SECS/GEM communication package for MPM Edison printer is a semiconductor market communication standard that provides a common interface between manufacturing equipment.

10 650V silicon carbide (SiC) Schottky diodes feature merged PIN Schottky (MPS) design.

SMT 158D8 high thermal conductive underfill is a diamond-filled, reworkable liquid epoxy. Has thermal conductivity of >6W/mK, high salt-moisture resistance, and excellent adhesion.

W series embedded Wi-Fi antennas offer range of standard solutions with ultraminiature form factors, PCB or FPC antenna technologies capable of supporting single- and dual-band operating frequencies up to 6GHz, performance-enhancing foam coatings, and various mounting options.