Digital torque wrench for assembly applications with torque ranges from 10Nm to 650Nm. Features IP54 protection, 2.3m drop resistance, point-of-load insensitive torque measurement, OLED display, 360° status light ring, vibration and audible feedback, interchangeable Auto-ID wrench heads with automatic length compensation, and storage for up to 200 readings. Supports RF, Bluetooth or Wi-Fi connectivity for integration with TorqueStar Pro, IQVu, TCI-2, MES platforms and third-party software. Includes rechargeable quick-change battery system with charging cradle or optional USB-C charging and is available in FOD-compliant versions.

Candeo is a post-CMP cleaning chemistry designed to remove residual particles and ionic contamination, reducing defectivity and increasing usable wafer area for silicon, silicon carbide and advanced packaging applications. Compatible with Entrepix DSS-200 cleaning platforms without hardware modifications, the formulation provides a wider process window, supports stable, repeatable cleaning performance, and is free of the strong odors associated with conventional ammonium hydroxide-based chemistries. The chemistry is available for process evaluation through Intersurface Dynamics and Entrepix.

The EPC91132 is a compact three-phase brushless DC motor drive reference design built around the EPC33110 monolithic GaN power module for humanoid robotics and drone applications. Supports 10 to 60 V input, delivers up to 11 Arms continuous output current (15 Arms pulsed), and operates at switching frequencies above 100 kHz. Integrates a microcontroller, voltage and current sensing, overcurrent protection, magnetic encoder and RS-485 interface. Complete design resources, including schematics, BOM and Gerber files, are available to accelerate motor drive development.

The AG16xFNxx Series power MOSFETs are designed for automotive 48V power supply systems, offering an 80V rating for applications including inverter control circuits, electric motors and electric water pumps. Available in compact HPLF5060 and DFN3333 packages, the devices are engineered to reduce board space requirements compared with conventional automotive MOSFET packages. The MOSFETs incorporate Copper Clip Junction Technology to improve heat dissipation and support high-current operation. The HPLF5060 package features Gull-Wing leads, while the DFN3333 package incorporates Wettable Flank Technology to enhance PCB solder joint inspection and reliability. All devices are AEC-Q101 qualified for automotive applications.