MKP1848H series of automotive-grade DC-Link metallized polypropylene film capacitors are optimized for high humidity environments.
WS-829 for printing and pin transfer applications, including LED die-attach, can be used for ball-attach on substrate in a standard BGA process, especially for sphere applications <0.25mm, as well as wafer-/panel-level packaging.
PCB antennas are for Wi-Fi, GSM, CDMA, 3G, 4G, LTE, GPS, Bluetooth, ZigBee, ISM and NB-IoT applications.
SR100E replenishment rack is designed for operation on the production line next to pick-and-place machines to facilitate efficient feeder replenishment.