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Products
HiTech CU21-3240 and CU31-2030 are one-component capillary underfills designed to protect assembled chip packages on printed circuit boards.
High-precision TR77000QM SII 3-D AOI has 5.5µm high-res 12mp imaging technology for semiconductor and packaging industry and other industries.
RMCP thick-film chip resistor with high power capability now comes in resistance values up to 10mΩ.
Press Releases
- Mycronic High Flex changes division name to PCB Assembly Solutions; Clemens Jargon Comments
- PRIDE Industries Invests in Kurtz Ersa POWERFLOW Wave Soldering System to Expand High-Reliability Electronics Manufacturing Capabilities
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
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- Editorial Contributions
- How Squeegee Blade Profile Helps Improve the Screen-Printing Process
- Verifying PCBA Cleanliness with Ion Chromatography
- Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization