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KREUZWERTHEIM, GERMANY -- A German regional court has found for Seho Systems in its patent dispute against Ersa. Ersa is appealing the judgment.
LAS VEGAS – CIRCUITS ASSEMBLY today announced winners of its 2011 Service Excellence Awards (SEAs) for electronics manufacturing services providers and electronics assembly equipment, materials and software suppliers.
STRATHAM, NH -- Vitronics Soltec USA will close its facility here and move production of its reflow and selective soldering lines to other Vitronics and Speedline sites.
LAS VEGAS – CIRCUITS ASSEMBLY today announced winners of the 2011 New Product Introduction Award for electronics assembly equipment, materials and software.
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TAIPEI -- Foxconn Technology Group announced plans to invest up to $12 billion in new manufacturing capacity and related services in Brazil.
LYON, FRANCE -- Flip chips made up 13% of all IC packages sold in 2010, and some 29% of the global IC assembly, packaging and test market, a new research report says.
Press Releases
- INSPECTIS AB ‘Makes it a Meal’ with Series U50s Advanced Kit
- Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
- Libra Industries Launches In-House High-Precision Underfill Capabilities
- HyRel Technologies and NJ MET Announce Strategic Collaboration for Integrated Component Services