghh” moments.)
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Why you should consider a certification program.
When I look back on my career and consider the key ingredient to my success, I’d say whenever opportunity knocked, I had the right skill set to walk through the door. I was fortunate that my first electronics manufacturing services (EMS) employer had both a tuition refund program that paid for my master’s degree in management and an internal management training program. That started me on a path of continuous learning that included multiple certification programs and other training programs. And, as advancement opportunities came up, I had the right qualifications and a results-focused track record.
Company-sponsored educational resources are more limited today. That said, technology has made it possible and convenient to engage in focused continuous learning opportunities. IPC’s Certified Electronics Program Manager (CEPM) training and certification program is a good example. What once required multiple trips to training locations and a solid week of classroom time can now be done via computer either in live sessions or through reviews of class recordings. The program was redesigned to an online format in 2017 and now is a six-week program with two two-hour classes per week, providing overviews of program management, sales, cost accounting, materials management, contracts, production planning, quality and leadership. Students are assigned to teams that complete a case study each week related to the concepts presented. A variety of online exercises reinforce key concepts. The goal is to ensure participants are provided a common framework of knowledge and the opportunity to interact with peers to discuss best practices. Information on the program and upcoming dates is available here: https://training.ipc.org/product/certified-electronics-program-manager-cepm-program.
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Businesses can’t plan for everything, but with the right prep they can adapt.
December is finally here. Mercy knows it seems to have taken forever to bring this most unusual year to a close. I keep pondering the question customers inevitably ask during a supplier audit: What contingencies are in place for “unforeseen and unthinkable” disasters and events? If anyone had asked me a couple years ago to come up with a plan to deal with a global pandemic I would have thought them to be crazy for asking. And yet, that was 2020!
The one takeaway from this crazy year is you can never plan for everything. Paradoxically, good planning makes it easier to deal with the unimaginable.
Business planning takes numerous forms. Most people think first of the financial budget planning, usually led by finance and account staffs. Visions of building a budget, whether bottom-up or top-down, as a tool to measure specific activities against comes to mind. This type of planning revolves around predicting core operating activities that are repeatable, predictable and highly measureable. While important, if not essential, for the operations folk to run the “business as usual,” that budget is only one aspect of planning.
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Hon Hai, better known as Foxconn, has been the largest EMS/ODM company in the world since 2005, when it catapulted Flextronics to gain the top spot. To be sure, Foxconn’s revenues then and now are enhanced by ample non-electronics manufacturing segments, but the depth and breadth of the company is by any measure staggering. In calendar 2019, it reached roughly $150 billion, a mark that is all the more impressive when you consider it doesn’t include sales from some of its largest subsidiaries, such as Innolux, Sharp, and its connector and cable units. Its quarterly revenue alone would make it the largest EMS/ODM in the world. And its annual output not only eclipses all its customers’ electronics sales, sans Apple, but also the next four largest competitors combined.
In pursuit of the almighty dollar, Foxconn is the almightiest. Nothing seems out of its reach. Its founder and erstwhile chairman ran for president of Taiwan. It also dabbled in American politics, putting a massive (if mostly empty) facility smack dab in the soy and corn fields of the district of the then-US House Speaker.
Never one to rest on its success, Foxconn is pushing further upstream into the semiconductor market. Having already snared Albit, three years ago it took a shot at the Toshiba memory business. And as we go to press, Foxconn is making a play for Silterra, the Malaysian maker of ICs, MEMs and sensors.
Hon Hai is on high. In mythical terms, toppling Foxconn would be like defeating Voldemort and Sauron. And then for good measure, maybe kicking the butt of that creepy emperor from Star Wars. Any company would be foolish to take that on, right?
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For 01005 parts, some apertures are better than others.
Continuous reduction in component size has been at the forefront of electronics product innovation, assembly process development and the industry conversation for years. Readers will no doubt recall the papers presented, tools developed, and processes modified to accommodate the “coming soon” metric 03015 and 0201 components. That preparation is essential. In my opinion, however, it is more likely than not that widespread use of these ultra-small chips is far in the future; it will come, but probably not in the next generation.
Another reality presents, perhaps, a more immediate challenge: increasing component density beyond current norms. Realistically, for next-generation mobile phones and wearables, the primary consumers of the most miniaturized components, board designs will continue to incorporate the 01005 chip (metric 0402). There are a gracious plenty of reasons for this, not the least of which are cost and component availability. The challenge for product designers is how to get the most function from chips that may be larger than they would prefer. What’s the solution? Squeeze the 01005s closer together, of course!
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